| Booth number/ref |
Company |
Company Description |
| A [ Back to top ] | | 415 | Accurate Circuit Engineering | Accurate Circuit Engineering (ACE) is AS9100, ITAR, Mil-Spec and CMMC L2 Certified manufacturer of high-technology quick turn PCBs, with deliveries in as little as 24 hrs.
ACE has continued to stay on the leading edge of technology offering only the best quality PCBs in the shortest amount of time. ACE also offers Design and Assembly making ACE a full turnkey solution. From Hybrid PTFE to standard blind and buried via constructions, ACE does it all with an emphasis in RF, Microwave and Antennas.
From Hybrid PTFE to stacked HDI blind and buried via constructions, ACE where quality and speed come together | | 105 | AdTech Ceramics | AdTech Ceramics is a fully integrated US manufacturer of alumina and aluminum nitride multilayer co-fired packages, specializing in mission-critical ceramics for challenging environments. Offering prototypes to high volume capabilities. We engineer the finest quality ceramics, making them #STRONGDURABLEPRECISE. ITAR registered * CUI trained * AS9100D * NADCAP Certified * | | 400 | Allied High Tech Products | For over 43 years, Allied High Tech Products has provided quality products for metallographic sample preparation & analysis. Allied designs and manufactures sectioning, mounting, grinding/polishing and milling equipment at their US facilities, and distributes a full range of consumable products. Allied’s equipment is built in-house to specifications that deliver maximum performance and dependability. All equipment carries a 2-year warranty & prompt service or technical help is always available. | | 114 | Alphacore Inc. | | | 522 | Altera Corporation | Altera Corporation is a semiconductor company specializing in programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chip (SoC) FPGAs, and related development tools. Its technologies enable customers to create flexible, high-performance hardware solutions for applications across communications, data centers, industrial automation, aerospace and defense, automotive, and embedded systems | | 414 | AmTECH Microelectronics | AmTECH Microelectronics is a custom microelectronics assembly and packaging services company (U.S. on-shore OSAT), based in Silicon Valley. AmTECH has over 30 years of experience in process development, design for manufacturing (DFM), and on-shore prototype to production. AmTECH’s assembly processes include: flip chip bonding, die bonding, fine and heavy wire bonding, vacuum reflow, silver sintering, dispense and encapsulation, and SMT assembly. Our facility features a fully equipped cleanroom with advanced, state-of-the-art automated equipment. AmTECH is proud to be ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, in compliance with IPC-A-610, and follows MIL-STD-883 workmanship standards. | | 402 | Arteris | Arteris is a leading provider of system IP for the acceleration of system-on-chip (SoC) development across today’s electronic systems | | 314 | Astronics Test Systems | | | 523 | Avalanche Technology | Avalanche Technology is the leader in true Space Grade non-volatile memory, delivering MRAM solutions designed to meet the five essential criteria required for space missions: Survive. Retain. Endure. Commit. Proven.
With an intellectual property portfolio of over 300 patents and applications, Avalanche offers Space-Grade MRAM that is radiation immune, retains data permanently, supports unlimited endurance, commits data instantly, and is backed by proven space and aerospace heritage, including PEMS and QML qualification. Avalanche products are trusted by leading space, defense, and aerospace organizations where failure is not an option. | | B [ Back to top ] | | 408 | BAE Systems | At BAE Systems, our dedication shows in everything we create and deliver to provide a vital advantage to our customers through world-class capabilities across air, land, maritime, space and cyber domains. As a proven partner with a rich legacy of innovation, we are pioneering inventions and technologies to defend our national security, protect our men and women in uniform, and contribute to the prosperity and sustainability of our local communities, our planet, and beyond. | | 403 | Battelle | | | C [ Back to top ] | | 206 | C&D Semiconductor | C&D Semiconductor is a USA based capital equipment supplier. As a customer focused company, systems are built optimized to customer requirements. This can include optimized configurations, foot print and software. Additionally, C&D has the expertise and capability to develop customer specific features or tool sets.
