GOMACTech 2023 Exhibition
 
Company Company Description: 
Booth number/ref
3D Glass Solutions, Inc.3D Glass Solutions (3DGS) is a pure-play glass foundry empowering high performance electronics. We leverage the unique properties of our patented APEX® glass-ceramic material which enables performance not possible with traditional 2D components.616
Alphacore Inc.Alphacore enables engineers to develop ultra-high performance and ultra-low power microelectronic components and systems with our products and design services. We develop data converter IP and RF, analog and mixed signal ASIC solutions, as well as image sensors and complete imaging systems. We also offer radiation hardened and radiation tolerant versions of our products. Our robust designs serve the defense, aerospace, automotive, communications, and scientific instrumentation markets. Let us supply you with state-of-the-art designs to satisfy your product and system needs.119
Andes Technology Corp.Seventeen years in business and a Founding Premier member of RISC-V International, Andes is publicly-listed company (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099) and a leading supplier of high-performance/low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Andes’ fifth-generation AndeStar™ architecture adopted the RISC-V as the base. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit cores with DSP, FPU, Vector, Linux, superscalar, and/or multicore capabilities. The annual volume of Andes-Embedded SoCs has exceeded 3 billion in 2021 and continues to rise. By the end of 2021, the cumulative volume of Andes-Embedded™ SoCs has surpassed 10 billion. For more information, please visit https://www.andestech.com. Follow Andes on LinkedIn, Twitter, Facebook, and YouTube!315
Astronics Test SystemsAstronics Test Systems ensures optimal performance of mission critical systems through innovative test solutions. Leveraging 60 years’ experience, we offer automatic test expertise to electronics manufacturers in aerospace, military, mass transit, urgent communications, and space industries. Our test solutions ensure the world’s most advanced electronics perform as designed, every time.504
Avalanche TechnologyAvalanche Technology Inc., headquartered in Fremont, California is the leader in next generation Spin Transfer Torque Magnetic RAM (STT-MRAM) technology, accepted as the front runner to replace traditional Flash, SRAM, and DRAM for unified architecture support in aerospace and defense, industrial, storage and other high reliability applications. Backed by more than 300+ patents granted around cell, circuit and system design innovation leveraging MRAM, this revolutionary non-volatile memory employs novel perpendicular magnetic tunnel junction (pMTJ) cell structures manufactured on 300mm standard CMOS processes. The resulting discrete and embedded products in production today are designed with standard serial and parallel interfaces and offer unprecedented density, endurance, reliability and low power with the persistence and inherent immunity of MRAM technology, making Avalanche a true "Next Generation MRAM Company."518
BAE Systems617
BattelleBattelle provides focused expertise and advanced R&D to establish root-of-trust verification to secure our nation's most critical systems. Using our unparalleled expertise and advanced laboratory capabilities, we have developed state-of-the-art trust and assurance tools and techniques to secure military and civilian microelectronics.202
BoeingAs a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. Boeing’s diverse team is committed to innovating for the future, leading with sustainability, and cultivating a culture based on the company’s core values of safety, quality and integrity.716
C&D Semiconductor Services, Inc.706
Cadence517
CAESCAES technology pioneers the future and underpins many of the world’s most critical missions. Our RF, microwave and millimeterwave solutions enable missile defense radars and missile seekers, electronic warfare systems that keep warfighters safe, communications systems that keep the world connected, and civil aviation radars that ensure the safety of the flying public. Our radhard microelectronics empower the world’s leading spacecraft: from leading high throughput commercial communications satellites, earth observation satellites, and manned space, to high priority national security missions, deep space exploration to Mars and beyond, and the latest new space constellations. CAES is the largest provider of analog and radiation hardened technology for the United States aerospace and defense industry. With a broad portfolio of off-the-shelf and customized RF, microwave and high reliability microelectronic products and subsystems, CAES offers a complete range of solutions for the entire signal chain from aperture to digital conversion.609
Checkpoint TechnologiesCheckpoint Technologies develops and manufactures innovative optical failure analysis tools used by semiconductor manufacturers in Laser Scanning and Photon Emission Microscopy. Checkpoint Technologies InfraScan™ product line includes laser probing, visible laser probing, frequency mapping, photon emission, lock-in TIVA and OBIRCH, Dual-Beam LTM-S Probing, SIL technologies, Dual SIL Systems, FemtoSecond Pulsed Laser stimulus, 2-photon LADA, TR-LADA, and pulsed laser probing – to reflect our fundamental commitment to maximizing value by adapting technology to meet specific market needs within the field of semiconductor device physics analytics802
