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| 3D Glass Solutions, Inc. | 3D Glass Solutions (3DGS) is an innovative RF passive device design and manufacturing company that develops and builds novel, high-frequency 3D components in its brand new, state-of-the-art, 33,000 sq. ft. manufacturing facility. Leveraging the unique properties of our patented APEX® glass-ceramic material, 3DGS technology enables performance not possible with traditional 2D components. | 720 | | Advanced Circuit Engineers LLC | Advanced Circuit Engineers (ACE) provides circuit edit, materials analysis and failure analysis services using FIBs, Dual beam FIB SEMs, TEM, EDS and EELS. | 717 | | Air Force Research Laboratory | AFRL T-CORE Processor
The Air Force Research Laboratory has developed a microprocessor with strong cyber defensive features. The T-CORE processor provides its owner with a continuous guarantee every instruction executed will be from its owner and every instruction pointer is traceable to its owner’s code or is a legitimate return pointer. T-CORE version 1 will be demonstrated running a cyber-attack game where you can compare a commercial processor to the T-CORE. Both processors will be running the same source code and you get to run cyber-attacks against them. | 914 | | Alphacore Inc | Alphacore enables engineers to develop ultra-high performance and ultra-low power microelectronic components and systems with our products and design services.
We develop data converter IP and RF, analog and mixed signal ASIC solutions, as well as image sensors and complete imaging systems. We also offer radiation hardened and radiation tolerant versions of our products.
Our robust designs serve the defense, aerospace, automotive, communications, and scientific instrumentation markets. Let us supply you with state-of-the-art designs to satisfy your product and system needs. | 616 | | Andes Technology Corp. | Andes Technology Corporation is a public listed company with well-established technology and teams to develop innovative high-performance/low-power 32/64-bit processor cores and associated development environment to serve worldwide rapidly growing embedded system applications.
The company delivers the best ultra-low power CPU cores, including its latest RISC-V series with integrated development environment and associated software and hardware solutions for efficient SoC design. The annual volume of Andes-Embedded SoCs has exceeded 3 billion since 2021 and continues to rise. The cumulative volume of Andes-Embedded™ SoCs has reached 10 billion at the end of 2021.
To meet the demanding requirements of today's electronic devices, Andes Technology delivers configurable software/hardware IP and scalable platforms to respond to customers' needs for quality products and faster time-to-market. Andes Technology's comprehensive CPU includes entry-level, mid-range, high-end, extensible and security families to address the full range of embedded electronics products, especially for connected, smart and green applications. The 5-stage pipeline 25-Series (N(X)25F, D25F, A(X)25, A(X)25MP), 27-Series (A(X)27, A(X)27L2, NX27V), and 8-stage in-order superscalar 45-Series (N(X)45, D45, A(X)45, A(X)45MP) families are based on Andes' latest AndeStar™ V5 architecture. The 32-bit cores (N25F/D25F/A25/A25MP/A27/A27L2/N45/D45/A45/A45MP) are compliant with RV32IMAC, and the 64-bit cores (NX25F/AX25/AX25MP/AX27/AX27L2/NX45/AX45/AX45MP) with RV64IMAC instruction sets.
For more information about Andes Technology, please visit http://www.andestech.com | 416 | | Avalanche Technology | The Next Generation MRAM Company
Avalanche Technology, headquartered in Fremont, California, is the world leader in Spin Transfer Torque Magnetic RAM (STT-MRAM) non-volatile memory leveraging perpendicular magnetic tunnel junction (pMTJ) cell structure manufactured on 300mm standard CMOS process.
Backed by more than 300+ granted patents around cell, circuit, and system design leveraging MRAM, our technology and products provide breakthrough speeds, unlimited endurance and non-volatility while reducing power and cost. With such attributes, our technology will serve and exceed our customers’ objectives as a replacement for SRAM, eFlash, and ROM in embedded applications in addition to discrete SRAM, non-volatile SRAM, NOR and DRAM.
With our newly released 1Gb - 8Gb Space Grade STT-MRAMs to further enable the space community with options of parallel interface, dual OSPI and DDR3 to satisfy the growing demand for high-performance non-volatile memory. | 918 | | BAE Systems | BAE Systems, Inc. and its 35,000 people are part of a global defense, aerospace and security company with 89,600 employees worldwide in more than 40 countries.
BAE Systems, Inc. ranks among the top 10 prime contractors to the U.S. Department of Defense and delivers a range of products and services for air, land, sea and space.
Electronic Systems serves defense and commercial markets offering a broad portfolio of vehicle and mission critical electronic systems from electronic warfare to navigation systems, electro-optical sensors, digital engine and flight controls, precision guidance and seeker solutions, next-generation military communications systems and data links, persistent surveillance capabilities, space electronics, and electric drive propulsion systems.
Intelligence & Security serves as a leading systems integrator of solutions and advanced technologies that enable the transformation of data into actionable intelligence and provide large-scale systems engineering, integration, and sustainment services for critical platforms and systems for a diverse customer base ranging from the Department of Defense, to the intelligence community, federal and civilian agencies, and troops deployed around the world.