Having a broad international customer base, C&D systems are deployed with a wide range of customers: semiconductor device manufacturers; compound semiconductor device manufacturers; MEMS and LED suppliers; biosensor manufacturers; high volume manufactures; low volume high dollar value manufactures. Wafer sizes range from 2” to 300 mm wafers and wafers on tape frames and HOOPs.
Common applications for C&D products are: photoresist coat & develop; planarized spin coating; metal lift-off; laminate photoresist develop; alloy or low temperature anneal; dice protect layers.
The main product platform is the C&D P9000 which is a cluster type system built around a central wafer handling robot. All of C&D’s process modules can be incorporated into the P9000 due to the flexible design. This enables customers to design systems for optimized performance at the lowest cost-of-ownership. Additionally, C&D continues to support linear track customers with its P8000 product and spare parts for the large installed base of linear tracks. | | 121 | Cadence | Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation from silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at www.cadence.com. | | 614 | CAST | CAST provides digital IP cores that developers use to build FPGA and ASIC systems for defense, aerospace, automotive, industrial, medical, and consumer applications. Our product line features embedded processors (RISC-V, MCUs); security (PQC encryption & SoC solutions); interfaces (TSN, CAN, more); compression (data, image, video); networking (TCP, UDP, eMACs); and peripherals, protocol converters, and many other functions. USA-based and operating for over 30 years, CAST is ISO 9001:2015 certified and supports industry standards such as ISO 26262 and DO 254. CAST has provided a Better IP Experience for many hundreds of organizations, shipping several million product units; visit us at GOMACTech to discuss how we might do the same for you. | | 101 | Checkpoint Technologies | | | 210 | Cofactr | The electronics supply chain infrastructure for critical hardware.
Cofactr secures the electronics supply chain for manufacturers who can’t risk component shortages, compliance gaps, or production delays.
Securing Defense, Aerospace, Semiconductor Manufacturing, Agriculture, and more across hundreds of hardware teams.
Cofactr unites electronic component data, procurement, and component kitting for the most demanding industries. | | 214 | CoolCAD Electronics | CoolCAD Electronics designs and fabricates wide bandgap silicon carbide (SiC) semiconductor transistors and integrated circuits (ICs) for applications in Power Electronics, Green Energy, High-Temperature Electronics and Deep Ultraviolet (UV) Optical Electronics. | | D [ Back to top ] | | 205 | Deca Technologies | With over 10 billion devices in the field, Deca’s flagship M-Series® fan-out and Adaptive Patterning™ technologies have transformed the way the world builds advanced electronic systems.
M-Series provides an ideal heterogeneous integration architecture for chiplets, in both classic Chips First and emerging Chips Last embedded bridge molded interposers. Deca’s Adaptive Patterning technology uniquely compensates for natural variation in embedded die structures allowing continuous scaling to ever higher density without compromises in yield or throughput. After high-speed optical measurement, Adaptive Patterning generates in real-time a bespoke, optimized layout which precisely aligns to each embedded bridge, passive or active device.
The power of Adaptive Patterning is realized through Deca’s Adaptive Patterning Design Kits (APDKs) and AP Studio software integrated with industry leading EDA platforms to provide design templates, tech files, stack-ups, and DRC decks.
As a pure-play technology development, transfer, and licensing company, Deca is the leading independent provider of advanced packaging technology for the semiconductor industry.
