| Booth number/ref |
Company |
Company Description |
| 3 [ Back to top ] | | 115 | 3D Glass Solutions, Inc. | 3D Glass Solutions (3DGS) is an innovative advanced packaging substrate solution provider based on glass. | | A [ Back to top ] | | 511 | AARD Technology LLC | AARD Technology is the North American representative for scia Systems GmbH, a German supplier specialized in plasma and ion beam process equipment. We offer systems for coating, etching, and trimming for the MEMS, microelectronics, and optics industries for high volume manufacturers and R&D. | | 112 | Accurate Circuit Engineering | Accurate Circuit Engineering (ACE) is AS9100, ITAR, DoD 2345, CMMC compliant and Mil-Spec Certified manufacturer of high-technology quick turn PCBs, with deliveries in as little as 24 hrs. ACE has continued to stay on the leading edge of technology offering only the best quality PCBs in the shortest amount of time. ACE also offers Design and Assembly making ACE a full turnkey solution. From Hybrid PTFE to standard blind and buried via constructions, ACE does it all with an emphasis in RF, Microwave and Antennas. | | 328 | AdTech Ceramics | A fully integrated US manufacturer of alumina and aluminum nitride multilayer co-fired packages, specializing in mission-critical ceramics for challenging environments. Offering prototypes to high volume capabilities. We engineer the finest quality ceramics, making them #STRONGDURABLEPRECISE. ITAR registered * CUI trained * AS9100D * NADCAP Certified | | 230 | Advance Reproductions Corporation | Advance Reproductions is a world-class provider of photomasking and photoplotting services, and unique photolithography solutions. Backed by a smart and creative technical team and driven by a commitment from the very first call to solving customers’ problems, we’ve built a reputation for delivering the most innovative photomasking solutions with high precision and speed. | | 128 | Advent Diamond, Inc. | Advent Diamond is developing semiconductor technology beyond today’s limits. We are commercializing diamond semiconductor materials and components to support innovation in telecommunication, electrification and advanced sensing. | | 130 | Allied High Tech Products Inc | For over 43 years, Allied High Tech Products has provided quality products for metallographic sample preparation & analysis. Allied designs and manufactures sectioning, mounting, grinding/polishing and milling equipment at their US facilities, and distributes a full range of consumable products. Allied’s equipment is built in-house to specifications that deliver maximum performance and dependability. All equipment carries a 2-year warranty & prompt service or technical help is always available. | | 204 | Alphacore Inc. | Alphacore Inc. is headquartered in the heart of the Arizona's innovative Silicon Desert. Our team combines long histories of delivering innovative data converter, radio-frequency (RF), analog and mixed signal products, and imaging ICs and systems for critical systems, through business success at both startups and multinational companies. We specialize in robust designs for temperature- and radiation-sensitive applications, with IP blocks and ASICs for customized for harsh environments. Our high-performance/low-power solutions are ideal to meet the needs of demanding segments, including aerospace, defense, scientific research, medical imaging, and homeland security. | | 311 | Altera | Altera provides leadership programmable solutions that are easy-to-use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end-to-end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet. | | 517 | Analog Devices, Inc. | Analog Devices, Inc. (ADI) is a trusted technology partner delivering comprehensive RF-to-bits solutions, including fully integrated phased arrays and aperture capabilities that accelerate defense innovation. From advanced sensing and intelligent edge processing to high-performance components, specialized system-in-package (SiP) solutions, and wideband digitizers and system-on-modules (SoMs), ADI’s transformative signal-chain technologies support modernization and enhance warfighter readiness.
ADI provides semiconductor and RF subsystem solutions that are trusted, secure, and resilient, enabling customers and government research and engineering organizations to meet the stringent quality and reliability requirements of the aerospace and defense industry—while benefiting from the scale, efficiency, and innovation of a commercial supplier. | | 109 | ARI | The Silicon Crossroads Microelectronic Commons (SCMC) Hub, led by the Applied Research Institute (ARI), is an innovation ecosystem of diverse partners driven to accelerate expansion of America’s microelectronics base by leveraging strong collaborative practices that strategically support innovation, workforce development, and infrastructure needs to achieve domestic microelectronics excellence. In this era of rapid technology advancements, the SCMC model attracts top talent, secures additional financial investments, and helps eliminate the R&D to production “valley of death.”
The SCMC is a three-state coalition comprised of Indiana, Illinois, and Michigan, yet has built a committed nationwide membership of innovators, transition owners, academic leaders, defense industrial base (DIB) partners, government program managers and prototyping/manufacturing facilities that are accelerating microelectronics development. The placement of this hub in America’s heartland is a testament of the region’s commitment to and will catalyze the attraction of top-technology companies, talent, and investments to the Midwest for coming generations. | | 321 | Astronics Test Systems | Astronics Test Systems ensures optimal performance of mission critical systems with innovative test solutions. With over 60 years of expertise, our solutions help mitigate obsolescence, embrace modern technology, and ensure operational readiness. | | 332 | ASU | Led by Arizona State University, the SWAP Hub brings together over 200 top semiconductor manufacturers, defense firms, national laboratories, leading academic institutions, startup companies and numerous other organizations. Hub members leverage advanced packaging, test, characterization, and fabrication capabilities at ASU’s MacroTechnology Works, Sandia National Laboratories and other cores to deliver Department of War needs. Together, we are accelerating innovation into the hands of warfighters.
| | 225 | Avalanche Technology | Avalanche Technology is the leader in true Space Grade non-volatile memory, delivering MRAM solutions designed to meet the five essential criteria required for space missions: Survive. Retain. Endure. Commit. Proven.
With an intellectual property portfolio of over 300 patents and applications, Avalanche offers Space Grade MRAM that is inherently radiation immune, retains data permanently, supports unlimited endurance, commits data instantly, and is backed by proven space and aerospace heritage, including PEMS and QML qualification. Avalanche products are trusted by leading space, defense, and aerospace organizations where failure is not an option. Learn why at www.avalanche-technology.com. More Avalanche perspectives include:
• AI Computing in Space – Whitepaper
• Data Centers in Space – Whitepaper
• Why MRAM Has a Clear Advantage in Aerospace & Defense Applications – Whitepaper | | B [ Back to top ] | | 213 | BAE Systems | At BAE Systems, our dedication shows in everything we create and deliver to support our customers’ missions of today and tomorrow … from the depths of the oceans, to the far reaches of space. Our skilled people are providing world-class capabilities across air, land, maritime, space and cyber domains every day. As a proven partner with a rich legacy of innovation, we are investing and collaborating to develop ground-breaking inventions and discriminating technologies to defend our national security, protect our men and women in uniform, and contribute to the prosperity and sustainability of our local communities, our planet, and beyond. | | 400 | Battelle | Battelle provides focused expertise and advanced R&D at the intersection of Cyber and emerging technologies to secure our nation's most critical systems. Using our unparalleled expertise and advanced laboratory capabilities, we have developed state-of-the-art trust and assurance tools and techniques to secure military and civilian microelectronics. | | 402 | Boeing | A leading global aerospace company and top U.S. exporter, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. Our U.S. and global workforce and supplier base drive innovation, economic opportunity, sustainability and community impact. Boeing is committed to fostering a culture based on our core values of safety, quality and integrity. | | C [ Back to top ] | | 212 | C&D Semiconductor | C&D Semiconductor, Inc. is an innovative, fast-growing semiconductor equipment manufacturer based in San Jose, California. Founded in 1989, we have been serving the global semiconductor and related industries for over two decades, with customers from around the world. | | 333 | Cactus Materials, Inc. | Cactus Materials is a product-driven company delivering high-performance solutions for AI photonics, and power semiconductor applications, engineered to support the demanding performance requirements of today’s aerospace and defense systems, from military data communications and optical sensing to high-power electronic warfare needs. | | 233 | Cadence | Cadence is a trusted partner in the aerospace and defense industry, delivering advanced electronic systems solutions. As a leader in AI, digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, power advancements in rad-hard, security, safety, and 5G technologies, enabling industry leaders to create mission-critical products with precision and reliability. Recognized as one of the world’s top 100 best-managed companies by the Wall Street Journal in 2024, Cadence