Frazer Anderson, Oxford Instruments

Wilfried Bair, Suss Microtec

Harrison Beasley, Global Semiconductor Alliance

Michelle Bourke, Oxford Instruments

Lisa Bradley, Freescale Semiconductor

David Butler, SPTS Technologies

David DiPaola, DiPaola Consulting, LLC

Steven Dwyer, EV Group

Joseph Ellul, Maxim Integrated Products, Inc.

Pietro Erratico, STMicroelectronics

Michael Gaitan, NIST

Evgeni Gousev, Qualcomm MEMS Technologies

Jeff Hilbert, Wispry

Peter Himes, Silex Microsystems

Claire Jackoski, Intel

Mike Jamiolkowski, Coventor

Thierry Lazerand, Plasma-Therm

Lisa Mansfield, SPTS Technologies

Robert Mao, Honeywell

Tamara McKinney Berry, OEM Group

Ian McNaught, Semefab

Heike Mueller, Suss Microtec

Matan Naftali, Maradin Technologies Ltd.

Yaw Obeng, NIST

Bryce Osoinach, Freescale Semiconductor

Eric Pabo, EV Group

Sarosh Patel, Johnstech International

Jim Reed, Okmetic

Sharon Rehbinder, AEPI Grenoble-Isere France Economic Development Agency

Sascha Revel, Acutronic USA

Ray Roop, Freescale Semiconductor

Mike Rosa, Applied Materials, Inc.

Dave Rothenburg, Movea

Clemens Schutte, EV Group

Michael Schilling, Plan Optik AG

Carolyn Short, SPTS Technologies

Brian Stephenson, Tronics Microsystems

Evelyn Tay, SPTS Technologies

Charlie Turk, OAI

Martina Vogel, Fraunhofer ENAS

Marcie Weinstein, Akustica

Carsten Wesselkamp, Plan Optik AG

Stephen Whalley, Intel

Steve Wilcenski, MEMSCAP