| Booth number/ref |
Company |
Company Description |
| 3 [ Back to top ] | | 115 | 3D Glass Solutions, Inc. | 3D Glass Solutions (3DGS) is an innovative advanced packaging substrate solution provider based on glass. | | A [ Back to top ] | | 322 | AAA Test Lab | We are the premier electronics testing lab and C-MRO™️facility in Florida. With incredible accuracy and rapid turnaround, we serve aerospace and defense contractors, primes, OEMs, LEMs, and CMs, as well as manufacturing and medical providers. Our main focus areas are failure analysis, upscreening, component verification, and engineering services. We also provide extensive MIL-STD, MIL-PRF, & NASA Spec testing to numerous test methods. ISO/IEC17025, ISO9001/AS9100, ASA-100, ESD S20.20 Certified Test Lab. | | 112 | Accurate Circuit Engineering | Accurate Circuit Engineering (ACE) is AS9100, ITAR, DoD 2345, CMMC compliant and Mil-Spec Certified manufacturer of high-technology quick turn PCBs, with deliveries in as little as 24 hrs. ACE has continued to stay on the leading edge of technology offering only the best quality PCBs in the shortest amount of time. ACE also offers Design and Assembly making ACE a full turnkey solution. From Hybrid PTFE to standard blind and buried via constructions, ACE does it all with an emphasis in RF, Microwave and Antennas. | | 311 | Altera | Altera provides leadership programmable solutions that are easy-to-use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end-to-end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet. | | 517 | Analog Devices, Inc. | Analog Devices, Inc. (ADI) is a trusted technology partner providing comprehensive full RF to Bits solutions and capabilities to support defense innovation. From advanced sensing to intelligent edge processing, from advanced components to specially packaged SiPs and system modules, ADI’s transformative signal chain solutions accelerate modernization and warfighter readiness. ADI provides semiconductor and RF subsystem solutions that are trusted, secure, and resilient, enabling our customers and government research and engineering centers to meet the stringent quality metrics for the aerospace and defense industry. | | 321 | Astronics Test Systems | Astronics Test Systems ensures optimal performance of mission critical systems with innovative test solutions. With over 60 years of expertise, our solutions help mitigate obsolescence, embrace modern technology, and ensure operational readiness. | | B [ Back to top ] | | 213 | BAE Systems | | | 400 | Battelle | | | C [ Back to top ] | | 212 | C&D Semiconductor | C&D Semiconductor, Inc. is an innovative, fast-growing semiconductor equipment manufacturer based in San Jose, California. Founded in 1989, we have been serving the global semiconductor and related industries for over two decades, with customers from around the world. | | 233 | Cadence | | | 414 | CAST | | | 201 | Checkpoint Technologies | | | 209 | Chip Scan | Chip Scan, based in New York City, is a provider of microelectronics assurance. Its specialty areas include cyber threat defense, microelectronics reverse engineering, space systems, and defending operational technologies. Chip Scan is accredited by the DMEA as a Category 1A Microelectronics Trusted Source. Chip Scan is also an awardee in the Anti-Tamper Executive Agent program for protection of critical program information. Its capabilities have been used to assure commercial and government systems, and its products are implemented and/or operational in commercial and military systems. Chip Scan also has strong core competencies in machine learning/AI driven reverse engineering, the recovery of critical design information for DMSMS, and the hardening of systems for anti-tamper. Our goal is to provide innovative solutions that protect our countries critical assets and protect the war fighter. | | 420 | CoolCAD Electronics | CoolCAD Electronics designs and fabricates wide bandgap silicon carbide (SiC) semiconductor transistors and integrated circuits (ICs) for applications in Power Electronics, Green Energy, High-Temperature Electronics and Deep Ultraviolet (UV) Optical Electronics.