is committed to excellence in aerospace and defense. Learn more at www.cadence.com | | 414 | CAST | CAST provides digital IP cores that developers use to build FPGA and ASIC systems for defense, aerospace, automotive, industrial, medical, and consumer applications. Our product line features embedded processors (RISC-V, MCUs); security (PQC encryption & SoC solutions); interfaces (TSN, CAN, more); compression (data, image, video); networking (TCP, UDP, eMACs); and peripherals, protocol converters, and many other functions. USA-based and operating for over 30 years, CAST is ISO 9001:2015 certified and supports industry standards such as ISO 26262 and DO 254. CAST has provided a Better IP Experience for many hundreds of organizations, shipping several million product units; visit us at GOMACTech to discuss how we might do the same for you. | | 201 | Checkpoint Technologies | Checkpoint Technologies designs and manufactures Laser Scanning Microscopes and Photon Emission Microscopes for semiconductor device physics analytics/failure analysis. Checkpoint Technologies InfraScan™ LSM/PEM Microscope product line includes laser probing, Dual-Beam LTM-S probing, visible laser probing, waveform acquisition, frequency mapping, photon emission, lock-in TIVA / OBIRCH, SIL technologies, Dual SIL Systems, FemtoSecond Pulsed Laser stimulus, 2-photon LADA, TR-LADA, and pulsed laser probing – to reflect our fundamental commitment to adapting technology to meet customer specific needs within the field of semiconductor failure analysis and fault isolation. | | 209 | Chip Scan | Chip Scan, based in New York City, is a provider of microelectronics assurance. Its specialty areas include cyber threat defense, microelectronics reverse engineering, space systems, and defending operational technologies. Chip Scan is accredited by the DMEA as a Category 1A Microelectronics Trusted Source. Chip Scan is also an awardee in the Anti-Tamper Executive Agent program for protection of critical program information. Its capabilities have been used to assure commercial and government systems, and its products are implemented and/or operational in commercial and military systems. Chip Scan also has strong core competencies in machine learning/AI driven reverse engineering, the recovery of critical design information for DMSMS, and the hardening of systems for anti-tamper. Our goal is to provide innovative solutions that protect our countries critical assets and protect the war fighter. | | 110 | ChipAgents.ai | ChipAgents.ai builds intelligent, autonomous agents purpose-built to accelerate semiconductor design, verification, and system optimization. Leveraging advanced AI reasoning and deep domain knowledge, ChipAgents collaborate across workflows to analyze complex design spaces, surface critical insights, and automate time-consuming engineering tasks. The result is faster iteration, higher-quality silicon, and more confident decision-making, from architecture exploration to tape-out, helping teams push the limits of performance, power, and reliability. | | 422 | Chiplytics | Chiplytics streamlines access to mission-critical electronic components through a scalable testing platform and growing network of supply chain partners. Mature nodes power nearly every electrical system, yet dependence on overseas manufacturing and complex distribution channels introduce significant risk to critical supply chains and national security. The Chiplytics Certified Authentic program will mitigate these risks by delivering secure sourcing, procurement, and testing for high-reliability electronics. | | 420 | CoolCAD Electronics | CoolCAD Electronics designs and fabricates wide bandgap silicon carbide (SiC) semiconductor transistors and integrated circuits (ICs) for applications in Power Electronics, Green Energy, High-Temperature Electronics and Deep Ultraviolet (UV) Optical Electronics.
SiC-based semiconductor devices significantly outperform traditional Si (silicon) devices and are a major driver in the transition from an outdated fossil fuel energy infrastructure to a more sustainable infrastructure based on renewable energy technologies. | | 226 | Custom Silicon Solutions | Custom Silicon Solutions (CSS) is a leading developer and supplier of analog, mixed-signal, RF, and high-voltage turnkey ASICs. For nearly three decades, CSS has empowered our customers to become leaders in their markets with low-cost, cutting-edge ASICs.
At CSS, superb engineering is the foundation of every successful ASIC program. The average engineer at CSS has a remarkable 25+ years of IC design experience which enables CSS to be the most creative and efficient turnkey ASIC provider in the industry. Our engineering team brings a wealth of circuit, system, and application expertise to address the unique challenges in the Industrial, Medical, Aerospace & Defense, and Consumer markets.
CSS owns and operates its own 8,000 sq. foot, class 10,000 clean room at our headquarters in Irvine, CA. Both wafer testing and final package testing is done on site at CSS, providing onshore sourcing of the highest quality integrated circuits. | | 203 | Cycuity | Cycuity provides software products and services to specify and verify semiconductor device security. We help customers ensure that security weaknesses are identified and mitigated during the design phase prior to manufacturing. Our security solutions are a critical element in the semiconductor product ecosystem for commercial and defense industries, providing broad, metric-driven security assurance for semiconductor development across the design supply chain - from secure usage of third-party IPs (3PIP) to full chips, including firmware and software. | | D [ Back to top ] | | 405 | Device Engineering, Incorporated | Device Engineering is an employee-owned ASIC design company.
We specialize in the design, production and long-term support of custom & standard RF/Mixed-Signal ASIC solutions for Defense, Aerospace, Industrial and other mission critical applications | | 327 | DMEA TAPO | The DMEA Trusted Access Program Office (TAPO) has been chartered by the US Government to find and maintain suppliers of Trusted microelectronic parts. TAPO brokers cost-effective access to Trusted suppliers of customized leading-edge microelectronic technologies to improve the security of mission-critical US Government information and operations. | | 501 | DoD Anti-Tamper Executive Agent | The DoD Anti-Tamper Executive Agent mission is to Deter, Impede, Detect and Respond to the reverse engineering and exploitation of our military's CPI to impede technology transfer, stop the alteration of system capabilities and prevent the development of countermeasures to U.S. systems. | | 227 | Draper Labs | As a nonprofit research and development company, Draper focuses on the design, development, and deployment of advanced technological solutions for the world’s most challenging and important problems. | | 502 | DSM Pro Engineering | DSM Pro Engineering helps the world's leading semiconductor companies develop their most complicated business critical ASICs. Stop by our booth for a demo of our AI-driven ASIC project management and build tool that can design the high level chip architecture based on product intent. | | E [ Back to top ] | | 123 | ECM USA | ECM Group | ECM manufactures R&D/lab to mass production wafer processing furnace systems for high-tech applications, both horizontal & vertical tube furnaces, for both semiconductor & solar/photovoltaic. Including: batch wafer processing (Atmospheric, LPCVD, Oxidation, PECVD, Diffusion, POCL, Low Pressure Doping, etc…) and single wafer RTP/RTA systems (Ohmic Contact Annealing, RTO, RTCVD, MOCVD, DLI/ALD). Also systems for energy storage, vacuum heat treatment and advanced crystal growth. | | 102 | Edaptive Computing, Inc. (ECI) | Edaptive Computing, Inc. is a Woman-Owned Small Business headquartered in Dayton, Ohio, with nearly 30 years of experience innovating smart, scalable engineering solutions that help government and commercial organizations operate faster, safer, and more securely. Edaptive’s mission is to tackle complex technical challenges by applying advanced technologies that automate critical processes, optimize performance, and improve trust in systems of systems.
Edaptive is showcasing PCBAT, an AI-driven capability that automates printed circuit board analysis - accelerating supply chain assurance by detecting components, generating Bills of Materials, and identifying risk or tampering directly from PCB images. PCBAT’s machine learning-powered detection and validation dramatically reduce the time and error associated with manual PCB validation, supporting rapid supply chain risk assessment and enhanced microelectronics assurance. | | 303 | EngeniusMicro | EngeniusMicro is a trusted provider of high-performance microelectronic die-level packaging solutions engineered for harsh environments. Our cutting-edge hybrid & multi-material additive manufacturing technologies enable the creation of custom ceramic packages and multi-layer printed circuit boards, offering exceptional thermal, electrical, and mechanical performance at lower cost than conventional packaging options at R&D scale and small production quantities. These tailored packages can be printed on demand to enable rapid design iteration, flight qualification, and device performance maximization for the most demanding applications, such as hypersonics, aerospace, space, maritime, and UAS. As a proud exhibitor at GOMACTech—an essential forum for reviewing advancements in microcircuit technology for government systems—EngeniusMicro is committed to advancing the next generation of defense and dual-use electronics in alignment with national security priorities and DoD innovation initiatives. | | 521 | EPC Space | EPC Space provides revolutionary high-reliability radiation hardened enhancement-mode gallium nitride power management solutions for space and other harsh environments.