CycuityCycuity was created as Tortuga Logic in 2014 by co-founders with a shared vision: to revolutionize cybersecurity with trusted microelectronics. Today, we remain committed to the belief that a secure design lifecycle is essential—from the design & verification chain into post-silicon. Silicon chip vulnerabilities like Spectre and Meltdown have the potential to exploit weaknesses in chip design and firmware and cause irreparable damage to companies that build or rely on semiconductor technology. At Cycuity, we’re working towards a world where the products that enrich, inform, and protect our lives aren’t just secure—they’re backed by the confidence of hardware security assurance.218
DMEA TAPOThe DMEA Trusted Access Program, TAPO, provides access to leading edge IC technologies under the multi project wafer and dedicated prototype programs, with engagement models available from standard ASIC to full custom design services. Through Trusted accreditation, customers have access to suppliers who can support their design, aggregation, foundry, mask manufacturing, post processing, packaging, and assembly requirements.612
ENGIN-IC, Inc.411
Extreme Waves402
Finetech USA607
Flex Logix Inc.Flex Logix(R) is a reconfigurable computing company providing leading eFPGA IP and AI inference chip solutions. Flex Logix’s embedded FPGA (eFPGA,) EFLX(R) technology is licensed to chip designers as intellectual property (IP) and enables our customer’s semiconductor chips to flexibly handle changing protocols, interfaces, algorithms, accelerate key workloads and provide mechanisms to avoid costly chip re-spins. The adoption of eFPGA technology in semiconductor devices is growing rapidly and Flex Logix is the market share leader for eFPGA technology with more than 25 chips working in Silicon and more in design. EFLX eFPGA is available today in popular 12, 16, 22, 28 and 40 nm process nodes with 7nm in design and more advanced nodes in planning. For more information, visit https://flex-logix.com/efpga/618
Globalfoundries U.S. Inc.GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more.503
Golden Altos Corp.502
IBM319
Indiana Integrated Circuits, LLC717
Integra Technologies LLC418
Intrinsic ID317
Intrinsix Corp.602
JEOL USA, Inc.603
JSTF - Jazz Semicnductor Trusted Foundry316
Kansas City National Security CampusThe Kansas City National Security Campus provides engineering, manufacturing and operational national security solutions for government organizations as part of its Global Security mission.614
Keysight TechnologiesKeysight provides the world’s most advanced, best-in-class electronic test & measurement products. The same world-class technology and engineering enabling these products can also be leveraged into your solution. Visit our booth and see how our high frequency MMICs, and other technologies can work for you!704
Knowles Precision DevicesKnowles Precision Devices is a quickly growing division of Knowles Corporation, a leading provider of high-performance audio solutions founded in 1946. Our division engineers a wide-variety of specialty components including multilayer ceramic, single-layer, high-reliability, and precision variable capacitors; EMI Filters; and microwave devices such as RF filters, splitters, and couplers. But we aren’t designing your standard commodity components. Our high-performance components are designed for systems that cannot fail or operate at extremely high voltages, temperatures, or frequencies across military, medical, electric vehicle (EV), and 5G market segments409
Linear Integrated SystemsLinear Systems is a full-service, 35-year-old U.S. designer and manufacturer of world class small-signal discrete semiconductors.217
Menta eFPGA, Inc.Menta eFPGA Inc. is the proven eFPGA pioneer who delivers embedded FPGA IPs in RTL and GDS2 format, for SoC, ASIC or ASSP designs. Our design-adaptive standard cells-based architecture and state-of-the-art tool set OrigamiTM provides the highest degree of design customization, best-in-class testability, and fastest time-to-volume for SoC design targeting any production node at any foundry. Menta’s eFPGAs are available as Soft RTL or Hard GDSII IP. Our technology lets you effortlessly update your silicon post-production, whether to fix a bug, implement customer and application specific features, adapt to evolving standards, or enhance security. Menta IPs are delivered with standard EDA tools, and support process technologies and nodes from any vendor (TSMC, GF... from 350nm all the way down to 3nm).605
Mercury Systems606
Metamagnetics613
Microchip Technology Inc.Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.314
MicropacMicropac Industries, Inc. manufactures and designs microelectronic and optoelectronic components and modules for the hi-rel industrial, medical, military, aerospace and space markets. Micropac offers both standard and custom products including optocouplers, LEDs, Hall Effect sensors, solid state relays and power controllers, high temperature voltage regulators and multi-chip modules.708
Microsoft Corp.
