GOMACTech 2023 Exhibition
 
Company Company Description: 
Booth number/ref
Alphacore Inc.Alphacore enables engineers to develop ultra-high performance and ultra-low power microelectronic components and systems with our products and design services. We develop data converter IP and RF, analog and mixed signal ASIC solutions, as well as image sensors and complete imaging systems. We also offer radiation hardened and radiation tolerant versions of our products. Our robust designs serve the defense, aerospace, automotive, communications, and scientific instrumentation markets. Let us supply you with state-of-the-art designs to satisfy your product and system needs.119
BAE Systems617
Boeing716
Cadence517
Checkpoint Technologies802
DMEA TAPOThe DMEA Trusted Access Program, TAPO, provides access to leading edge IC technologies under the multi project wafer and dedicated prototype programs, with engagement models available from standard ASIC to full custom design services. Through Trusted accreditation, customers have access to suppliers who can support their design, aggregation, foundry, mask manufacturing, post processing, packaging, and assembly requirements.612
ENGIN-IC, Inc.411
Extreme Waves402
FINETECH607
Flex Logix Technologies Inc.Flex Logix(R) is a reconfigurable computing company providing leading eFPGA IP and AI inference chip solutions. Flex Logix’s embedded FPGA (eFPGA,) EFLX(R) technology is licensed to chip designers as intellectual property (IP) and enables our customer’s semiconductor chips to flexibly handle changing protocols, interfaces, algorithms, accelerate key workloads and provide mechanisms to avoid costly chip re-spins. The adoption of eFPGA technology in semiconductor devices is growing rapidly and Flex Logix is the market share leader for eFPGA technology with more than 23 chips working in Silicon and more in design. EFLX eFPGA is available today in popular 12, 16, 22, 28 and 40 nm process nodes with 7nm in design and more advanced nodes in planning. For more information, visit https://flex-logix.com/efpga/616
Golden Altos Corp.502
IBM319
Indiana Integrated Circuits, LLC518
Integra Technologies LLC418
Intrinsix Corp.602
JEOL USA, Inc.603
JSTF - Jazz Semicnductor Trusted Foundry316
Kansas City National Security CampusThe Kansas City National Security Campus provides engineering, manufacturing and operational national security solutions for government organizations as part of its Global Security mission.614
Menta eFPGA, Inc.605
Mercury Systems606
Micross ComponentsMicross… The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets. Micross brands include: Micross, SemiDice, Silicon Turnkey Solutions, Advanced Interconnect Technologies, Hi-Rel Components, Component Modification Services, and Die & Wafer Solutions.719
Modelithics, Inc.MODELITHICS® is the industry leader providing highly accurate, scalable measurement-based simulation models, behavioral models, complex equivalent circuit models, and advanced non-linear models for all types of RF & microwave devices, as well as comprehensive measurement services. Modelithics extensive services include capabilities for custom 3D model development, GaN modeling, X-Parameters, load pull and noise measurements.303
Nano OPS, Inc.308
Northrop GrummanNorthrop Grumman is a technology company, focused on global security and human discovery. Our pioneering solutions equip our customers with capabilities they need to connect, advance and protect the U.S. and its allies. Driven by a shared purpose to solve our customers’ toughest problems, our 90,000 employees define possible every day.604
ON Semiconductor514
PacTech USA, Inc.Pac Tech - Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: Manual & Automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders. SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG or ENEPIG for UBM (solder bumping) or OPM (wirebond). Other services include Electroplating, Laser Solder Jetting, Solder Rework & Solder Reballing, Wafer Level Solder Balling, Re-passivation, RDL, Backmetal, Wafer Thinning, Wafer Dicing, Tape & Reel, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for electroless plating.718
Palomar Technologies, Inc.Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI. With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services. Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com219
Photronics, Inc.318
Plexus Corp.516
QP Technologies302