Radiation hardened GaN-based power devices address critical space-borne environments for applications including power supplies, light detection and ranging (lidar), motor drive, and ion thrusters. | | 427 | ERS electronic GmbH | ERS electronic GmbH, based in Germering close to Munich, has been providing innovative thermal management
solutions to the semiconductor industry for more than 50 years.
The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based
thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related
and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market.
Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors
of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition
in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level
packaging manufacturing process. Our headquarter, sales department, engineering center and production facilities
are in the Munich suburb of Germering, and we also have sales and support offices worldwide. | | 310 | Eurofins EAG Laboratories | Eurofins EAG Laboratories has over 40 years’ experience in materials testing services. Our parent company, Eurofins Scientific, is a multi-billion-dollar global leader in scientific services with a portfolio of over 200,000 validated analytical methods. We offer a consultative, multi-disciplinary approach to solving your materials- and engineering-related product problems. As thought leaders in investigative science, we set the global standard for materials testing services. | | 107 | Everspin Technologies | Everspin Technologies, Inc.
Headquartered in Chandler, Arizona, Everspin Technologies, Inc. has been a qualified supplier to the U.S. DIB since 2008. As the global leader in the design and manufacture of Magneto-resistive Random Access Memory (MRAM) and Spin-Transfer Torque MRAM (STT-MRAM), Everspin has shipped more than 200 million discrete and embedded MRAM devices into commercial, industrial, and defense applications where data persistence and integrity, low latency, and security are critical requirements. Everspin expanded its PERSYST® MRAM product family with the introduction of the EM064LX HR and EM128LX HR high-reliability devices. These devices are specifically engineered to meet the stringent requirements of the Military, Aerospace, LEO, MEO and other space markets and applications. These advanced xSPI MRAM solutions deliver sustained read and write bandwidth of up to 90 MB/s, unlimited endurance with data retention of ten years at operating temperatures up to 125°C. The devices are qualified to AEC-Q100 Grade 1 for operation over the temperature range of −40°C to +125°C and undergo 48-hour burn-in testing. Radiation resilience has been validated through testing conducted by NASA’s Jet Propulsion Laboratory. These persistent, non-volatile memory devices provide a resilient, high-performance, and dependable alternative to SRAM and NOR FLASH enabling mission-critical systems operating in demanding aerospace, defense, and space environments to maintain uncompromised data integrity and reliable system performance where failure is unacceptable. | | F [ Back to top ] | | 224 | Fabric8Labs | Fabric8Labs, Inc., based in San Diego, California, is revolutionizing manufacturing with its advanced 3D printing technology - Electrochemical Additive Manufacturing (ECAM). Founded in 2015, the company’s proprietary ECAM technology is a key enabler across multiple value chains, such as electronics, medical devices, communications systems, and semiconductor manufacturing. Fabric8Labs is working to broaden the market for metal additive manufacturing by providing advanced manufacturing services that displace traditional manufacturing. For more information visit Fabric8Labs.com. | | 514 | Finetech | Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework.
We provide solutions for each stage of your journey – from R&D to industrial automated production. | | 108 | ForwardEdge ASIC | As a commercially focused, wholly owned subsidiary of Lockheed Martin, we combine the agility of a startup with the stability and scale of a Fortune 100 leader. Our agile team of IC design engineers delivers trusted, cutting-edge technology to help you lead, innovate, and succeed.
We specialize in best-in-class ASIC technology, 100% domestically traceable microelectronic solutions designed for performance in commercial, defense, and security sectors. | | 504 | Fuse | Fusion energy development and radiation environments for TREE testing | | G [ Back to top ] | | 431 | GenAlpha | AI Enabled Analog Design Tools | | 304 | Golden Altos Corp. | Golden Altos is a QML provider of assembly services located in silicon valley (Fremont, CA). Golden Altos offers complete on-shore, in-house, high-reliability hermetic assembly for both monolithic and hybrid assemblies as well as qualification services for both hermetic and plastic IC’s. We continually strive to deliver the finest products, services and documentation through our own internal system, as well as regular certifications from government agencies. As a small business that has served the commercial, military, and aerospace industries for over 30 years, Golden Altos understands the importance of putting our customers first because what we do matters. | | 433 | Graf Research | Graf Research unleashes innovation by developing ideas into disruptive technologies. Our mission is to perform research, provide services, apply analytics, and create products that enable secure and high-performance embedded and adaptive computing solutions. | | H [ Back to top ] | | 512 | Heidelberg Instruments | Heidelberg Instruments designs, develops, and manufactures maskless laser lithography systems for the fabrication of micro-structures, serving the global photolithography community in both the direct writing field and in photomask production. Application areas include MEMS, micro-optics, advanced packaging (3DIC), IC, flat panel displays (FPD), micro-fluidics, sensors, and other analog and digital electronic components. Our systems are used in research and development, rapid prototyping, and industrial production. | | 322 | HexaTech, Inc. | Established in 2001, HexaTech, Inc. is a recognized world leader in the development and commercialization of the next-generation semiconductor material, aluminum nitride (AlN). This wide bandgap semiconductor offers unique properties which enable the fabrication of first-in-kind devices, including long life ultraviolet (UV-C) light emitting diodes (LEDs) for disinfection applications, deep UV lasers for biological threat detection, high voltage switching devices for efficient power conversion, and radio frequency (RF) components for satellite communications. | | 509 | Holt Integrated Circuits | Located in Aliso Viejo, CA, Holt Integrated Circuits is a major supplier of ICs for avionics and military aircraft data bus and display applications. The company’s products are specified by more than 400 manufacturers worldwide and are employed in flight control, navigation, engine management, communications, safety equipment, and in-flight entertainment systems.
Holt’s range of ICs supporting the ARINC 429 standard is the widest in the industry, and its MIL-STD-1553 transceivers are recognized as the industry’s smallest, having the lowest power consumption. In addition, Holt MIL-STD-1553 integrated terminals offer the most compact, cost effective solution available, integrating protocol, transceiver and transformers in a single 15x15mm package. Other data bus products include ARINC 717, CAN (ARINC 825), Ethernet, RS-485/422, discrete-to-digital and analog switches.
Select products are available to DSCC SMD specifications. Holt also offers product compliant to the EU Directive 2011/65/EU (“RoHS 2”).
Holt Integrated Circuits is AS9100D:2016 and ISO 9001:2015 registered. | | 429 | Honeywell Aerospace Technologies | Products and services from Honeywell Aerospace Technologies are found on almost every commercial, defense and space aircraft, and in many terrestrial systems. The Aerospace Technologies business unit builds aircraft engines, cockpit and cabin electronics, wireless connectivity systems, mechanical components, power systems, and more. Its solutions create more fuel-efficient aircraft, more direct and on-time flights and safer skies and airports. | | 315 | HRL Laboratories, LLC | HRL is a state of the art research facility in Malibu California that focuses on projects ranging from Gallium Nitride Semiconductor fabrication to additive materials. With a 10,000 square foot cleanroom, they are a trusted foundry utilized by commercial and DoD customers. | | I [ Back to top ] | | 231 | IBM | IBM is a leading global hybrid cloud and AI, and business services provider, helping clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. IBM has cultivated a premier federal consulting practice that enables enterprise transformations to accelerate business outcomes through our agility expertise powered by multi-cloud environments, garage, analytics, and digital capabilities. All of this is backed by IBM’s legendary commitment to trust, transparency, responsibility, inclusivity, and service. For more information, visit www.ibm.com | | 407 | Idaho Scientific | We are embedded security experts. Our proven, easy-to-integrate and low maintenance solutions address Government cybersecurity and anti-tamper requirements. Our products address the vulnerabilities in embedded systems, preventing cyber exploitation by allowing an adversary persistent arbitrary code execution and preventing intellectual property theft and exploitation of proprietary firmware and data. | | 121 | Instec, Inc. | Instec is a scientific instrument manufacturer focused on precision thermal and environmental control. Our products are compatible with any optical measurement system and can be equipped with electrical testing setups including electrical probers, all inside a controlled sample environment. Necessary for many applications including spectroscopy, electrochemical analysis, nanotechnology research, and more. | | 206 | Intel Corp. | Intel, the world leader in silicon innovation, develops technologies, products, and initiatives to continually advance customer missions. Providing advanced manageability, security, and sustainable performance, Intel business-optimized technologies address the challenges and opportunities within the public sector today and tomorrow. | | 413 | ISI | ISI, a Molex company, specializes in manufacturing multi-component electronic modules designed for highly reliable and ruggedized applications. Their solutions excel in demanding environments across industries such as military, aerospace, heavy industry, and advanced packaging. ISI leverages deep expertise in advanced electronic packaging to deliver durable, high-performance modules that support next-generation technology needs and stringent operational requirements.