Platforms & Services serves U.S. and international customers as a leading provider of tracked, wheeled and amphibious armored combat vehicles, naval guns, artillery and missile launching systems, advanced precision strike munitions and ordnance, and delivers services and sustainment activities including naval ship repair and modernization, and the management and operation of government-owned munitions facilities.
BAE Systems employees proudly design, produce, and deliver some of the world’s most advanced, technology-led solutions to protect those who protect us. | 418 | | Battelle | Battelle provides focused expertise and advanced R&D to establish root-of-trust verification to secure our nation's most critical systems. Using our unparalleled expertise and advanced laboratory capabilities, we have developed state-of-the-art trust and assurance tools and techniques to secure military and civilian microelectronics. | 220 | | Bruker Semiconductor | Bruker Semiconductor offers unique Cryogenic Wafer cleaning systems. This DRY Cleaning method is used for particle removal and unwanted process artifacts without damaging fragile patterns. This Dry Cleaning technology allows the user to safely clean wafers with the problems that come from wet clean processing. Used in Semiconductor, MEMS and Photonics applications. Bruker also offer a suite of metrology solutions in AAFM, XRAY and White Light. | 814 | | Cadence | Cadence® technology enables Intelligent System Design™ for electronic chips, boards, and systems used in mission-critical defense systems. We’ll introduce you to the latest tools, methodologies, and support you need for first-pass success and future-proofed electronic systems for use in aerospace and defense applications. With Cadence, you can harness the trusted solutions and tools that the commercial electronics industry has relied on for more than 30 years. | 219 | | CAES | CAES (Cobham Advanced Electronic Solutions) technology pioneers the future and underpins many of the world’s most critical missions. Our radhard microelectronics empower the world’s leading spacecraft: from leading high throughput commercial communications satellites, earth observation satellites, and manned space, to high priority national security missions, deep space exploration to Mars and beyond, and the latest new space constellations. Our RF, microwave and millimeterwave solutions enable missile defense radars and missile seekers, electronic warfare systems that keep warfighters safe, communications systems that keep the world connected, and civil aviation radars that ensure the safety of the flying public. | 819 | | Caspia Technologies | Caspia Technologies offer innovative solutions to ensure end-to-end security and integrity for today’s complex electronics supply chain in servicing the industrial as well as the Government markets. Our solutions include EDA assurance tools, Security IP primitives, and Physical Assurance IC and PCB level tools and methodologies. Caspia Technologies also provides comprehensive training and consulting services. | 915 | | Checkpoint Technologies | Checkpoint Technologies develops and manufactures innovative optical failure analysis tools used by semiconductor manufacturers to improve the speed and reliability of integrated circuits. Our products, which range from OEM components to fully-integrated, end-user solutions, reflect our fundamental commitment to maximizing value by adapting technology to meet specific market needs. | 315 | | Chip Scan, Inc. | Chip Scan is the leading expert in assuring microelectronics designs against contamination by trojans, backdoors and unintentional exploitable vulnerabilities. Our capabilities can quickly and efficiently evaluate ASIC, FPGA and SOC designs, including third party IP for the presence of these advanced threats that are generally undetected by standard V&V. Our tools can investigate stealthy hidden functionality by identifying likely triggers. Chip Scan supports DoD 5200.44 compliance and Zero-Trust requirements by providing means to measure and mitigate and improve supply chain trust. Chip Scan is based out of New York City. | 4 | | Criteria Labs | Dedicated to providing the best RF device and microelectronic engineering solutions possible, Criteria Labs can deliver unique solutions to your complex technical problems, improve your program schedules, and complement you with capabilities not internally available.
Our in-house Engineering Team can deliver comprehensive RF device and microelectronic engineering solutions for high-reliability aerospace, defense, commercial semiconductor, automotive, and medical applications. Our breadth of services remains an important differentiator, no other company in the industry can offer the end-to-end solutions that we can.
We understand that your mission critical program needs are financially and strategically important to your organization, and we take the responsibility to help you achieve your goals very seriously. We also recognize that we can be the very best at what we do and still be great to work with. We strive to be both. | 314 | | Defense Technical Information Center (DTIC) | The Defense Technical Information Center (DTIC) has collected and disseminated GOMACTech conference proceeding papers dating back to 1968. As the DoD’s central authority for collecting, safeguarding, analyzing, and disseminating defense-related scientific and technical (S&T) information, DTIC facilitates innovation across the DoD research and engineering enterprise. Through DTIC’s public website (https://go.usa.gov/xefYZ), publicly released S&T information is available to the public. DTIC’s access-controlled research and engineering hub, the R&E Gateway https://go.usa.gov/xefYX , is the only one-stop source offering access to DoD research, other S&T information, and collaboration with other subject matter experts.
DTIC offers many resources devoted to Microelectronics, including an access-controlled page with conference proceeding papers from previous year’s GOMACTech conferences https://go.usa.gov/xefHC. DTIC also features several specialized pages devoted to microelectronics to highlight key information significant to DoD microelectronics research development (https://go.usa.gov/xefH2). Via its Horizons tool, DTIC delivers capabilities to evaluate completed and ongoing research through spending by program element and Congressional funding data https://go.usa.gov/xefHg. In 2019, DTIC’s Journal of DoD Research and Engineering published a special edition issue consisting of articles developed from GOMACTech conference proceeding papers (Vol 2, Issue 2, Aug. 2019), located at (https://go.usa.gov/xefeU). DTIC also includes support for workspaces for the Microelectronics industry and the DoD to connect via Defense Innovation Marketplace (https://go.usa.gov/xefHZ). | 711 | | DMEA | The DMEA Trusted Access Program, TAPO, provides access to leading edge IC technologies under the multi project wafer and dedicated prototype programs, with engagement models available from standard ASIC to full custom design services.
