GOMACTech 2022 Exhibition
Company Company Description: 
Booth number/ref
3D Glass Solutions, Inc.3D Glass Solutions (3DGS) is an innovative RF passive device design and manufacturing company that develops and builds novel, high-frequency 3D components in its brand new, state-of-the-art, 33,000 sq. ft. manufacturing facility. Leveraging the unique properties of our patented APEX® glass-ceramic material, 3DGS technology enables performance not possible with traditional 2D components.720
Criteria Labs IncDedicated to providing the best RF space and semiconductor services possible, Criteria Labs can deliver unique solutions to your complex technical problems, improve your project schedules, and complement you with capabilities not internally available. Our in-house Engineering Team can deliver eutectic die attachments, die to shim attachments, chip and wire assemblies, ceramic space qualified packaging, upscreening, RF device screening up to 50 GHz, reliability, and qualification testing solutions where dependability is critical. Our breadth of services remains an important differentiator, no other company in the industry can offer the comprehensive end-to-end solutions that we can. We understand that your RF space and semiconductor projects are financially and strategically important to your organization, and we take the responsibility to help you achieve your goals very seriously. We also recognize that we can be the very best at what we do and still be great to work with. We strive to be both.314
Integra TechnologiesIntegra Technologies is a global leader in the sourcing, packaging, testing and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability (“Hi-Rel”) applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle - from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, counterfeit detection, DPA and FA service for high-reliability applications. Find out more at: https://www.integra-tech.com521
Intrinsix Corp.413
JEOL USA, Inc.509
Menta eFPGA, Inc.For ASIC and SoCs designers who need fast, right-the-first time design and fast time to volume, Menta is the proven eFPGA pioneer whose design-adaptive standard cells-based architecture and state-of-the-art tool set provides the highest degree of design customization, best-in-class testability and fastest time-to-volume for SoC design targeting any production node at any foundry. Menta also provides rad-hard eFPGA IPs in any CMOS technology node - with several proven silicon.514
Mercury SystemsMercury Systems is a global commercial technology company serving the aerospace and defense industry. Headquartered in Andover, Mass., we research, develop and manufacture trusted and secure open architecture computer hardware and software products tailored for mission-critical applications, including embedded processing modules and subsystems, microelectronics components, modules and subsystems, avionics mission computers and displays, and rugged edge servers.513
MIT Lincoln LaboratoryThe MIT Lincoln Laboratory Microelectronics Laboratory is a state-of-the-art semiconductor research and fabrication facility that supports the design, fabrication, and packaging of novel devices.620
Raith America, Inc.Raith is a leading precision technology manufacturer for focused ion beam (FIB-SEM) nanofabrication, large area scanning electron microscopy (SEM), and electron beam lithography (EBL) instrumentation. With sub-5 nm patterning performance, Raith instruments are enabling researchers in academic and industry environments to continuously advance their applications in applied nanoscale research and development, as well as production of compound semiconductor components709
StratEdge CorporationStratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services. StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego.412
Vortex Aerospace Design & Labs, IncSince 2004, Vortex Aerospace Design & Labs, Inc. (VADL) has been verifying and aggregating designs for various MPW programs. We are proud to offer this expertise on Global Foundries' Global Solutions Ecosystem. We offer Global Foundries technologies for MPWs and fully dedicated production runs. In addition, VADL provides design, verification, and mask data prep services to assist with your chip design flow.518