SiC-based semiconductor devices significantly outperform traditional Si (silicon) devices and are a major driver in the transition from an outdated fossil fuel energy infrastructure to a more sustainable infrastructure based on renewable energy technologies. | | 203 | Cycuity | Cycuity provides software products and services to specify and verify semiconductor device security. We help customers ensure that security weaknesses are identified and mitigated during the design phase prior to manufacturing. Our security solutions are a critical element in the semiconductor product ecosystem for commercial and defense industries. They provide the broadest, metric-driven security assurance for semiconductor development across the design supply chain - from secure usage of third-party IPs (3PIP) to full chips, including firmware and software. | | D [ Back to top ] | | 327 | DMEA TAPO | | | 329 | DMEA TAPO | Honeywell FM&T
Kansas City National Security Campus (KCNSC)
Contractor National Nuclear Security Administration (NNSA). | | 501 | DoD Anti-Tamper Executive Agent | The DoD Anti-Tamper Executive Agent mission is to Deter, Impede, Detect and Respond to the reverse engineering and exploitation of our military's CPI to impede technology transfer, stop the alteration of system capabilities and prevent the development of countermeasures to U.S. systems. | | E [ Back to top ] | | 102 | Edaptive Computing, Inc. (ECI) | Edaptive Computing, Inc. pioneers innovative solutions for digital transformation. | | 303 | EngeniusMicro | EngeniusMicro is a trusted provider of high-performance microelectronic die-level packaging solutions engineered for harsh environments. Our cutting-edge hybrid & multi-material additive manufacturing technologies enable the creation of custom ceramic packages and multi-layer printed circuit boards, offering exceptional thermal, electrical, and mechanical performance at lower cost than conventional packaging options at R&D scale and small production quantities. These tailored packages can be printed on demand to enable rapid design iteration, flight qualification, and device performance maximization for the most demanding applications, such as hypersonics, aerospace, space, maritime, and UAS. As a proud exhibitor at GOMACTech—an essential forum for reviewing advancements in microcircuit technology for government systems—EngeniusMicro is committed to advancing the next generation of defense and dual-use electronics in alignment with national security priorities and DoD innovation initiatives. | | 521 | EPC Space | EPC Space provides revolutionary high-reliability radiation hardened enhancement-mode gallium nitride power management solutions for space and other harsh environments.
Radiation hardened GaN-based power devices address critical space-borne environments for applications including power supplies, light detection and ranging (lidar), motor drive, and ion thrusters. | | 310 | Eurofins EAG Laboratories | Eurofins EAG Laboratories has over 40 years’ experience in materials testing services. Our parent company, Eurofins Scientific, is a multi-billion-dollar global leader in scientific services with a portfolio of over 200,000 validated analytical methods. We offer a consultative, multi-disciplinary approach to solving your materials- and engineering-related product problems. As thought leaders in investigative science, we set the global standard for materials testing services. | | F [ Back to top ] | | 514 | Finetech | Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework.
We provide solutions for each stage of your journey – from R&D to industrial automated production. | | G [ Back to top ] | | 433 | Graf Research | Graf Research unleashes innovation by developing ideas into disruptive technologies. Our mission is to perform research, provide services, apply analytics, and create products that enable secure and high-performance embedded and adaptive computing solutions. | | H [ Back to top ] | | 315 | HRL Laboratories, LLC | | | I [ Back to top ] | | 121 | Instec, Inc. | Instec is a scientific instrument manufacturer focused on precision thermal and environmental control. Our products are compatible with any optical measurement system and can be equipped with electrical testing setups including electrical probers, all inside a controlled sample environment. Necessary for many applications including spectroscopy, electrochemical analysis, nanotechnology research, and more. | | 206 | Intel Corp. | Intel, the world leader in silicon innovation, develops technologies, products, and initiatives to continually advance customer missions. Providing advanced manageability, security, and sustainable performance, Intel business-optimized technologies address the challenges and opportunities within the public sector today and tomorrow. | | 208 | Intel Foundry | | | 413 | ISI | ISI, a Molex company, specializes in manufacturing multi-component electronic modules designed for highly reliable and ruggedized applications. Their solutions excel in demanding environments across industries such as military, aerospace, heavy industry, and advanced packaging. ISI leverages deep expertise in advanced electronic packaging to deliver durable, high-performance modules that support next-generation technology needs and stringent operational requirements.