Through Trusted accreditation, customers have access to suppliers who can support their design, aggregation, foundry, mask manufacturing, post processing, packaging, and assembly requirements. | 415 | | ENGIN-IC, Inc. | ENGIN-IC provides SWaP-C differentiation for companies looking for advanced MMIC and module solutions. | 615 | | Evatec NA | Welcome to the Thin Film Powerhouse
Evatec delivers complete thin film production solutions for Advanced Packaging, Semiconductor, Optoelectronics and Photonics. Choose from our range of batch, cluster and inline platform architectures for deposition of metals, TCOs, piezoelectrics, dielectrics, magnetics and a whole range of compounds. From Power Devices to MEMS and Wireless our team is ready to deliver tailored production solutions according to your process, throughput and fab integration requirements. | 818 | | Extreme Waves | Extreme Waves, San Diego, CA, develops high-performance custom phased-arrays and transceivers for SATCOM, 5G, and point-to-point communication links at 8-110 GHz, including X, Ku and Ka-band SATCOM, Ku-band CDL, and all of the 5G frequencies up to 71 GHz. Its product portfolio also includes low and medium power X, Ku and Ka-band radars (pulsed and FMCW) with multiple phase centers. SiGe and CMOS chip design services and chip design reviews are also available for partners. Its customer list includes medium and large commercial and defense companies in the US, and several federal laboratories. For additional information, please email info@extreme-waves.com | 909 | | FINETECH | Finetech’s high‐accuracy die bonding equipment supports the most precise and complex applications in advanced packaging, die attach and micro assembly. Sub-micron placement is possible with an extensive range of bonding technologies including thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, and Indium. Manual, motorized and automated models provide an equipment migration pathway from R&D and prototyping to production, with a unique capability to run the automated models in manual mode for true flexibility. Quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. | 516 | | Flex Logix Technologies Inc. | Flex Logix is the leading supplier in eFPGAs, EFLX, with more designs, metal stacks and configurations supported. We have been doing eFPGAs for 8 years and can port our technology to TSMC process in just a few months. Once ported, EFLX eFPGAs of any size can be delivered in a few days with available processes.
EFLX eFPGA uses standard cells to build the logic and by leveraging our patented XFLX ® Boundary-less Radix Interconnect we can reduce the interconnect by up to 50% providing area and speed benefits.
Another huge benefit of integrating eFPGAs is to save system power by eliminating redundant interfaces. By integrating the FPGA not only is it right sized by configuring the number of LUTs and DSPs used but eliminates any unused devices and reduces latency.
EFLX eFPGA also is low power with configurations available that have power rails separated for controlling the power granularity.
For high reliability applications eFPGAs can be rad-hardened or instantiated using triple redundancy in any technology required.
Reduce power, add reconfigurability and accelerate your chips with EFLX eFPGAs! | 619 | | GE Research | GE Research is a team of 1,000+ scientists and engineers working across multiple industries including healthcare, energy, aerospace, and defense.
For over 60 years, our Electronics and Sensing division has delivered breakthrough solutions for GE, Government, and Strategic Partners. Let us put our technology and expertise to work for you in areas that include microelectronics, semiconductors, MEMS, photonics, microsystems, and advanced packaging. | 618 | | GlobalFoundries | GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. We are redefining innovation and semiconductor manufacturing by developing feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. As a steadfast partner, with a unique mix of design, development and fabrication services, GF works collaboratively alongside our customers to bring a broad range of innovative products to market. With a global customer base, a talented and diverse workforce and an at-scale manufacturing footprint spanning three continents, GF is delivering a new era of more. | 510 | | Golden Altos Corp. | Golden Altos is a QML provider of assembly services (http://www.goldenaltos.com) and we are located in the heart of the silicon valley (Milpitas, CA). Golden Altos offers complete on-shore, in-house, high-reliability hermetic assembly for both monolithic and hybrid assemblies as well as qualification services for both hermetic and plastic IC’s. We continually strive to deliver the finest products, services and documentation through our own internal system, as well as regular certifications from government agencies. As a small business that has served the commercial, military, and
aerospace industries for over 30 years, Golden Altos understands the importance of putting our customers first because what we do matters. | 214 | | HRL Laboratories | HRL Laboratories is a state-of-the-art research laboratory that focuses on advancing technology in a wide variety of fields including semiconductor technology for military applications. | 912 | | IBM | IBM Consulting focuses on addressing Trusted Foundry clients' key business needs, optimizing their business processes and helping them transform on a global scale. Leveraging years of experience and cross-industry expertise in securing Semiconductor Manufacturing, as a DMEA accredited broker we offer a range of Trusted Foundry security services across many domains, including secure IT systems, design, test, and logistics.