By combining proven reliability with innovative design, ISI empowers customers to develop competitive, robust products tailored for harsh and mission-critical conditions. | | J [ Back to top ] | | 200 | JEOL | JEOL is the market leader in electron beam-based lithography, both mask and direct write platforms. JEOL also manufactures the highest end SEM, SEM/FIB, and Automated S/TEM characterization systems. JEOL recently introduced a 3D printer, capable of building objects in metals ranging from pure copper to pure tungsten. Our customer base spans quantum technologies, photonics, semiconductors, energy sectors, and life sciences. Celebrating our 75yr anniversary, JEOL continues to excel at customer satisfaction by offering guaranteed response times and guaranteed up times for the life of our instruments. Stop by Booth 315 to learn more! | | 426 | Jmem Technology Co., Ltd. | Jmem Tek is a fabless semiconductor company within the upstream semiconductor industry and specializes in Application-Specific Integrated Circuit (ASIC) solutions for quantum-resilient cybersecurity. We also provide hardware security Intellectual Property (IP) and Integrated Circuit (IC) design services, concentrating on next-generation quantum safe security solutions that safeguard against hackers and ensure robust data protection. | | K [ Back to top ] | | 329 | Kansas City National Security Campus | The Kansas City National Security Campus (KCNSC) is one of eight sites that comprise the National Nuclear Security Administration (NNSA). Three key mission activities within KCNSC are Nuclear Weapons Programs, Global Security, and the Supply Chain Management Center. The Global Security division of KCNSC is a secure engineering and manufacturing activity, safeguarding the nation with products and services that support response to global threats. Founded in 1998, Global Security now has more than 400 personnel in Kansas City and Albuquerque (NMO) supporting national security across four key areas: Global Security and Stability, Proliferation Deterrence, Emerging Challenges and Supply Chain Assurance. With over 75 years of continuous excellence, the mission of KCNSC remains to deliver innovative national security solutions for generations to come. | | 305 | Keysight Technologies Inc. | Keysight Technologies is a leading technology company that empowers innovators with software-centric design, emulation, and test solutions, helping customers accelerate development and reduce risk across areas like communications, automotive, aerospace/defense, IoT, and emerging technologies. Through its recent acquisition of Riscure, Keysight also offers device security evaluation and vulnerability testing services, bringing specialized expertise in areas such as side-channel analysis and fault injection testing, along with support for security certifications and security-focused training. | | L [ Back to top ] | | 411 | LAB14 Inc. | LAB14 Inc. is the US distributor and service provider for Notion Systems Single wafer processing system for spin/spray coating, cleaning, processing, bonding and development substrates. n.Varixx product lines is for fully automated systems and the n.Unixx systems for manual stations. In addition, Notion Systems n.Jet product line provides industrial ink-jet printing. | | 221 | Laser Thermal Analysis | Laser Thermal is a precision instrumentation company. Our thermal analysis tools (TOPS and FASTR) address longstanding gaps in the market: accurate, high-throughput, and user-friendly measurements of thermal conductivity, thermal resistance, and volumetric heat capacity. We’ve eliminated the technical and operational barriers of legacy techniques, providing precise measurements over a wide range of length scales. We also offer contract testing laboratory services. | | 323 | LeWiz Communications, Inc. | LeWiz develops solutions and rad-hard chips for end-to-end time critical networks (time-triggered Ethernet, time sensitive network) for aerospace applications. Solutions include smart endpoint, switch, gateways interconnecting networks of different protocols. Chips include complex RISC-V based system-on-chip and FPGA devices. US design and fab. See demos at exhibit. | | M [ Back to top ] | | 519 | MACOM | MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. | | 503 | Marvell | Marvell delivers data infrastructure semiconductor solutions that move, process, store and secure the world’s data. Today, we’re at the heart of the AI and cloud revolution, providing the high-performance compute, interconnect, network switching and storage technologies that power the most advanced data centers on the planet. Our solutions enable hyperscalers to build fabrics that train the largest models, tailor compute for every unique need, and scale cloud services globally. Visit www.marvell.com. | | 113 | MASS Group | MASS Group, Inc. (Manufacturing Automation & Software Systems) is a trusted U.S.-based provider of cloud and on-premise manufacturing software purpose-built for complex, regulated, and high-precision operations. For over 25 years, MASS Group has delivered secure, configurable, and scalable solutions to organizations across aerospace, defense, semiconductor, energy, and industrial manufacturing. | | 211 | Mercury Systems | Mercury Systems is a technology company that delivers mission-critical processing power to the edge to solve the most pressing A&D challenges. Combining technologies and expertise developed for more than 40 years, the Mercury Processing Platform offers customers a unique advantage to unleash breakthrough capabilities. It spans the full breadth of signal processing—from RF front end to the human-machine interface— enabling customers to turn data into decisions with standard products and custom integrated solutions from silicon to system scale | | 505 | Microelectronics Commons | The Microelectronics Commons program is a network of regional technology Hubs acting on a shared mission: to expand the nation’s global leadership in microelectronics. The Microelectronics Commons program is accelerating domestic prototyping and growing a pipeline of U.S.-based semiconductor talent.
The Microelectronics Commons program was established through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Agreement (OTA) established by the Naval Surface Warfare Center (NSWC), Crane Division and is managed by the National Security Technology Accelerator (NSTXL). | | 500 | Microsanj, LLC | Microsanj delivers high-resolution thermal imaging for semiconductors, RF devices, and photonics. Our thermoreflectance and hybrid infrared (IR+TR) solutions provide nanosecond transient analysis and sub-micron resolution for precise failure detection and optimization. | | 428 | Micross | One Source. One Solution. Micross is the most complete end-to-end provider of advanced microelectronic services and component, die & wafer solutions.
Serving the Aerospace, Defense & Space communities for more than 45 years, Micross is the largest and most experienced DMEA DoD Trusted Source OSAT (Outsourced Semiconductor Assembly and Test) manufacturer in the United States. With a core strength in maintaining end-of-life (EOL) technologies, Micross provides an extensive understanding and expertise in semiconductor obsolescence management, mitigating supply chain risks and enabling the extension of the product life cycle for a program’s microelectronics requirements.
With the broadest franchised access in sourcing semiconductor die & wafer; an extensive portfolio of military and space grade high-reliability power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products; and the most comprehensive advanced packaging, assembly, modification, upscreening and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete product lifecycle sustainment.
For more information about Micross, please visit www.micross.com and follow us on LinkedIn. | | 334 | MIT Lincoln Laboratory | The Lincoln Laboratory Microsystems Prototyping Foundry is a semiconductor research and fabrication facility for design, fabrication, packaging, and test with extensive staff, process, and technology capabilities. | | 401 | MMEC | MMEC leads the acceleration of microelectronic technologies and delivers solutions to establish a trusted and resilient domestic supply chain. The MMEC is the premier collaborative, public-private ecosystem, that engages broadly across innovative partners in industry, academia and government to rapidly advance defense and commercial applications. This unique environment empowers members to discover new technologies, share capabilities, develop a skilled workforce and launch groundbreaking innovation into scalable commercial production for the benefit of National Security and economic dominance. | | 312 | Mosaic Microsystems | Mosaic Microsystems: Redefining Microelectronics Packaging.
