MIG thanks those who help with MEMS Executive Congress Europe 2013.

Frazer Anderson, Oxford Instruments
Julien Arcamone, CEA-LETI
Angelo Assimakopoulos, Knowles Electronics
Frank Bartels, Bartels Mikrotechnik
Harrison Beasley, Global Semiconductor Alliance
Michelle Bourke, Kilbrydon Consulting
Siebe Bouwstra, MEMS Technical Consultancy
Lisa Bradley, Freescale Semiconductor
David Butler, SPTS
Wayne Chavez, Freescale Semiconductor
Janet Danisman, Bavarian US Offices for Economic Development
Jo De Boeck, imec
Cornelia Duris, Freescale Semiconductor
Thorbjörn Ebefors, Silex Microsystems
Alissa Fitzgerald, AM Fitzgerald
Thomas Fries, Fries Research and Technology
Vincent Gaff, Tronics
Stephane Gervais-Ducouret, Freescale Semiconductor
Thomas Gessner, Fraunhofer ENAS
Joanne Halpern, German Center for Research & Innovation
Peter Himes, Silex Microsystems
Wolfgang Huebschle, Bavarian US Offices for Economic Development
Christine Kaindlsdorfer, EVGroup
Jim Knutti, Acuity
Hannu Laatikainen, Murtata Electronics Oy
Mary Ann Maher, SoftMEMS
Iris Lehman, IVAM
Jiri Marek, BOSCH
Laurent Massicot, Freescale Semiconductor
Mike Mignardi, Texas Instruments
Dave Monk, Freescale Semiconductor
Christine Neuy, MSTBW
Andrew North, Freescale Semiconductor
Ronny van ‘t Oever, Micronit Microfluidics
Marc Osajda, Freescale Semiconductor
Martijn Reinheld, FHI
Vullers Ruud, imec
Nicole Salas, ABB
Frank Schaefer, BOSCH
Clemens Schütte, EVGroup
Len Sheynblat, Qualcomm
Per Slycke, Xsens
Jack Taylor, Freescale Semiconductor
Dave Thomas, SPTS
Jacques Trichet, Freescale Semiconductor
Maurus Tschirky, CSEM
Greg Turetzky, CSR
Andre van Geelen, EPCOS
Chris van Hoof, imec
Davina Verges, Freescale Semiconductor
Francois Villeneuve, Freescale Semiconductor
Martina Vogel, Fraunhofer ENAS
Samantha Ward, Qualcomm
Bin Wu, Freescale