GOMACTech 2022 Exhibition
 
Company Company Description: 
Booth number/ref
3D Glass Solutions, Inc.3D Glass Solutions (3DGS) is an innovative RF passive device design and manufacturing company that develops and builds novel, high-frequency 3D components in its brand new, state-of-the-art, 33,000 sq. ft. manufacturing facility. Leveraging the unique properties of our patented APEX® glass-ceramic material, 3DGS technology enables performance not possible with traditional 2D components.720
ACCURATE CIRCUIT ENGINEERINGAccurate Circuit Engineering (ACE) specializes in RF, High Speed, Microwave and Antenna PCB's. ACE has been a recognized leader RF and Microwave for more than a decade and has been a small family owned business for over 36 years. We are flight approved by JPL for RF and Microwave Products, with Antennas on the ISARA and SWOT projects. Both of these resulted in published recognition awards for ACE. We are small volume quick turn experts and offer free DFM, stack up suggestions and material selection during design. We do this at no cost or obligation. The entire ACE team is motivated with one philosophy, Excellent Customer Service and Complete Satisfaction. Our Quality and on time deliveries are held above 98% while our technology is cutting edge making no job too small or too tough. Running behind on your design ? Let ACE make your ideas a reality, faster than the speed of thought !! Sales@ace-pcb.com708
Criteria Labs IncDedicated to providing the best RF space and semiconductor services possible, Criteria Labs can deliver unique solutions to your complex technical problems, improve your project schedules, and complement you with capabilities not internally available. Our in-house Engineering Team can deliver eutectic die attachments, die to shim attachments, chip and wire assemblies, ceramic space qualified packaging, upscreening, RF device screening up to 50 GHz, reliability, and qualification testing solutions where dependability is critical. Our breadth of services remains an important differentiator, no other company in the industry can offer the comprehensive end-to-end solutions that we can. We understand that your RF space and semiconductor projects are financially and strategically important to your organization, and we take the responsibility to help you achieve your goals very seriously. We also recognize that we can be the very best at what we do and still be great to work with. We strive to be both.314
Flex Logix Inc.Flex Logix is the leading supplier in eFPGAs, EFLX, with more designs, metal stacks and configurations supported. We have been doing eFPGAs for 7 years and can port our technology to TSMC process in just a few months. Once ported, EFLX eFPGAs of any size can be delivered in a few days with available processes. EFLX eFPGA uses standard cells to build the logic and by leveraging our patented XFLX ® Boundary-less Radix Interconnect we can reduce the interconnect by up to 50% providing area and speed benefits. Another huge benefit of integrating eFPGAs is to save system power by eliminating redundant interfaces. By integrating the FPGA not only is it right sized by configuring the number of LUTs and DSPs used but eliminates any unused devices and reduces latency. EFLX eFPGA also is low power with configurations available that have power rails separated for controlling the power granularity. For high reliability applications eFPGAs can be rad-hardened or instantiated using triple redundancy in any technology required. Reduce power, add reconfigurability and accelerate your chips with EFLX eFPGAs!619
GLOBALFOUNDRIES510
Hold
IBM421
Integra TechnologiesIntegra Technologies is a global leader in the sourcing, packaging, testing and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability (“Hi-Rel”) applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle - from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, counterfeit detection, DPA and FA service for high-reliability applications. Find out more at: https://www.integra-tech.com521
Intrinsix Corp.413
JEOL USA, Inc.509
Menta eFPGA, Inc.For ASIC and SoCs designers who need fast, right-the-first time design and fast time to volume, Menta is the proven eFPGA pioneer whose design-adaptive standard cells-based architecture and state-of-the-art tool set provides the highest degree of design customization, best-in-class testability and fastest time-to-volume for SoC design targeting any production node at any foundry. Menta also provides rad-hard eFPGA IPs in any CMOS technology node - with several proven silicon.514
Mercury SystemsMercury Systems is a global commercial technology company serving the aerospace and defense industry. Headquartered in Andover, Mass., we research, develop and manufacture trusted and secure open architecture computer hardware and software products tailored for mission-critical applications, including embedded processing modules and subsystems, microelectronics components, modules and subsystems, avionics mission computers and displays, and rugged edge servers.513
MicrossMicross… The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical and industrial markets.320
MIT Lincoln LaboratoryThe MIT Lincoln Laboratory Microelectronics Laboratory is a state-of-the-art semiconductor research and fabrication facility that supports the design, fabrication, and packaging of novel devices.620
PacTech USA, Inc.Pac Tech - Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: Manual & Automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders. SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG or ENEPIG for UBM (solder bumping) or OPM (wirebond). Other services include Electroplating, Laser Solder Jetting, Wafer Level Solder Balling, Re-passivation, RDL, Backmetal, Wafer Thinning, Wafer Dicing, Tape & Reel, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for electroless plating.613
QP TechnologiesQP is a leading provider of prototype and volume IC packages and assembly, wafer processing, and substrate design and development services..We leverage our proven technologies developed by our skilled experts to collaborate with our customers to release your products to market in record time..QP has an extensive portfolio of package types, ceramic, OmPP (QFN, Open molded Plastic Package), OCPP (Transfer mold equivalent, Open Cavity Plastic.. Package) ..Pls visit us at Booth 710 to discuss how we can apply our resources to meet your requirements.710
Raith America, Inc.Raith is a leading precision technology manufacturer for focused ion beam (FIB-SEM) nanofabrication, large area scanning electron microscopy (SEM), and electron beam lithography (EBL) instrumentation. With sub-5 nm patterning performance, Raith instruments are enabling researchers in academic and industry environments to continuously advance their applications in applied nanoscale research and development, as well as production of compound semiconductor components709
StratEdge CorporationStratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services. StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego.412
Trusted Semiconductor Solutions Inc.Trusted Semiconductor Solutions provides integrated circuit development services from concept to qualified part delivery leveraging the best-in-class on-shore manufacturing capabilities. Trusted Semiconductor Solutions specializes in IC design, IP development, and high-density package solutions with expertise in radiation hardening for space and strategic applications.721
Vortex Aerospace Design & Labs, IncSince 2004, Vortex Aerospace Design & Labs, Inc. (VADL) has been verifying and aggregating designs for various MPW programs. We are proud to offer this expertise on Global Foundries' Global Solutions Ecosystem. We offer Global Foundries technologies for MPWs and fully dedicated production runs. In addition, VADL provides design, verification, and mask data prep services to assist with your chip design flow.518