Mosaic Microsystems is a premier domestic provider of advanced glass packaging solutions, strategically meeting the escalating demands for high-performance computing, AI, and high-bandwidth communications. As the industry shifts toward 5G/6G and satellite communications at mm-Wave frequencies, Mosaic’s thin glass substrates and interposers provide a high-density, low-loss alternative to conventional organic and silicon materials.
Our core advantage lies in our expertise with ultra-thin glass (<500um) tailored for the chiplet revolution and heterogeneous integration. By enabling finer feature patterning and smaller vias, our glass solutions provide the ideal platform for Co-Packaged Optics (CPO) and high-speed data transfer. From Through-Glass Via (TGV) wafers to RDL interposers, Mosaic empowers the next generation of AI, HPC, and microfluidic devices with unmatched precision, superior thermal stability, and design flexibility. | | 412 | MOSIS 2.0: Accelerated Prototyping | MOSIS 2.0 is your gateway for semiconductor prototyping, enabling access to silicon and compound semiconductor MPWs, a network of research fabs, and a deep bench of process, device, and circuit experts. From quick-turn R&D to low- or high-volume tapeouts, our engineering service helps you rapidly design, fabricate, and test. | | 111 | Movellus | Movellus is the infrastructure IP partner for high-performance, energy-efficient silicon. We provide solutions for adaptive clocking, droop detection, and power network characterization. | | 101 | MRSI Mycronic | MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled precision and reliability for R&D, NPI, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, and optical imaging products. We provide the most flexible assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. Our commitment to excellence ensures we meet our customers' needs with meticulous attention to detail and 24/7 field support. For more information visit www.mycronic.com/product-areas/die-bonding/. | | N [ Back to top ] | | 434 | Nano OPS, Inc. | Nano OPS, Inc. offers a revolutionary additive manufacturing platform, Fab in a Box, for the fabrication of nano and microelectronics. This patented, versatile, and compact platform combines nano- and microscale additive manufacturing capabilities into a single, fully automated, high-throughput system. It supports the fabrication of devices using many materials, including semiconductors, metals, and dielectrics. The Fab in a Box provides a technology for making electronics, advanced packaging, displays, and sensors without utilizing vacuum, etching, or chemical reactions on wafers or other substrates. This agile and disruptive technology enables high-end prototyping or production at substantially lower capital and manufacturing costs. | | 314 | NHanced Semiconductors Inc | NHanced Semiconductors, Inc. is the world leader in advanced 2.5D and 3D integrated circuits. The company uses advanced packaging technology to enable high security solutions and enhance SWAP for critical devices. Their broad suite of capabilities includes interposer production, hybrid bonding of chiplets, TSV insertion, exotic material handling, and extensive BEoL processing. Low-volume high-mix manufacturing is fully supported. NHanced is US owned and ITAR registered, performing all of its work within the US. | | 228 | Nimbis Services, Inc. | Nimbis Services is the technology-transition engine for U.S excellence. We support the full trusted and assured technology-transition lifecycle, from research and development to acquisition, maintenance, and sustainment.
The Nimbis Trusted Stratus is a dual-use Modeling, Simulation, and Analysis (MS&A) platform accelerating the transition of microelectronics, manufacturing, and aerospace technologies. Our platform's unique digital-twin capabilities support radiation effects analysis, thermal analysis, and hardware-software co-verification, and more.
Over the past 17 years, Nimbis has launched and implemented numerous projects and prototypes for the DoW and supported over 300 projects and 150 organizations. We are deeply experienced in the underlying cloud and on-prem high-performance computing, data, and networking infrastructures supporting MS&A and digital engineering. | | 325 | Noble Metal Services | High reliability supply chain partner for precious metal source materials, reclaim and refining, 26 years in operation. Gold, Silver, Platinum, Palladium, Iridium, Rhodium, and Ruthenium. Waste streams include multi-layered ceramics, rags, wipes, production residues, scrap components, chamber flake and hazardous wastes. We can also clean your shield kits to UHV standards. EPA complaint based on our stringent environmental systems. ITAR registered, ensures your proprietary property is 100% destroyed, on-site in our Cranston, RI facility. Excellent recommendations from our defensive manufacturers. Please stop by our booth. Let’s talk about our reliability and process | | 506 | North Carolina State University | CLAWS brings together the leading regional experts in wide bandgap semiconductors to develop an increase in domestic production and employment. | | 103 | Northeast Regional Defense Technology Hub (NORDTECH) | NORDTECH facilitates microelectronics fabrication and prototyping using a regional network of cleanrooms and manufacturing-relevant facilities. Through lab-to-fab prototyping projects and relevant workforce development initiatives, NORDTECH is supporting Department of War (DOW) Microelectronics Commons program goals and U.S. leadership in advanced microelectronics. Collectively, our advances in chip design, intellectual property, and cutting-edge tooling make NORDTECH a strategic springboard for onshoring and scaling secure microelectronics. | | 324 | Northrop Grumman | Northrop Grumman designs, manufactures, assembles, tests and packages millions of microelectronics annually to support next-generation defense and commercial systems in the United States, ensuring the American supply chain is protected and sustainable to strengthen national defense infrastructure. From design, fabrication, to field, the company’s mission-tailored semiconductor solutions serve as the crucial intelligence powering mission success. | | 124 | Northwest-AI-Hub | The California-Pacific-Northwest AI Hardware Hub or NW-AI-Hub is one of the eight Hubs funded by the Microelectronics Commons.
CXR (CMOS + X Route), a flagship initiative of the Northwest-AI Hub, accelerates the transition of next-generation AI and advanced microelectronics technologies from concept to manufacturable hardware. CXR enables secure, low-cost prototyping by providing streamlined access to advanced commercial CMOS foundry processes combined with integration of emerging “+X” technologies—including 2D materials, quantum components, novel functional materials, and heterogeneous device platforms.
Innovators in government, defense, and dual-use markets often face significant barriers to hardware realization: high mask and foundry costs, complex IP and NDA requirements, limited access to advanced nodes, and lack of post-processing expertise for integrating disruptive technologies. CXR addresses these challenges by operating as a centralized coordinating body that:
-Launches and manages multi-project wafer (MPW) shuttles
-Facilitates secure multi-party NDA frameworks
-Provides design enablement, PDK access, and parametric test structures
-Coordinates integration of disruptive +X technologies with foundry CMOS
-Leverages distributed fabrication capabilities across the Microelectronics Commons
Through strategic collaboration with industry partners such as Western Digital and coordination with peer Microelectronics Commons Hubs (including CA DREAMS, SCMC, and MMEC), CXR aggregates demand, reduces cost barriers, and accelerates secure hardware prototyping for national security and commercial applications.
CXR uniquely engages across startups, established industry, academia, national laboratories, and DoD-aligned programs to enable rapid development of CMOS+X systems. By bridging commercial-grade semiconductor manufacturing with cutting-edge research innovations, CXR serves as a national pathway for advancing secure, scalable, and manufacturable AI and microelectronics technologies.
Organizations seeking to prototype advanced microelectronics, integrate novel materials with CMOS platforms, or transition government-funded research into manufacturable hardware are invited to engage with CXR. | | 129 | NSWC Crane | The FPGA Assurance for Navy and Government Systems
(FANGS) and Reverse Engineering Embedded Firmware
(REEF) Labs of NSWC Crane provide technical expertise
and tool solutions for securing DoD programs and systems.