QuickLogic CorporationQuickLogic Corporation (NASDAQ: QUIK) is a publicly traded, US-owned, trusted supplier of FPGA and eFPGA cores with a proven 30+ year track record in delivering millions of units for commercial, ruggedized and mission critical applications. Five of the Top five and eight of the Top 10 DoD Primes use our technology today. Our Australis eFPGA IP generator leverages foundry standard cell libraries, enabling us to go from concept to tapeout of a customized FPGA/eFPGA for any process node in as little as days. In addition to our proprietary Aurora FPGA User Tools, we are also the first FPGA vendor that has shipped products with 100% open-source FPGA user tools, supporting RTL-to-bitstream for fully transparent and inspectable FPGA user tools. QuickLogic is a member of the DARPA Toolbox Initiative.403
Raith America, Inc.417
Rogers CorporationRogers delivers advanced material solutions solving design issues such as signal integrity, Radio Frequency (RF) signal management, power efficiency, and thermal management, to deliver improved device and system reliability. These solutions include high frequency laminates, bondplys and prepregs. Rogers operates manufacturing facilities in the United States, Asia and Europe.509
Silitronics Solutions, Inc.Silitronics offers value added IC package design and assembly services from concept to NPI to high volume production guided by “First Time Right” philosophy. Silitronics team has expertise to propose, develop, and implement cost effective solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in the heart of Silicon Valley, and boasts a 10,000+ sq. ft. state of art automated facility with 10K and 1K clean rooms. Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. One of our key differentiated services is assembly process development. Many of the NPI package assemblies which Silitronics does are so advanced that there is no precedence and does not fit in a standard assembly template. Often the design rules have to be pushed beyond their limits. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well crafted Design of Experiments (DOE) and even investments in new equipment. Silitronics has 100+ man years of R&D experience.611
Spectial Design + Test Inc.203
SRI InternationalSRI International designs and manufactures form, fit, function replacements for obsolete microcircuits. Utilizing a Trusted Wafer Foundry, specialized design and test approaches, we provide QML certified (MIL-PRF-38535) units. Through the Generalized Emulation of Microcircuits (GEM) and the Advanced Microcircuit Emulation (AME) programs, sponsored by DLA, a permanent solution is provided.419
StratEdge CorporationStratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services. StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego.702
SynopsysSynopsys is ushering in the era of Smart, Secure Everything - where everything is connected and secure. With the world's most advanced technologies for chip design, verification, IP integration, and software security and quality testing, Synopsys enables the DoD, other government agencies, and their partners, to deliver innovative products faster and cheaper while also meetings higher security standards.703
Top Talent Search Experts, LLCTOP TALENT SEARCH EXPERTS, LLC Helping our clients in the Test and Measurement, Power Electronics, Aerospace, Avionics and Semiconductor industries find the most talented Engineers, Managers, Executives and Technical Sales professionals available in today's competitive marketplace.512
TOPLINE CORPORATIONManufacturer of CGA solder columns for FPGA and ASIC devices for Defense and Space. Also manufacturer of Vibration Dampers. Supply of bonding wire for chips.615
Tortuga Logic218
Trusted Semiconductor Solutions Inc.Trusted Semiconductor Solutions provides integrated circuit development services from concept to qualified part delivery leveraging the best-in-class on-shore manufacturing capabilities. It specializes in IC design, IP development, and high-density package solutions with expertise in radiation hardening for space and strategic applications.311
Vistec Electron BeamVistec Electron Beam GmbH is a leader in the design and manufacture of electron-beam lithography systems. The company provides systems to both key semiconductor manufacturers as well as Advanced Research. The application areas span a wide range of existing and emerging semiconductor and nanotechnology applications including silicon direct write, compound semiconductor, mask making, advanced research, integrated optics and photonics. The company provides Variable Shaped Beam lithography systems and is located in Jena, Germany. In addition to their production facility in Germany, Vistec Electron Beam maintains service and support centres in Europe, China, Taiwan and also in the US.313