By combining proven reliability with innovative design, ISI empowers customers to develop competitive, robust products tailored for harsh and mission-critical conditions. | | J [ Back to top ] | | 200 | JEOL | | | L [ Back to top ] | | 221 | Laser Thermal Analysis | Laser Thermal is a precision instrumentation company. Our thermal analysis tools (TOPS and FASTR) address longstanding gaps in the market: accurate, high-throughput, and user-friendly measurements of thermal conductivity, thermal resistance, and volumetric heat capacity. We’ve eliminated the technical and operational barriers of legacy techniques, providing precise measurements over a wide range of length scales. We also offer contract testing laboratory services. | | 323 | LeWiz Communications, Inc. | LeWiz develops solutions and rad-hard chips for end-to-end time critical networks (time-triggered Ethernet, time sensitive network) for aerospace applications. Solutions include smart endpoint, switch, gateways interconnecting networks of different protocols. Chips include complex RISC-V based system-on-chip and FPGA devices. US design and fab. See demos at exhibit. | | M [ Back to top ] | | 519 | MACOM | MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. | | 211 | Mercury Systems | Mercury Systems is a technology company that delivers mission-critical processing power to the edge to solve the most pressing A&D challenges. Combining technologies and expertise developed for more than 40 years, the Mercury Processing Platform offers customers a unique advantage to unleash breakthrough capabilities. It spans the full breadth of signal processing—from RF front end to the human-machine interface— enabling customers to turn data into decisions with standard products and custom integrated solutions from silicon to system scale | | 500 | Microsanj, LLC | Microsanj delivers high-resolution thermal imaging for semiconductors, RF devices, and photonics. Our thermoreflectance and hybrid infrared (IR+TR) solutions provide nanosecond transient analysis and sub-micron resolution for precise failure detection and optimization. | | 534 | Micross | One Source. One Solution. Micross is the most complete end-to-end provider of advanced microelectronic services and component, die & wafer solutions.
Serving the Aerospace, Defense & Space communities for more than 45 years, Micross is the largest and most experienced DMEA DoD Trusted Source OSAT (Outsourced Semiconductor Assembly and Test) manufacturer in the United States. With a core strength in maintaining end-of-life (EOL) technologies, Micross provides an extensive understanding and expertise in semiconductor obsolescence management, mitigating supply chain risks and enabling the extension of the product life cycle for a program’s microelectronics requirements.
With the broadest franchised access in sourcing semiconductor die & wafer; an extensive portfolio of military and space grade high-reliability power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products; and the most comprehensive advanced packaging, assembly, modification, upscreening and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete product lifecycle sustainment.
For more information about Micross, please visit www.micross.com and follow us on LinkedIn. | | 334 | MIT Lincoln Laboratory | The Lincoln Laboratory Microsystems Prototyping Foundry is a semiconductor research and fabrication facility for design, fabrication, packaging, and test with extensive staff, process, and technology capabilities. | | 301 | MMEC | MMEC leads the acceleration of microelectronic technologies and delivers solutions to establish a trusted and resilient domestic supply chain. The MMEC is the premier collaborative, public-private ecosystem, that engages broadly across innovative partners in industry, academia and government to rapidly advance defense and commercial applications. This unique environment empowers members to discover new technologies, share capabilities, develop a skilled workforce and launch groundbreaking innovation into scalable commercial production for the benefit of National Security and economic dominance. | | 312 | Mosaic Microsystems | Mosaic is at the forefront of advanced glass packaging for microelectronics, strategically addressing the growing need for high-performance computing and communication bandwidth. Our innovative thin glass substrates and interposers offer increased interconnect density and lower loss, enabling advancements in AI, 5G/6G, and heterogeneous integration. | | 412 | MOSIS 2.0: Accelerated Prototyping | MOSIS 2.0 is your gateway for semiconductor prototyping, enabling access to silicon and compound semiconductor MPWs, a network of research fabs, and a deep bench of process, device, and circuit experts. From quick-turn R&D to low- or high-volume tapeouts, our engineering service helps you rapidly design, fabricate, and test. | | 101 | MRSI Mycronic | MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled precision and reliability for R&D, NPI, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, and optical imaging products. We provide the most flexible assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. Our commitment to excellence ensures we meet our customers' needs with meticulous attention to detail and 24/7 field support. For more information visit www.mycronic.com/product-areas/die-bonding/. | | N [ Back to top ] | | 434 | Nano OPS, Inc. | | | 314 | NHanced Semiconductors Inc | NHanced Semiconductors, Inc. is the world leader in advanced 2.5D and 3D integrated circuits. The company has brought advanced packaging (AP) technology into low volume manufacturing. NHanced works with dozens of companies developing next generation sensors and processors and also exploits the new Moore’s Law concept of semiconductors – chiplets | | 325 | Noble Metal Services | Our Commitment to Sustainability is threaded throughout our organization. We have implemented a pro-active joint effort of our management team and labor force to continually monitor and refine our processes to further support our goal to reduce environmental impact.