FANGS and REEF are part of JFAC for collaborating with other
DoD entities while also collaborating closely with industry and
academia. The REEF Lab supports �irmware assurance
throughout the product lifecycle using forensic and vulnerability
analysis for �irmware as well as �irmware feature veri�ication
by utilizing binary extraction, disassemblers/ decompilers,
and debuggers. The FANGS Lab assures the entire FPGA
lifecycle with SME support, V&V of performer tools, and R&D
solutions. Tools presented at GOMACTech and developed by the
FANGS Lab for FPGA Assurance include the Security Mitigation
Enforcer (SeME) and Bitstream Analysis Toolkit (BAT). | | O [ Back to top ] | | 104 | Omni Design Technologies | Omni Design Technologies develops ultra-low power, high-performance semiconductor IP solutions for advanced system-on-chip (SoC) designs, using cutting-edge process nodes like advanced FinFET and CMOS down to 3nm. Its technology spans Wideband Signal Processing™, including SWIFT™ data converters (ADCs and DACs) with resolutions from 6 to 14 bits and sampling rates up to 100 GSPS for applications such as broadband communications, automotive ADAS, LiDAR, radar, and AI infrastructure. Their product portfolio offers silicon-proven cores and chiplets for high-speed wireless and wireline communications, data centers, satellite receivers, and precision monitoring solutions. Omni Design’s solutions empower industry leaders to achieve energy efficiency, speed, and advanced integration in the most demanding data-driven environments. | | 430 | onsemi | onsemi pushes innovation to create intelligent power and sensing technologies that solve the most challenging customer problems. Its employees are inspired each day to increase stakeholder value through high-quality and high-value products and services. | | P [ Back to top ] | | 320 | PacTech USA, Inc. | PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region. | | 330 | Photronics, Inc. | or more than 50 years, we have done one thing and done it well. With laser focus, an unwavering commitment to quality, dedicated employees and constructive customer collaboration, we have grown into a leading global enterprise. Our photomask products, services and technologies have provided the manufacturing foundation for state-of-the-art mobile devices, PCs, TVs, displays and a host of other products that you rely on every day.
We are recognized for providing exceptional customer service, leading technology and outstanding value to our customers. We earned this recognition through collaboration in strategic partnerships and prudent investments that have expanded Photronic’s capacity, technology and capability, all building our unequaled product portfolio. | | 234 | Polar Semiconductor | Located in Minnesota, Polar Semiconductor is a U.S.-owned 200mm Merchant Foundry, with an established track record in high-volume manufacturing of Silicon Integrated Circuit and Discrete devices. Polar specializes in Sensor and Power Semiconductors tailored for Automotive, Industrial, and Aerospace & Defense applications. With a recent investment of $525 million, Polar is expanding its manufacturing footprint, doubling its capacity to competitive scale (40,000 wafers per month), and investing in Automation (Autonomous Robots and Automated Material Transport Systems) and Intelligent Manufacturing (AI/ML). The 150,000 sq. ft. Class 1 cleanroom facility is home to state-of-the-art manufacturing and measurement Equipment, and produces advanced BCD, BiCMOS, MOSFET, IGBT, Optical MEMS, Wide-Bandgap (GaN), and Magnetoresistance sensor technologies. Polar provides a suite of foundry Design Enablement, Transfer, and Characterization services. Fully certified to run Automotive products, Polar meets stringent Quality and Environment Certification requirements, and is now working towards obtaining ITAR and Trusted (Defense) Certifications. Polar supports the National Security infrastructure through RD&E collaboration with DoD Microelectronics Commons and the National Semiconductor Technology Center, supports Economic Security through serving various Industries with critical advanced technologies, ensuring IP Protection and Secure Data, providing Pilot to High Volume Cost-Competitive manufacturing, and ensures Supply Chain Resilience as a foundry located in the U.S. Upper Midwest with Stable and Secure Water and Electricity and a low risk for catastrophic natural events. Polar serves customer needs through tailored Partnership Models, from traditional Pure Play to “Captive Capacity,” and seeks to create a technology advantage through joint RD&E or licensing. Polar’s backbone is its stable, long-tenured workforce, comprising of highly skilled and experienced customer enablement, technology, and operations teams. More information at: polarsemi.com | | 408 | PQSecure Technologies, LLC | PQSecure™ is a leading provider of high-assurance cryptographic solutions designed to meet the security demands of a post-quantum world. The company specializes in post-quantum cryptography (PQC) hardware and software IP, delivering industry-grade implementations of NIST-standardized algorithms optimized for performance, efficiency, and side-channel resistance. PQSecure’s portfolio includes secure hardware accelerators, resilient cryptographic cores, and integrated system solutions for embedded, edge, and constrained environments across ASIC, FPGA, and SoC platforms. Backed by a growing portfolio of issued U.S. patents and pending applications, PQSecure enables defense, aerospace, and government systems, commercial infrastructure, semiconductor and IP partners, and IoT platforms to deploy quantum-resilient security without compromising performance, power, or assurance. | | 308 | Precision Circuit Technologies | At Precision Circuit Technologies (PCT) we’re heralding a new era of miniaturization and ultra high-density integration (UHDI), ushering in next-generation electronic devices that are significantly smaller, faster, and more functional than ever before. Built on liquid crystal polymer (LCP) substrate, known for its extremely low signal loss tangent (Df) and dielectric constant (Dk), and utilizing our proprietary particle-free liquid metal inks and patented additive fabrication techniques, we create ultra high-density interconnect (UHDI) circuits with unmatched precision, achieving intricate circuit geometries with lines and spaces as small as 6-microns, all while improving signal integrity. | | 207 | Presidio Components | Family owned and operated since 1980, located in San Diego, and Sioux Falls, SD. US manufacturer of ceramic capacitors for Defense, Aerospace, Space and Telecommunication for RF/Microwave, chip and power applications. | | 126 | Purdue Applied Research Institute (PARI) | The Purdue Applied Research Institute (PARI) is a nonprofit entity that extends the reach and impact of Purdue University’s deep research strengths and top-ranked academic programs in engineering, agriculture, science and technology. PARI works to improve national security, global development, infrastructure solutions and to accelerate critical technologies.
Through applied research and program personnel, state-of-the-art facilities and infrastructure, PARI significantly enhances Purdue’s ability to translate discoveries into innovative solutions and services for mission-oriented government, industry, NGO and foundation partners. PARI is an incubator for advanced development and transition of leading ideas and technology with potential for significant impact through large-scale prototypes, pilots, and startups. | | Q [ Back to top ] | | 232 | Qorvo | Qorvo delivers trusted, high-performance RF and analog semiconductor solutions for mission-critical defense and aerospace systems. As a U.S.-based supplier, Qorvo provides secure open foundry services, advanced packaging, and space-qualified manufacturing backed by 30+ years of compound semiconductor expertise. Qorvo empowers government and defense partners to design, build, and deploy with confidence. | | 214 | QP Technologies | QP Technologies is a leading provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services and our service offerings enable our customers to target a range of end markets, including commercial, RF, power, industrial, automotive, medical and mil-aero. We leverage proven technologies developed by our skilled experts, and we work closely with you to get your products to market quickly and in high volume. Our in-depth and unique industry knowledge, combined with the personal relationship we create with you, means you can count on us to be your trusted adviser and partner. | | 421 | QuickLogic Corp. | QuickLogic, a trusted supplier in the Aerospace and Defense markets for nearly three decades, specializes in the design of programmable logic devices, embedded FPGA (eFPGA) IP, and FPGA-based products, including Strategic Radiation Hardened (SRH) FPGAs. Our low-power, production-proven eFPGA enables fast, in-field reconfiguration of ASICs and SoCs, facilitating over-the-air updates for evolving needs. For our FPGA tools, we offer both a 100% open-source version (Aurora) as well as a version that integrates Synopsys® Synplify® Logic Synthesis (Aurora Pro) to empower Mil/Aero/Defense contractors with complete toolchain visibility and long-term control, while also achieving best-in-class power, performance, and area (PPA). QuickLogic's dedication to innovation within the defense and aerospace community reinforces its role as a leader in trusted, secure, strategic radiation-hardened, and fast-reconfigurable computing technology for defense applications. | | R [ Back to top ] | | 306 | Radiation Team | The Rad Team are radiation experts in reliability solutions for space systems. We provide radiation testing and analysis for commercial, academic, government, and military customers. Our engaging approach to radiation solutions encompasses a full suite of white-glove services including: BoM database, turnkey testing, design mitigations, requirements, and mission assurance. | | 415 | Raith America, Inc. | RAITH is a global market and technology leader in maskless nanofabrication and characterization systems. Its comprehensive portfolio includes electron beam lithography, FIB-SEM systems, laser lithography, and advanced imaging solutions. With over 1,200 systems installed worldwide and serving 10,000+ users, the company enables breakthrough innovations in quantum technologies, photonics, semiconductors, and life sciences. Its solutions bridge the gap between R&D and production, supporting applications in connectivity, mobility, green energy, and healthcare. Headquartered in Germany with global operations including a US-based applications center, RAITH combines cutting-edge technology with four decades of expertise to deliver precision nanofabrication tools for both research institutions and industry. | | 202 | Rambus | Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With 35 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs. For more information, visit rambus.com. | | 105 | Raytheon | RTX serves customers in the commercial aerospace and defense industries. We combine complementary technology offerings and world-class engineering teams to deliver innovative solutions. | | 229 | Real Intent | Real Intent is a leading provider of EDA software to accelerate early functional verification and advanced sign-off of digital designs.