Micross ComponentsMicross… The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets. Micross brands include: Micross, SemiDice, Silicon Turnkey Solutions, Advanced Interconnect Technologies, Hi-Rel Components, Component Modification Services, and Die & Wafer Solutions.719
MIT Lincoln LaboratoryThe Microelectronics Laboratory is a state-of-the-art semiconductor research and fabrication facility that supports the design, fabrication, and packaging of novel devices.818
Modelithics, Inc.MODELITHICS® is the industry leader providing highly accurate, scalable measurement-based simulation models, behavioral models, complex equivalent circuit models, and advanced non-linear models for all types of RF & microwave devices, as well as comprehensive measurement services. Modelithics extensive services include capabilities for custom 3D model development, GaN modeling, X-Parameters, load pull and noise measurements.303
Nano OPS, Inc.Nano OPS, Inc. provides a purely additive manufacturing platform, “Factory-in-a-Tool” for advanced packaging and semiconductor manufacturing applications. The company’s patented, highly versatile manufacturing platform delivers nano and microscale manufacturing capabilities in a single tool. The patented processes can be used to make devices using a variety of materials such as semiconductors, metals, and dielectrics. Nano OPS “Fab-in-a-Tool” brings to the manufacturers of semiconductors, advanced packaging, displays, and sensors a disruptive solution to make high-end products at substantially lower capital and manufacturing costs.308
Northrop GrummanNorthrop Grumman is a technology company, focused on global security and human discovery. Our pioneering solutions equip our customers with capabilities they need to connect, advance and protect the U.S. and its allies. Driven by a shared purpose to solve our customers’ toughest problems, our 90,000 employees define possible every day.604
ON Semiconductor514
PacTech USA, Inc.Pac Tech - Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: Manual & Automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders. SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG or ENEPIG for UBM (solder bumping) or OPM (wirebond). Other services include Electroplating, Laser Solder Jetting, Solder Rework & Solder Reballing, Wafer Level Solder Balling, Re-passivation, RDL, Backmetal, Wafer Thinning, Wafer Dicing, Tape & Reel, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for electroless plating.718
Palomar Technologies, Inc.Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI. With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services. Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com219
Photronics, Inc.318
Plexus Corp.516
QP Technologies302
QuickLogic CorporationQuickLogic Corporation (NASDAQ: QUIK) is a publicly traded, US-owned, trusted supplier of FPGA and eFPGA cores with a proven 30+ year track record in delivering millions of units for commercial, ruggedized and mission critical applications. Five of the Top five and eight of the Top 10 DoD Primes use our technology today. Our Australis eFPGA IP generator leverages foundry standard cell libraries, enabling us to go from concept to tapeout of a customized FPGA/eFPGA for any process node in as little as days. In addition to our proprietary Aurora FPGA User Tools, we are also the first FPGA vendor that has shipped products with 100% open-source FPGA user tools, supporting RTL-to-bitstream for fully transparent and inspectable FPGA user tools. QuickLogic is a member of the DARPA Toolbox Initiative.403
Raith America, Inc.417
Real IntentReal Intent provides intent-driven static sign-off tools to accelerate early functional verification of digital designs.507
RiscureRiscure is a large global security evaluation lab and market leader for Side-Channel and Fault Injection test equipment. Riscure provides security Services, Tools, and Training to help customers around the world enhance the resilience of their solutions, protect sensitive information, and speed up the process of development and certification. We challenge the security of embedded systems through our leading test equipment, by using thorough and inventive testing to discover security weaknesses in both hardware and software.510
Rochester Electronics, LLCRochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and the broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market. Rochester is the Semiconductor Lifecycle Solution. No other company compares to the breadth of Rochester’s product selection, value-added services, and manufacturing solutions.506
Rogers CorporationRogers delivers advanced material solutions solving design issues such as signal integrity, Radio Frequency (RF) signal management, power efficiency, and thermal management, to deliver improved device and system reliability. These solutions include high frequency laminates, bondplys and prepregs. Rogers operates manufacturing facilities in the United States, Asia and Europe.509
Silicon AssuranceSilicon Assurance develops hardware security software to address trust and assurance issues in silicon chips designed by semiconductor companies and system OEMs. Our automated tool will reduce the time required by verification and hardware security engineers to check the security of chip design, prevent data leakage from the system by detecting vulnerabilities, and save revenue of companies by protecting IP blocks.707