For more than seven decades, IBM Research has defined the future of information technology with more than 3,000 researchers in 12 labs located across six continents. Scientists from IBM Research have produced six Nobel Laureates, two US. Presidential Medal of Freedom, 10 US. National Medals of Technology, five US. National Medals of Science, six Turing Awards, 22 inductees in the US. National Academy of Sciences and 20 inductees into the US. National Inventors Hall of Fame.
As semiconductor technology advances, electronic devices become smaller, faster and more reliable. IBM remains a leader in semiconductor technology, high-performance and high-end systems, storage and cognitive computing, and continues to invest in R&D for advanced semiconductor technology. Together with industry partners, IBM Research is heavily engaged in pushing the limits of chip technology to boost such applications as cloud computing and artificial intelligence. | 421 | | Indiana Integrated Circuits LLC | | 318 | | Infineon Technologies | Infineon Technologies and its subsidiary, International Rectifier HiRel Products, Inc. (IR HiRel), is a leader in high reliability, rad hard power conversion for aerospace and defense, and other ruggedized applications. Our design, operations and quality systems exceed military standards. Infineon offers standard and custom semiconductor-based products specifically designed for HiRel applications where commercial electronics cannot meet the requirements.
Infineon’s solutions include high reliability and rad hard memory, RF, rad hard power MOSFETs and ICs, hybrid DC-DC converters and PCB-based power supplies. Customers globally recognize our HiRel and rad hard portfolio for its excellent performance, reliability, longevity and unparalleled design heritage. | 3 | | Integra Technologies | Integra Technologies LLC, a DMEA Trusted and an employee owned company with locations in Wichita, KS, Silicon Valley, CA, and Albuquerque, NM, is one of the largest semiconductor die prep, assembly, test & qualification facilities in the United States. Integra's operations have been satisfying customers for over 30 years by providing a wide variety of semiconductor services including: Die Prep, Assembly (plastic and ceramic), Test Development, Final Test, Characterization, Wafer Probe, Volume Production Test, Qualification Services (HTOL, HAST, Temp Cycle), DPA, CSAM, Failure Analysis, PEM Qualifications, Up-screening, Counterfeit Detection, Obsolescence Management, and Trusted Processing. Integra has one of the largest and most experienced test engineering organizations offering support for every device technology including FPGA, Microprocessor, ASIC, RF, Mixed Signal, Digital, Linear, Analog, SiP and MCMs. Integra provides 24x7 high or low volume US based manufacturing capacity and has demonstrated industry leading quality and on time delivery performance. Find out more at: https://www.integra-tech.com | 521 | | Intrinsix Corp. | Intrinsix offers IC Design Services and Intellectual Property for advanced electronics. The company leverages its experience with commercial semiconductor companies (complex processor-based digital, mixed signal or RF designs at advanced nodes) into unique solutions for emerging DoD applications. The company, now part of CEVA, Inc. (a major supplier of sensor and connectivity IP), has over 65 employees in the business unit and is based in the U.S. – accredited, trusted, and focused since 1986. | 413 | | JEOL USA, Inc. | Since 1967, JEOL has supplied a complete line of Electron Beam Lithography (EBL) systems. JEOL is the world’s top supplier of EBL systems. Applications range from nano-lithography research to high speed mix and match exposures for communication devices on a variety of III-V and related substrates. We have proven solutions to a variety of challenges, from transparent substrates to DFB Laser applications. We offer unsurpassed technical reliability, on-site application assistance, and service expertise | 509 | | JSTF - Jazz Semicnductor Trusted Foundry | JSTF (a DMEA Accredited company) was created to provide Trusted and ITAR access to all Tower Semiconductor Newport Beach technologies for mil/aero and intelligence communities. Available Tower/Jazz Semi technologies range from 130nm high-speed SiGe and CMOS to 0.5um CMOS and support applications ranging from ROICs to mmWave.
18021 Cowan, Suite J, Irvine, CA 92614
959-291-2649; www.jazztrusted.com | 217 | | Kansas City National Security Campus | The Kansas City National Security Campus provides engineering, manufacturing and operational national security solutions for government organizations as part of its Global Security mission. | 317 | | KBR | KBR Government Solutions ensures mission success for customers on land, at sea, in the air, in space and in cyberspace. We create value and drive innovation by combining engineering, technical and scientific expertise with our full life cycle capabilities, mission knowledge and future-focused technologies. We are known for excelling in complex and extreme environments, and trusted to overcome the nation’s most pressing challenges. KBR is engineering solutions for the needs of today and tomorrow, safely and efficiently. We are the future, designed and delivered. | 812 | | Keyence Corporation of America | KEYENCE strives to develop innovative products to meet the needs of our customers in every industry. With quality standards increasing, KEYENCE’s advanced microscope and measurement systems ensure that our customers are able to meet those requirements. High-resolution imaging, ISO-certified roughness, and 2D/3D measurement is coupled with easy-to-use interfaces for an elevated inspection experience. KEYENCE offers a full range of services: free on-site demonstrations and sample testing, training, after sale support, and short lead times so our customers can improve their processes as quickly as possible. | 708 | | Keysight Technologies | Keysight provides the world’s most advanced, best-in-class electronic test & measurement products. The same world-class technology and engineering enabling these products can also be leveraged into your solution. Visit our booth and see how our high frequency MMICs, and other technologies can work for you! | 806 | | Marvell Government Solutions | Marvell Government Solutions (MGS) is an independent subsidiary of Marvell Semiconductor dedicated to delivering secure custom Application Specific Integrated Circuits (ASIC) solutions to the Aerospace and Defense (A&D) market. We offer a wide range of flexible solutions and services including: Register Transfer Language (RTL) design, synthesis, physical design, IP design, IP integration and licensing, test development, advanced packaging, full turnkey services, and end-to-end supply chain management.