Our static sign-off product capabilities include multi-mode clock domain crossing; multi-scenario reset domain crossing; multi-test mode DFT; multi-policy RTL linting, connectivity & glitch, hardware security, and formal linting. Real Intent products lead the market in performance, capacity, accuracy, and completeness. | | 425 | Red Balloon Security | Red Balloon Security is the industry leader in high-assurance security for embedded systems, providing deep host-based defense and real-time runtime protection for critical infrastructure and defense hardware. We specialize in securing the entire device lifecycle through advanced firmware hardening and our BITWISE FPGA bitstream assurance tool, which delivers automated vulnerability analysis and JFAC Level of Assurance reporting. By neutralizing zero-day exploits without requiring source code or hardware modifications, we ensure mission-critical resilience for the world’s most sensitive systems. | | 508 | Reliable MicroSystems | Reliable MicroSystems LLC, founded in 2016, with offices in the Cool Springs area of Franklin, Tennessee and WestGate Technology Park in Crane, Indiana. Rel-Micro supports the DoW and the Defense Industrial Base with radiation-hardened, trusted, integrated circuit design infrastructure. Rel-Micro provides expertise in discovery, modeling, and mitigation of operational failures in advanced technologies due to harsh environments. Engineers provide advanced-technology research and development, radiation effects analysis, IC modeling and simulation, IC testing, and radiation-hardened-by-design IC design. Rel-Micro represents technical expertise with over ten decades of combined experience in the mil-aero enterprise. | | 125 | Rickert-Areno Engineering, LLC | As a non-traditional defense contractor, we are committed to offering innovative and flexible solutions to sectors that demand the highest standards of security and functionality. Our team’s expertise spans Systems Architecture Design and Systems Architecture Security Assessment, ensuring that every solution we create is both efficient and resilient to modern cybersecurity threats.
What sets us apart is our unique focus on security-first system design, which is essential for organizations dealing with sensitive data and complex environments. We understand the critical nature of compliance and reliability in government and defense projects, as well as the evolving security needs of commercial enterprises. Our services are designed to ensure long-term operational success, with integrated security solutions built from the ground up. | | S [ Back to top ] | | 410 | Samtec | Founded in 1976, Samtec delivers advanced interconnect solutions that enable true silicon-to-silicon connectivity across the entire signal path—from die-to-die and chip-to-substrate to board-to-board and system-level integration. By combining high-speed copper and optical interconnect platforms with innovative packaging technologies, Samtec helps customers overcome bandwidth, density, and power-efficiency limits in next-generation computing, AI, aerospace, and high-performance embedded applications.
A key enabler of the silicon-to-silicon strategy is Glass Core Technology (GCT), which includes proprietary through glass via (TGVs) paired with precision redistribution layers (RDL) all built on cutting edge fused silica and borosilicate transparent materials. Glass Core Technology is uniquely positioned to solve many of today’s interconnect challenges at mmWave frequencies. For more information please visit www.samtec.com | | 135 | Secure Micro Technologies, LLC | Secure Micro Technologies specializes in delivering cutting-edge embedded cybersecurity solutions for critical infrastructure sectors such as satellite systems, command and control platforms, nuclear facilities, industrial control environments, and secure communications networks. Leveraging extensive experience supporting the Department of Defense and its industrial base, the company excels in architecting secure hardware, firmware, and software systems tailored for high-assurance applications. | | 127 | Shibuya Corp. | Shibuya Corporation is a leading Japanese manufacturer of advanced semiconductor packaging equipment, specializing in high-precision solder ball mounters and laser-assisted thermo-compression bonders (LATCB). Our solutions enable fluxless, high-reliability interconnects for next-generation devices including photonics, chiplets, and heterogeneous integration. | | 120 | Siemens | Siemens is driving transformation to enable a digital enterprise for electronic systems, including 2.5D/3D heterogeneous Integration, packaging and multi-domain system design and verification. Xcelerator, the integrated portfolio of software and services from Siemens, helps companies of all sizes create and leverage a comprehensive digital twin that provides organizations with new insights and opportunities to drive innovation. See the latest from Questa One formal and verification, hardware-assisted verification with Veloce, system level packaging with XSI/XPD, high-level design and synthesis with Catapult, physical design implementation with Aprisa, circuit simulation and verification with AFS/Solido, DFT for chip & 2.5/3DIC modules with Tessent, functional monitoring with Embedded Analytics and signoff with the Calibre product solutions. | | 133 | SiFive | SiFive is the leader in RISC-V computing, delivering the custom silicon foundation that AI demands. As the gold standard for RISC-V CPUs, SiFive combines the flexibility of open standards with unmatched performance, enabling scalable AI solutions from the edge to the data center. With the broadest portfolio, leading IP, and deep system expertise, we help the world’s technology leaders rapidly build differentiated AI hardware—faster, at lower cost, and without compromise. | | 205 | Sigasi Visual HDL | Sigasi Visual HDL (SVH) transforms VS Code into a powerful VHDL/Verilog/SV platform for chip designers providing deep design insights and a streamlined workflow. We made our tool for one purpose: build better chips, faster. You catch errors and bugs early in the design cycle which avoids costly delays in the later stages. Visual HDL is an essential tool for advanced chip designers. | | 309 | Silicon Creations | Silicon Creations is a leading silicon IP provider and the current Mixed-Signal Partner of the Year with both TSMC (9-years running) and GlobalFoundries. The company provides world-class silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance multi-protocol and targeted SerDes, and high-speed differential I/Os for diverse applications including networking, automotive, “radiation tolerant” applications for space and/or heavy industry, processors, and medical devices as well as consumer products such as smartphones, and wearables/IoT. Silicon Creations delivers silicon-proven solutions available at advanced nodes including TSMC 3nm and above, Intel 18A and above, and GlobalFoundries 12nm and above. | | 404 | Silitronics | Silitronics is ITAR Corporation and acquired GDSI (Grinding and Dicing Services Inc), marking a significant milestone in our journey to redefine Advanced EIC and Photonics PIC assembly. This union, powered by the creative force of “Power of 2” brings together Silitronics’ integrated packaging leadership with GDSI’s proven expertise in precision wafer thinning, polishing and Stealth Laser dicing. Silitronics and GDSI offering have
accelerated time to market with “Start-Up” speed and “First Time Right” solutions. | | 116 | SkyWater Technology | SkyWater Technology (NASDAQ: SKYT) is securing America’s silicon foundation as the largest U.S.-based, pure-play semiconductor foundry. A trusted partner to both commercial customers and federal defense programs, SkyWater’s Technology as a Service model empowers innovators to bring emerging technologies like quantum computing and next-generation systems from concept to reality. With state-of-the-art facilities in Minnesota, Florida, and Texas, SkyWater specializes in foundational nodes and advanced packaging to support the nation’s critical infrastructure, strengthen supply chain resilience, and ensure long-term U.S. technology leadership. SkyWater is a DMEA-accredited Category 1A Trusted Foundry. To learn more, visit www.skywatertechnology.com. | | 522 | Space R3 LLC | Space R3 sets the standard for radiation assurance in complex space systems, delivering true Test-As-You-Fly validation grounded in more than 37 years of experience across semiconductor design and high-reliability space missions. Founded and led by Melanie Berg, a pioneer in complex device radiation testing and mitigation strategies, Space R3 brings unmatched depth in designing, verifying, and hardening systems that are flying today. Our mitigation methodologies have influenced industry practices worldwide. We deliver fully integrated, turnkey radiation assurance — aligning testing, mitigation implementation, requirements development, and mission assurance into one cohesive strategy — ensuring mission-critical systems perform reliably in the harshest radiation environments. | | 300 | Spectral Design and Test, Inc. | Spectral Design and Test Inc., headquartered in Somerville, New Jersey, is a global leader in advanced embedded memory solutions. We serve a wide range of markets—including commercial applications, AI/IoT/5G technologies, and the Mil/Aero/DoD sectors—by delivering high performance, highly specialized memory IP.