Noble’s state-of-the-art equipment and modernized technologies help to ensure that the handling and treatment of material in our plant is fully compliant with the Environmental Protection Agency (EPA) regulations and the State of Rhode Island’s Environmental Management Group (RIDEM). | | 324 | Northrop Grumman | | | P [ Back to top ] | | 320 | PacTech USA, Inc. | PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region. | | 234 | Polar Semiconductor | Located in Minnesota, Polar Semiconductor is a U.S.-owned 200mm Merchant Foundry, with an established track record in high-volume manufacturing of Silicon Integrated Circuit and Discrete devices. Polar specializes in Sensor and Power Semiconductors tailored for Automotive, Industrial, and Aerospace & Defense applications. With a recent investment of $525 million, Polar is expanding its manufacturing footprint, doubling its capacity to competitive scale (40,000 wafers per month), and investing in Automation (Autonomous Robots and Automated Material Transport Systems) and Intelligent Manufacturing (AI/ML). The 150,000 sq. ft. Class 1 cleanroom facility is home to state-of-the-art manufacturing and measurement Equipment, and produces advanced BCD, BiCMOS, MOSFET, IGBT, Optical MEMS, Wide-Bandgap (GaN), and Magnetoresistance sensor technologies. Polar provides a suite of foundry Design Enablement, Transfer, and Characterization services. Fully certified to run Automotive products, Polar meets stringent Quality and Environment Certification requirements, and is now working towards obtaining ITAR and Trusted (Defense) Certifications. Polar supports the National Security infrastructure through RD&E collaboration with DoD Microelectronics Commons and the National Semiconductor Technology Center, supports Economic Security through serving various Industries with critical advanced technologies, ensuring IP Protection and Secure Data, providing Pilot to High Volume Cost-Competitive manufacturing, and ensures Supply Chain Resilience as a foundry located in the U.S. Upper Midwest with Stable and Secure Water and Electricity and a low risk for catastrophic natural events. Polar serves customer needs through tailored Partnership Models, from traditional Pure Play to “Captive Capacity,” and seeks to create a technology advantage through joint RD&E or licensing. Polar’s backbone is its stable, long-tenured workforce, comprising of highly skilled and experienced customer enablement, technology, and operations teams. More information at: polarsemi.com | | 207 | Presidio Components | Family owned and operated since 1980, located in San Diego, and Sioux Falls, SD. US manufacturer of ceramic capacitors for Defense, Aerospace, Space and Telecommunication for RF/Microwave, chip and power applications. | | Q [ Back to top ] | | 214 | QP Technologies | QP Technologies is a leading provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services and our service offerings enable our customers to target a range of end markets, including commercial, RF, power, industrial, automotive, medical and mil-aero. We leverage proven technologies developed by our skilled experts, and we work closely with you to get your products to market quickly and in high volume. Our in-depth and unique industry knowledge, combined with the personal relationship we create with you, means you can count on us to be your trusted adviser and partner. | | 421 | QuickLogic Corp. | QuickLogic, a trusted supplier in the Aerospace and Defense markets for nearly three decades, specializes in design of programmable logic devices, embedded FPGA (eFPGA) and FPGA-based products, including Strategic Radiation Hardened (SRH) FPGAs. Our low-power, production-proven eFPGA enables in-field fast reconfiguration of ASICs and SoCs, facilitating over-the-air updates for evolving needs. Our 100% open-source tools offer Mil/Aero/Defense contractors complete toolchain visibility and long-term control, which secures critical intellectual property and ensures future support. QuickLogic's dedication to innovation within the defense and aerospace community reinforces its role as a leader in trusted, secure, SRH, and fast reconfigurable computing technology for defense applications. | | R [ Back to top ] | | 415 | Raith America, Inc. | RAITH is a global market and technology leader in maskless nanofabrication and characterization systems. Its comprehensive portfolio includes electron beam lithography, FIB-SEM systems, laser lithography, and advanced imaging solutions. With over 1,200 systems installed worldwide and serving 10,000+ users, the company enables breakthrough innovations in quantum technologies, photonics, semiconductors, and life sciences. Its solutions bridge the gap between R&D and production, supporting applications in connectivity, mobility, green energy, and healthcare. Headquartered in Germany with global operations including a US-based applications center, RAITH combines cutting-edge technology with four decades of expertise to deliver precision nanofabrication tools for both research institutions and industry. | | 202 | Rambus | Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With 35 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs. For more information, visit rambus.com. | | 229 | Real Intent | Real Intent is a leading provider of EDA software to accelerate early functional verification and advanced sign-off of digital designs.