As a fabless semiconductor provider, MGS works with multiple on-shore and off-shore foundries to meet customer requirements. MGS offers access to Marvell’s proven product and IP portfolio by leveraging Marvell Semiconductor’s differentiated solutions across data center, carrier infrastructure, enterprise networking, automotive. Our true leading-edge technology portfolio supports Zero Trust, root of trust, secure oversight, and access to <14nm technologies including 14nm, 5nm and 3nm. | 815 | | Menta eFPGA, Inc. | For ASIC and SoCs designers who need fast, right-the-first time design and fast time to volume, Menta is the proven eFPGA pioneer whose design-adaptive standard cells-based architecture and state-of-the-art tool set provides the highest degree of design customization, best-in-class testability and fastest time-to-volume for SoC design targeting any production node at any foundry.
Menta also provides rad-hard eFPGA IPs in any CMOS technology node - with several proven silicon. | 514 | | Mercury Systems | Mercury Systems is a global commercial technology company serving the aerospace and defense industry. Headquartered in Andover, Mass., we research, develop and manufacture trusted and secure open architecture computer hardware and software products tailored for mission-critical applications, including embedded processing modules and subsystems, microelectronics components, modules and subsystems, avionics mission computers and displays, and rugged edge servers. | 513 | | Metamagnetics, Inc. | U.S. based and veteran owned, Metamagnetics develops and markets advanced RF and microwave solutions to enhance the performance and effectiveness of mission-critical security, surveillance and communication systems. Our unparalleled knowledge of electromagnetism and materials science empowers break-through technologies that can bring significant value to defense and commercial projects. | 414 | | Microchip Technology Inc. | Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. | 913 | | Micross | Micross… The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets. Micross brands include: Micross, SemiDice, Silicon Turnkey Solutions, Advanced Interconnect Technologies, Hi-Rel Components, Component Modification Services, and Die & Wafer Solutions. | 320 | | MIT Lincoln Laboratory | The Lincoln Laboratory Microsystems Prototyping Foundry is a semiconductor research and fabrication facility for design, fabrication, packaging, and test with extensive staff, process, and technology capabilities.
Fabrication and integration capabilities are enabled by our Microelectronics Laboratory, a 200mm wafer processing facility equipped with commercial-class cassette-to-cassette fabrication equipment and professionally staffed 24 hours a day, five days a week. This 90nm-class facility operates full-flow fabrication across a broad range of integrated circuit technologies, including fully depleted silicon-on-insulator CMOS, CCD imagers, superconductor electronics, photonics, MEMs, and microfluidics. | 620 | | Mobile Semiconductor Inc. | About Mobile Semiconductor:
Mobile Semiconductor offers SRAM, ROM and Register File memory compilers optimized for applications requiring small area, ultra-low power, low leakage, and/or ultra-high performance.
Several of the compilers are RHBD (Rad Hard by Design) and are currently in use in space applications.
Mobile Semiconductor’s customers differentiate their products by using our application-optimized memories to meet their high performance and ultra-low power product requirements.
Mobile Semiconductor is 100% U.S. based. | 807 | | Modelithics, Inc. | MODELITHICS® is the industry leader providing highly accurate, scalable measurement-based simulation models, behavioral models, complex equivalent circuit models, and advanced non-linear models for all types of RF & microwave devices, as well as comprehensive measurement services. Modelithics extensive services include capabilities for custom 3D model development, GaN modeling, X-Parameters, load pull and noise measurements.
Modelithics models capture parasitic effects, offering scalable design parameters, such as substrate scaling, pad-and part value scaling, plus adjustable input parameters including bias and temperature for active device models. The advanced features provide for powerful design analysis capability, increasing design accuracy leading to rapid design success. | 1 | | Nano OPS, Inc. | Nano OPS, Inc. provides a patented, highly versatile nanomanufacturing platform for additive manufacturing of electronics (semiconductors) at the nano and micro scale utilizing a variety of materials on any substrate. Nano OPS Fab-In-A-Tool printing equipment delivers a platform to the manufacturers of electronics, displays, MEMS, and sensors a disruptive solution to make high-end products at substantially lower capital and manufacturing costs. Nano OPS is shipping its machine to leading customers in the U.S., Europe, and Asia. Nano OPS recently introduced two new products to enable ultra-low-cost development and manufacturing of IoT, 5G, Edge computing, wearables, and similar future technologies.
Researchers have used the technology to print the following materials for micro and nanoelectronics applications (journal articles are available).
• Conductors: silver, gold, copper, aluminum, tungsten, organic conductors
• Semiconductors: II-VI and III-V semiconductors, organic semiconductors such as C8-BTBT and pentacene.
• Dielectrics: A variety of organic insulators, SiO2, and other inorganic dielectrics.