Our MemoryIP™ portfolio provides a comprehensive suite of intellectual property, featuring AI optimized SRAMs, ultra low power IoT memories, radiation hardened by design (RHBD) technologies, and specialized architectures such as TCAMs. As a true one stop shop for embedded memory IP, we offer solutions engineered for performance, reliability, and mission critical environments.
Spectral also delivers industry leading Memory Development EDA tools tailored to the unique requirements of Mil/Aero organizations. These tools empower teams to build their own RHBD Memory Compilers with greater efficiency and confidence. Our flagship platform, MemoryCanvas™, streamlines and accelerates the development of Memory Compilers, making the process more intuitive and productive than ever. Complementing this, MemoryTime™ enables designers to model, analyze, and characterize embedded memories with precision—producing the most advanced EDA views available.
To learn more, visit us at www.spectral-dt.com. | | 313 | SRI International | SRI International designs and manufactures form, fit, function replacements for obsolete microcircuits. Utilizing a Trusted Wafer Foundry, specialized design and test approaches, we provide QML certified (MIL-PRF-38535) units. Through the Generalized Emulation of Microcircuits (GEM) and the Advanced Microcircuit Emulation (AME) programs, sponsored by DLA, a permanent solution is provided. | | 520 | StratEdge Corporation | StratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz, specializing in packages and mounting tabs for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. StratEdge's molded ceramic packages offer unparalleled reliability, designed to handle high-frequency chips up to 18 GHz, with over 200 standard outlines available, providing a vast array of packaging options. Complementing these, StratEdge's post-fired ceramic packages and copper laminate mounting tabs excel in thermal management for compound semiconductors. The packages provide ultra-low loss performance over a wide range of frequencies, depending on the style and mounting configuration. Many open-tooled designs are available with 50 ohm impedance high-frequency transitions, which provide convenience and ease for packaging high-performance semiconductors. StratEdge has a variety of lids and options for their attachment and offers post assembly services. Markets served include telecom for 5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. Our facility near San Diego, California, is both ITAR registered and ISO 9001:2015 certified. | | 220 | Synopsys | Catalyzing the era of pervasive intelligence, Synopsys delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. For Government, Aerospace, and Defense companies, as well as their partners and ecosystems, Synopsys provides solutions to help accelerate mission-critical developments. Build and deploy advanced systems that exceed mission requirements and address challenging application demands, including C5ISR, EW, security, and safety. Enable longevity and reliability in extreme environments with low size, weight, power, and cost (SWaP-C) from sea to space. Synopsys is a US DoD-trusted design service supplier. For more information visit synopsys.com. | | T [ Back to top ] | | 513 | Tektronix Component Solutions | Tektronix Component Solutions (CSO) is a U.S. based, onshore semiconductor services provider specializing in high reliability ASIC development, wafer fabrication, advanced packaging and comprehensive test solutions. For more than 50 years, we’ve supported mission critical programs across defense, aerospace, and industrial markets, delivering secure, trusted and ITAR compliant manufacturing. Our vertically integrated model allows customers to streamline their needed OSAT supply chain services all under one roof. We are uniquely equipped to handle complex mixed signal, RF, and rad hard requirements while meeting the most stringent quality and reliability standards. CSO’s engineering and operations teams partner closely with their customers to accelerate development cycles and ensure flawless execution from prototype to full rate production. Whether you need ASIC design enablement, small volume engineering runs, or scalable manufacturing for long lifecycle programs, CSO provides the agility, transparency, and technical depth required to support your mission. We look forward to connecting with you and discussing how our onshore, secure semiconductor solutions can strengthen your technology roadmap. | | 106 | Teledyne Micropac | Teledyne HiRel Micropac is a trusted global provider of high-reliability semiconductor, microelectronic, and optoelectronic solutions for mission-critical applications across military, aerospace, space, industrial, and medical markets. Our expertise spans the design, development, and manufacturing of advanced components and modules, including semiconductors, optocouplers, LEDs and displays, proximity and Hall effect sensors, solid-state relays, power controllers, high-temperature voltage regulators, and multi-chip modules.
Certified to MIL-PRF-19500 and MIL-PRF-38534 standards, we deliver both standard and custom solutions tailored to meet stringent qualification and environmental requirements. Our comprehensive capabilities include packaging, electrical testing, qualification, and up-screening, supported by our innovative SLiM (Semiconductor Lifecycle Management) program. SLiM addresses obsolescence challenges through die banking, custom packaging, memory stacking, and full wafer-up resurrection—ensuring long-term availability and lifecycle support.
At Teledyne HiRel Micropac, we are committed to excellence, reliability, and innovation, enabling our customers to achieve their mission-critical objectives with confidence. | | 223 | Tenet3 | Founded in 2013, Tenet3® set out to better secure cyber-physical systems by putting anti-tamper research into practice. To achieve this, we built
MeTRA®, a knowledge management platform for teams to digitally capture, exchange and analyze system data. During the last thirteen years we have
come to realize that the first principle for securing cyber-physical systems, “knowing what you have,” applied to many challenges in a wide range of use cases. Whether it is processes or personnel, critical infrastructure or structural tests, change management
or cybersecurity, we can help you make sense of complexity. | | 331 | Tenstorrent | At Tenstorrent, we build computers for AI, and the developers that are shaping its future.
Our high-performance RISC-V based CPUs and AI, modular chiplets, and scalable compute systems give developers full control, at any scale from a single-node experimentation to data center-scale deployment.
We believe in an open future. Our architecture and software are designed to be edited, forked, and owned. Our team of engineers, dreamers, and first-principle thinkers is redefining how hardware and software converge to accelerate innovation. | | 423 | Texas Instruments | We design, manufacture, and sell analog and embedded semiconductors that are the essential building blocks of electronic systems. With more than 80,000 products, we have the most comprehensive portfolio of general-purpose analog products, as well as a full breadth of analog and embedded products that help our customers create differentiated applications. For over 60 years, we have created a wide range of high-reliability products for space, avionics and defense electronics designs. Engineers rely on TI’s product availability and system-level knowledge, support and detailed design resources to meet mission-critical design requirements with products that can operate in harsh environments for decades. | | 335 | Trusted Semiconductor Solutions | Trusted Semiconductor Solutions Inc. was founded in 2006 to design and deliver integrated circuits, radiation hardened products, and electronic systems solutions for military & defense, space, and industrial markets. Our flexibility and creativity allow us to uniquely partner with our customers to develop high-quality products. We provide a single point of contact for your product development needs, offering services from design through production with unparalleled program management, consultation, and customer service. | | 100 | Trusted Strategic Solutions, LLC | Trusted Strategic Solutions provides strategic consulting services for organizations in the public and private sectors. We help clients navigate challenges related to rare earth elements, microelectronics, and semiconductors by offering informed analysis and forward-looking strategies. | | 301 | TTM Technologies | TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com. | | U [ Back to top ] | | 510 | UF | Florida Semiconductor Institute | FSI’s mission is to drive innovation and technological advancement in the semiconductor industry by executing high-impact research and development programs, educating and training the next generation of talent, and expanding the workforce pipeline. We foster collaboration across academia, industry, and government to strengthen Florida’s vibrant semiconductor industry. We are dedicated to making Florida a global leader in specialty electronics. |
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