Our static sign-off product capabilities include multi-mode clock domain crossing; multi-scenario reset domain crossing; multi-test mode DFT; multi-policy RTL linting, connectivity & glitch, hardware security, and formal linting. Real Intent products lead the market in performance, capacity, accuracy, and completeness. | | S [ Back to top ] | | 135 | Secure Micro Technologies, LLC | Secure Micro Technologies specializes in delivering cutting-edge embedded cybersecurity solutions for critical infrastructure sectors such as satellite systems, command and control platforms, nuclear facilities, industrial control environments, and secure communications networks. Leveraging extensive experience supporting the Department of Defense and its industrial base, the company excels in architecting secure hardware, firmware, and software systems tailored for high-assurance applications. | | 205 | Silitronics | Silitronics is ITAR Corporation and acquired GDSI (Grinding and Dicing Services Inc), marking a significant milestone in our journey to redefine Advanced EIC and Photonics PIC assembly. This union, powered by the creative force of “Power of 2” brings together Silitronics’ integrated packaging leadership with GDSI’s proven expertise in precision wafer thinning, polishing and Stealth Laser dicing. Silitronics and GDSI offering have
accelerated time to market with “Start-Up” speed and “First Time Right” solutions. | | 116 | SkyWater Technology | SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, high-volume production and heterogeneous integration solutions in its U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology within diverse categories including mixed-signal CMOS, read-out ICs, embedded computing, rad-hard ICs, memory and logic devices, power management ICs, MEMS, superconducting ICs, photonics and advanced packaging. SkyWater serves the growing markets of aerospace & defense, automotive, biomedical, industrial and quantum computing. For more information, visit: www.skywatertechnology.com. | | 300 | Spectral Design and Test, Inc. | | | 313 | SRI International | SRI International designs and manufactures form, fit, function replacements for obsolete microcircuits. Utilizing a Trusted Wafer Foundry, specialized design and test approaches, we provide QML certified (MIL-PRF-38535) units. Through the Generalized Emulation of Microcircuits (GEM) and the Advanced Microcircuit Emulation (AME) programs, sponsored by DLA, a permanent solution is provided. | | 520 | StratEdge Corporation | StratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic and lower-cost molded ceramic packages, specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom for 5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards.
StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services.
Our facility in Santee, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified. | | 220 | Synopsys | | | T [ Back to top ] | | 513 | Tektronix Component Solutions | With more than 75 years of Test & Measurement expertise, Tektronix Component Solutions provides reliable semiconductor assembly and test services that help customers bring products to market with confidence. | | 223 | Tenet3 | Founded in 2013, Tenet3® set out to better secure cyber-physical systems by putting anti-tamper research into practice. To achieve this, we built
MeTRA®, a knowledge management platform for teams to digitally capture, exchange and analyze system data. During the last thirteen years we have
come to realize that the first principle for securing cyber-physical systems, “knowing what you have,” applied to many challenges in a wide range of use cases. Whether it is processes or personnel, critical infrastructure or structural tests, change management
or cybersecurity, we can help you make sense of complexity. | | 103 | The Northeast Regional Defense Technology Hub (NORDTECH) | | | 335 | Trusted Semiconductor Solutions | Trusted Semiconductor Solutions Inc. was founded in 2006 to design and deliver integrated circuits, radiation hardened products, and electronic systems solutions for military & defense, space, and industrial markets. Our flexibility and creativity allow us to uniquely partner with our customers to develop high-quality products. We provide a single point of contact for your product development needs, offering services from design through production with unparalleled program management, consultation, and customer service. | | 100 | Trusted Strategic Solutions, Inc. | Trusted Strategic Solutions provides strategic consulting services for organizations in the public and private sectors. We help clients navigate challenges related to rare earth elements, microelectronics, and semiconductors by offering informed analysis and forward-looking strategies. |
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