• Nanomaterials: single and multi-walled Carbon Nanotubes, 2D materials, quantum dots. | 713 | | Nimbis Services, Inc. | Nimbis Services, US-based, is an e-commerce cloud product marketplace connecting communities for design, modeling, simulation, and analytics in the cloud. GOMAC attendees will learn that Nimbis’ Trusted Silicon Stratus (TSS) cloud service was conceived and funded for OSD and is currently the only approved cloud service for DoD microelectronics work. As a neutral cloud services broker, Nimbis’ capabilities provide secure cloud-based communities of interest for libraries, APP workflows, IP and diverse data, uninhibited by existing IT silos or insufficient IT cloud expertise. Please meet Nimbis staff and view collaborative cloud platforms now available for DoD microelectronics and Smart Manufacturing supply chain communities. | 809 | | NOKOMIS | Nokomis is a high growth technology company dedicated to providing advanced technical capability for our customers. Over the last decade our team has developed and delivered state-of-the-art uniquely capable sensors and technology solutions. Founded in 2002, Nokomis is the pre-eminent company in the world in the detection, identification, and geolocation of electronics. Nokomis’ expertise lies in the development and manufacturing of the world’s most sensitive electromagnetic sensors. Our customers use our products for a myriad of applications ranging from cyber intrusion detection and electronic device health monitoring to domestic and military threat tracking. | 813 | | Northrop Grumman Mission Systems | Northrop Grumman is a technology company, focused on global security and human discovery. Our pioneering solutions equip our customers with capabilities they need to connect, advance and protect the U.S. and its allies. Driven by a shared purpose to solve our customers’ toughest problems, our 90,000 employees define possible every day. | 614 | | PacTech USA, Inc. | Pac Tech - Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: Manual & Automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders. SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG or ENEPIG for UBM (solder bumping) or OPM (wirebond). Other services include Electroplating, Laser Solder Jetting, Wafer Level Solder Balling, Re-passivation, RDL, Backmetal, Wafer Thinning, Wafer Dicing, Tape & Reel, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for electroless plating. | 613 | | PALOMAR TECHNOLOGIES, INC. | Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. | 810 | | Photronics, Inc. | For more than 50 years, we have pioneered and delivered the best in photomask manufacturing and technology. Our specialized products deliver world-class performance, and we continue evolving to support leading-edge technologies for both integrated circuits (IC) and flat panel displays (FPD). In fact, no merchant photomask company serves the IC and FPD industries like Photronics. Our global presence, product breadth and technological prowess are unmatched. We invest in state-of-the-art tools and work in partnership with you to ensure we meet all your photomask requirements. | 321 | | Plexus Corp. | Since 1979, Plexus has been partnering with companies around the world to transform their concepts into branded products and deliver them to the market. We’re a global force of over 19,000 team members who draw inspiration from solving your most complex product challenges. At Plexus, we’re dedicated to providing you with a seamless product realization experience with customer service like you’ve never seen in the electronics manufacturing industry.
Plexus is a proven leader in advanced microelectronics manufacturing and assembly solutions. Leveraging over 35 years of technology leadership in design and manufacturing — with proven expertise in high-complexity, high-reliability and harsh environmental products — we are uniquely positioned to design, manufacture and deliver microelectronic products that exceed our customers’ expectations. | 319 | | QP Technologies | QP Technologies is a leading provider of US based prototype and production IC packaging and assembly, wafer processing, substrate design and development services..We leverage our proven technologies developed by our skilled experts to collaborate with our customers to release your products to market in record time..QP Technologies has an extensive portfolio of package types, ceramic, OmPP (QFN, Open molded Plastic Package), OCPP (Transfer mold equivalent, Open Cavity Plastic.. Package) ..Pls visit us at Booth 710 to discuss how we can apply our resources to meet your requirements. | 710 | | QuickLogic Corporation | QuickLogic Corporation (NASDAQ: QUIK) is a publicly traded, US-owned, trusted supplier of FPGA and eFPGA cores with a proven 30+ year track record in delivering millions of units for commercial, ruggedized and mission critical applications. We currently supply programmable logic to all of the top five, and eight of the top ten DoD prime contractors. Our eFPGA cores are used in a variety of existing Radiation Hardened products today. We currently support multiple process nodes at TSMC, GlobalFoundries, SkyWater Technology, Samsung, and UMC. Our Australis eFPGA IP generator leverages foundry standard cell libraries, enabling us to go from concept to tapeout of a customized FPGA/eFPGA for any process node in as little as days. We are the first & only FPGA vendor that has shipped products with 100% open-source FPGA user tools, supporting RTL-to-bitstream for fully transparent and inspectable FPGA user tools. QuickLogic is a member of the DARPA Toolbox Initiative. | 908 | | Raith America, Inc. | We empower the world with reliable nanofabrication solutions and thus help fulfill the immense promise of the nanoscale. We deliver innovative, high-technology instrumentation and exceptional support for industry and government initiatives in compound semiconductor, laser, and quantum devices and circuits, helping them stay at the forefront of production and development. Our instruments include electron beam lithography (EBL), FIB-SEM, and UV laser maskless photolithography solutions, all backed by our talented US-based team of applications, sales, and field service engineers. | 709 | | Rambus | Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com. | 609 | | Riscure | Riscure is a large global security evaluation lab and market leader for Side-Channel and Fault Injection test equipment. Riscure provides security Tools, Services and Training to help customers around the world enhance the resilience of their solutions, protect sensitive information, and speed up the process of development and certification. We challenge the security of embedded systems through our leading test equipment, by using thorough and inventive testing to discover security weaknesses in both hardware and software. | 911 | | Rogers Corporation | Rogers Corporation is a global leader in engineered materials to power, protect and connect our world. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic and elastomeric materials are used in applications for EV/HEV, automotive safety and radar systems, mobile devices, renewable energy, wireless infrastructure, energy-efficient motor drives, industrial equipment and more. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide. | 808 | | SecureFoundry | SecureFoundry is a fast-moving and aggressive technology company focused on creating a commercialization solution for the low-mid volume semiconductor market. We have successfully commercialized anti-tamper microelectronics, post quantum encryption, and various provenance tracking applications and architectures supporting Department of Defense (DoD) and statewide 5G Zones. We are now focused on developing our Multi Ebeam Direct Write Lithography System, for advance nodes, low volumes, and high customization. | 910 | | Siemens | Siemens EDA. The pace of innovation in electronics is constantly accelerating. To enable customers to deliver life-changing innovations faster and become market leaders, we are committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services. | 714 | | Silex Insight | Silex Insight is a recognized market-leading independent supplier of Security IP solutions for embedded systems. The security platforms and solutions from Silex Insight include flexible and high-performance crypto engines which are easy to integrate and an eSecure IP module that provides a complete security solution for all platforms. Development take place at the headquarters near Brussels, Belgium. | 718 | | Silitronics Solutions, Inc. | Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop, and implement cost effective packaging solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in San Jose, CA, the heart of Silicon Valley, and boasts a 10,000+ sq.ft. state of art automated facility with 10K and 1K clean rooms. Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. In house Machine Shop for fast cycle time. | 612 | | SkyWater Technology | SkyWater (NASDAQ: SKYT) is a U.S.-owned semiconductor manufacturer and a DOD-accredited Trusted supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, volume production and advanced packaging solutions in its world-class U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology with diverse categories including mixed-signal CMOS, read-out ICs, rad-hard, power discretes, MEMS, superconducting ICs, photonics, carbon nanotubes and interposers. SkyWater serves growing markets including aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial and IoT. For more information, visit: www.skywatertechnology.com. | 817 | | Spectral Design and Test, Inc. | Spectral Design and Test Inc. is a worldwide leader in specialized embedded memory, based in Somerville, New Jersey. Spectral offers intellectual property (IP) in the form of specialized embedded memories as part of their MemoryIP™ offering. With a broad portfolio of embedded memory technology for AI optimized SRAMs, Low Power IoT memories, radiation hardened by design memories, NVM and other specialized memory architectures such as TCAMs, Spectral is a one stop shop for embedded memory IP. The company’s Memory Development EDA tools also address the needs of library developers & SOC designers. MemoryCanvas™, the flagship memory development product, offers an ease of use and productivity level unmatched in the industry. MemoryTime™ enables designers to model, analyze, characterize and generate integration views for any embedded memory. Additional information on the company can be accessed at http://www.spectral-dt.com. | 608 | | SRI International | SRI International designs and manufactures form, fit, function replacements for obsolete microcircuits. Utilizing a Trusted Wafer Foundry, specialized design and test approaches, we provide QML certified (MIL-PRF-38535) units. Through the Generalized Emulation of Microcircuits (GEM) and the Advanced Microcircuit Emulation (AME) programs, sponsored by DLA, a permanent solution is provided. | 419 | | StratEdge Corporation | StratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards.
StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services.
StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego. | 412 | | Synopsys | Synopsys is ushering in the era of Smart, Secure Everything - where everything is connected and secure. With the world's most advanced technologies for chip design, verification, IP integration, and software security and quality testing, Synopsys enables the DoD, other government agencies, and their partners, to deliver innovative products faster and cheaper while also meetings higher security standards. | 719 | | Tecport Optics, Inc | Tecport is an industry-leading manufacturer of state-of-the-art thin film vacuum deposition systems. Sophisticated systems employ leading edge technology such as IBS, HD Plasma Source, and Reactive Magnetron Sputtering, Ion Plasma DLC, achieving coating characteristic which has never been achieved before. Dedicated to excellence in customer service and technical innovation, Tecport has built a loyal customer base that benefits from its corporate motto, “We serve to serve to serve again". | 2 | | Tenet3 | Tenet 3, LLC (Tenet3) is a system security engineering firm that provides digital engineering solutions to reveal hidden cyber risks in systems, software, and hardware. We provide digital thread SSE models for systems and supply chains – As Designed – As Built – As Operating. We have nationally recognized experts in AI/ML, graph analytics, anti-tamper, and cybersecurity. Our DevSecOps Cloud Team can support secure cloud infrastructure for sensitive data curation and analytics, approved at IL-4, and cloud software and services for end-to-end systems modeling. Our software engineering team uses agile development processes to provide responsive solutions to customer requirements. | 218 | | The Boeing Company | Boeing is the world's largest aerospace company and leading manufacturer of commercial jetliners, defense, space and security systems, and service provider of aftermarket support. As America’s biggest manufacturing exporter, the company supports airlines and U.S. and allied government customers in more than 150 countries. Boeing products and tailored services include commercial and military aircraft, satellites, weapons, electronic and defense systems, launch systems, advanced information and communication systems, and performance-based logistics and training. | 519 | | The MicroElectronics and Security Training (MEST) Center | Premiere microelectronics security training materials offered by leading experts.