Silitronics Solutions, Inc.Silitronics offers value added IC package design and assembly services from concept to NPI to high volume production guided by “First Time Right” philosophy. Silitronics team has expertise to propose, develop, and implement cost effective solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in the heart of Silicon Valley, and boasts a 10,000+ sq. ft. state of art automated facility with 10K and 1K clean rooms. Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. One of our key differentiated services is assembly process development. Many of the NPI package assemblies which Silitronics does are so advanced that there is no precedence and does not fit in a standard assembly template. Often the design rules have to be pushed beyond their limits. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well crafted Design of Experiments (DOE) and even investments in new equipment. Silitronics has 100+ man years of R&D experience.611
Spectial Design + Test Inc.203
SRI InternationalSRI International designs and manufactures form, fit, function replacements for obsolete microcircuits. Utilizing a Trusted Wafer Foundry, specialized design and test approaches, we provide QML certified (MIL-PRF-38535) units. Through the Generalized Emulation of Microcircuits (GEM) and the Advanced Microcircuit Emulation (AME) programs, sponsored by DLA, a permanent solution is provided.419
StratEdge CorporationStratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services. StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego.702
SynopsysSynopsys is ushering in the era of Smart, Secure Everything - where everything is connected and secure. With the world's most advanced technologies for chip design, verification, IP integration, and software security and quality testing, Synopsys enables the DoD, other government agencies, and their partners, to deliver innovative products faster and cheaper while also meetings higher security standards.703
The MOSIS Service, ISI, USCThe MOSIS Service was founded in 1981 at Information Sciences Institute, Viterbi School of Engineering of University of Southern California. DARPA provided the contract for The MOSIS Service to facilitate the first manufacturing projects for fabless organizations. The MOSIS Service pioneered the Multi-Project Wafer (MPW) model. The MOSIS Service has processed over 60,000 designs at more than a dozen foundries. Customers of The MOSIS Service have included US Government Laboratories, foreign and domestic corporations, and foreign and domestic universities. MOSIS has enabled IC designers to prototype innovative semiconductor designs in CMOS FinFET, FD-SOI, Bulk, SiGe, high-voltage BCD, and other specialty processes.414
Top Talent Search Experts, LLCTOP TALENT SEARCH EXPERTS, LLC Helping our clients in the Test and Measurement, Power Electronics, Aerospace, Avionics and Semiconductor industries find the most talented Engineers, Managers, Executives and Technical Sales professionals available in today's competitive marketplace.512
TOPLINE CORPORATIONManufacturer of CGA solder columns for FPGA and ASIC devices for Defense and Space. Also manufacturer of Vibration Dampers. Supply of bonding wire for chips.615
Toppan Photomasks Round Rock, Inc.TF1A (TRUSTED) accredited photomask products and data services provider.515
Trusted Semiconductor Solutions Inc.Trusted Semiconductor Solutions provides integrated circuit development services from concept to qualified part delivery leveraging the best-in-class on-shore manufacturing capabilities. It specializes in IC design, IP development, and high-density package solutions with expertise in radiation hardening for space and strategic applications.311
University of California, DavisCenter for Hardware and Embedded Systems Security and Trust University of California, Davis709
Vistec Electron BeamVistec Electron Beam GmbH is a leader in the design and manufacture of electron-beam lithography systems. The company provides systems to both key semiconductor manufacturers as well as Advanced Research. The application areas span a wide range of existing and emerging semiconductor and nanotechnology applications including silicon direct write, compound semiconductor, mask making, advanced research, integrated optics and photonics. The company provides Variable Shaped Beam lithography systems and is located in Jena, Germany. In addition to their production facility in Germany, Vistec Electron Beam maintains service and support centres in Europe, China, Taiwan and also in the US.313
XTREME SemicionductorA “solutions” company providing support for legacy systems. A “MIL-PRF-38535 QML certified” manufacturer, providing re-manufacturing of legacy components. Our newest solution in the fight against product obsolescence is our “Chip Recovery (ChiPR) Product”, a game changer in the fight against obsolescence. As leader in Counterfeit Product Detection, XTREME Semiconductor offers “Certified EOL Product” providing peace of mind and assurance that you receive only authentic OCM material.118