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Symposium 6.11

Modeling the Interaction of Anelasticity, Damage and Environmental Effects in Polymer Composites


Fodil Meraghni, Arts et Métiers (ENSAM) Institute of Technology
George Chatzigeorgiou, Chargé de Recherche CNRS
Gary Seidel, Virginia Tech University
Kiefer Björn, TU Bergakademie Freiberg


The scope of this symposium is to gather scientists with expertise in the study of polymer composites and their structures in engineering applications. Polymer composites are often sensitive to temperature variations, and upon loading, they experience strong anelastic regimes (viscoelasticity, plasticity and/or viscoplasticity) coupled with damage. Various multiscale approaches, both mean-field and full-field, will be investigated, aiming at addressing the response of these materials under thermo-hygro-mechanical conditions and how their behavior affects the structural components. The damage accumulation and the related fracture will be described with local or nonlocal approaches. To address the computational cost of the scale transition techniques, reduced order model strategies will be also discussed, towards the development of data-driven models. Furthermore, the fatigue life of polymer composite structures is of great importance for the applications, thus computational techniques for the analysis of high cyclic loading using temporal reduction approaches such as cycle jumps or 4D homogenization technique will be also a topic of discussion on this symposium.  Special interest is on the application of computational tools to model damage initiation and propagation in composite materials in regards to matrix cracking and matrix-filler interface decohesion along with filler fracture using a broad range of computational tools such as continuum damage modeling and cohesive zone modeling, among others, and across computational platforms from finite element and xFEM to meshless and particle based methods including peridynamics.  Applications in polymer, ceramic, and metal matrix composites are relevant, with interest in both microscale and nanoscale filler materials.