More than ever, we observe increasing demand for well-trained cybersecurity workforce in all government agencies, national labs, and industry sectors. Microelectronics security and trust has become an essential and significant component of cybersecurity. With MEST Center, we plan to develop comprehensive training programs in microelectronics design and security.
Distinctive aspects of the MEST program include:
Collaboration between multiple universities.
Establishing an ecosystem of training modules and options to suit the need for diverse government and industry employees.
Strong emphasis on hands-on learning. This includes teaching state-of-the-art computer-aided design tools (CAD) and hands-on hardware design, hacking, and countermeasure tools.
Major courses and certificate programs
Comprehensive coverage of all security topics – from devices, architectures, to integrated circuits, to platforms, and to large systems.
Offering major courses and certificate programs, unique in the nation.
Self-learning kits for hardware and systems security topic available for remote training and busy professionals.
Training material made available on secure cloud, e.g. TSS. | 5 | | The MOSIS Service, ISI, USC | The MOSIS Service offers silicon fabrication services to semiconductor integrated circuit (IC) designers at universities, research organizations, defense and aerospace companies, and commercial design companies for both multiple-project wafer and low volume dedicated wafer projects.
Since its beginning in 1981, MOSIS (“Metal Oxide Semiconductor Implementation Service”) has processed more than 60,000 IC designs, averaging five chips a week.
MOSIS enables IC designers to prototype innovative semiconductor designs within an effective cost structure, offering a range of processes: CMOS FinFET, FD-SOI, Bulk, SiGe, high-voltage BCD, and other specialty processes. MOSIS collaborates with four major foundries—TSMC, GlobalFoundries, Intel Foundry Services, and Samsung Foundry—to offer a range of semiconductor processes from 12nm FinFET to 350nm. | 712 | | Top Talent Search Experts, LLC | TOP TALENT SEARCH EXPERTS, LLC
Helping our clients in the Test and Measurement, Power Electronics, Aerospace, Avionics and Semiconductor industries find the most talented Engineers, Managers, Executives and Technical Sales professionals available in today's competitive marketplace. | 715 | | Tortuga Logic | Tortuga Logic enables comprehensive security verification throughout the entire lifecycle of semiconductor chip development, so organizations can detect and mitigate hardware vulnerabilities before manufacturing. The company’s Radix™ technology adds systematic hardware vulnerability detection and mitigation to existing ASIC, SoC, and FPGA verification methodologies using its innovative information flow analysis technology. | 811 | | Trusted Semiconductor Solutions Inc. | Trusted Semiconductor Solutions provides integrated circuit development services from concept to qualified part delivery leveraging the best-in-class on-shore manufacturing capabilities. Trusted Semiconductor Solutions specializes in IC design, IP development, and high-density package solutions with expertise in radiation hardening for space and strategic applications. | 721 | | Verilock | Verilock has developed an Entropy Extraction Device (EED)technology. We provide silicon IP for a low resource circuitry that enables a near infinite number of responses to input challenges for authentication and/or cryptographic key generation. | 216 | | Vistec Electron Beam | Vistec Electron Beam Gmbh.
As a long-standing equipment supplier, Vistec Electron Beam GmbH provides leading technology solutions for advanced electron-beam lithography. Based on the Variable Shaped Beam (VSB) principle, the electron-beam lithography systems are mainly utilized for semiconductor applications and advanced research as silicon direct write, compound semiconductor, mask making as well as integrated optics and photonics. | 920 | | Vortex Aerospace Design & Labs, Inc | Since 2004, Vortex Aerospace Design & Labs, Inc. (VADL) has been verifying and aggregating designs for various MPW programs. We are proud to offer this expertise on Global Foundries' Global Solutions Ecosystem. We offer Global Foundries technologies for MPWs and fully dedicated production runs. In addition, VADL provides design, verification, and mask data prep services to assist with your chip design flow. | 518 | | Wolfspeed | Wolfspeed is a vertically integrated manufacturer of SiC materials and semiconductors. Wolfspeed’s innovative product families include power-switching devices as well as GaN-on-SiC and LDMOS RF devices targeted for telecom, military and aerospace applications. To learn more, visit wolfspeed.com. | 215 | | X-Celeprint | X-Celeprint licenses micro-transfer printing (MTP) technology, a massively parallel pick-and-place process for the heterogeneous integration of ultra-thin compound semiconductor, silicon and passive components. X-Celeprint is co-located with Micross, which has a Trusted/ITAR-compliant 200mm wafer fab with extensive heterogeneous capabilities, in Research Triangle Park, North Carolina, and Tyndall National Institute in Cork, Ireland. Both facilities have MTP technology in their R&D advanced packaging lines for supporting customers with rapid prototyping. ASM AMICRA offers a high precision, high throughput, fully automatic MTP manufacturing system, and X-FAB offers MTP foundry service. | 820 |
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