Deca’s world class investors, including Infineon, Qualcomm, and ASE provide a strong foundation for continuing innovation and growth. | | 605 | Defense Microelectronics Activity | Defense Microelectronics Activity (DMEA) | | 411 | DLA GEM & AME Programs | For over 35 years, a government-industry partnership between Defense Logistic Agency (DLA), DLA Land and Maritime and SRI International (Princeton, NJ) has maintained and extended the ability to provide a permanent supply of form-fit-function-interface emulated microcircuits after commercial sources are no longer viable. To date, the DLA Generalized Emulation Microcircuit (GEM) program has delivered more than 175,000 MIL-PRF-38535 compliant microcircuits in support of Army, Navy, Air Force and Marine platforms with no change in documentation, BOMs or parts lists. | | E [ Back to top ] | | 515 | ECM Group | ECM USA | ECM manufactures R&D/lab to mass production wafer processing furnace systems for high-tech applications, both horizontal & vertical tube furnaces, for both semiconductor & solar/photovoltaic. Including: batch wafer processing (Atmospheric, LPCVD, Oxidation, PECVD, Diffusion, POCL, Low Pressure Doping, etc…) and single wafer RTP/RTA systems (Ohmic Contact Annealing, RTO, RTCVD, MOCVD, DLI/ALD). Also systems for energy storage, vacuum heat treatment and advanced crystal growth. | | 714 | EPC Space | EPC Space is focused on designing and manufacturing radiation hardened (Rad Hard) GaN-on-silicon transistors and ICs packaged, tested, and qualified for satellite and high-reliability applications. | | 610 | Extreme Waves | Pushing the Boundaries of High-Performance Flat Panel Active Phased Arrays and Transceivers for Communication and Radar Systems | | G [ Back to top ] | | 204 | GenAlpha | AI for Analog | | 102 | General Dynamics Mission Systems, Idaho Scientific | We are embedded security experts. Our proven, easy-to-integrate and low maintenance solutions address government cybersecurity and anti-tamper requirements. Our products address the vulnerabilities in embedded systems, preventing cyber exploitation by allowing an adversary persistent arbitrary code execution and preventing intellectual property theft and exploitation of proprietary firmware and data. | | 301 | Graf Research | Graf Research unleashes innovation by developing ideas into disruptive technologies. Our mission is to perform research, provide services, apply analytics, and create products that enable secure and high-performance embedded and adaptive computing solutions. | | H [ Back to top ] | | 310 | Heidelberg Instruments | Heidelberg Instruments is a global leader in precision direct write lithography, maskless aligners, and nanofabrication systems. Our tools cater to a diverse range of needs, from tabletop solutions to high-end photomask manufacturing equipment. Trusted in 50+ countries for over 40 + years, with 1500+ installations, we specialize in micro- and nanofabrication systems for 2D, 2.5D, and applications like MEMS, advanced packaging, TFT, and more. | | I [ Back to top ] | | 220 | Instec, Inc | Instec is a scientific instrument manufacturer focused on precision thermal and environmental control. Our products are compatible with any optical measurement system and can be equipped with electrical testing setups including electrical probers, all inside a controlled sample environment. Necessary for many applications including spectroscopy, electrochemical analysis, nanotechnology research, and more. | | J [ Back to top ] | | 117 | JEOL USA, Inc | | | 323 | Jmem Tek Inc. | Jmem Tek provides quantum-resilient hardware security IP and chips: JPUF unclonable device identity, JCrypt CAVP-validated ML-KEM/ML-DSA acceleration, JShield side-channel protection, and the JRoot root of trust — all integrated in its PUF-based quantum-safe security chips. | | K [ Back to top ] | | 603 | Kansas City National Security Campus | Kansas City National Security Campus managed by Honeywell FM&T, Global Security Division working with DMEA's TAPO program | | 510 | Kyocera International, Inc. | Kyocera, a global enterprise with annual sales exceeding $15 billion, is a world leader in ceramic packaging and assembly for microelectronic devices. The combination of Kyocera's advanced material technologies, manufacturing processes, and design capabilities allows us to provide quality package and service solutions supporting the needs of diverse customers worldwide. | | L [ Back to top ] | | 211 | Laser Thermal Analysis | | | 723 | Leo Green AI, Inc. | Provider of: TRUSTED FPGA AND ASIC FULL-STACK AI ACCELERATION, BUILT FOR CO-DESIGN
Leo Green AI delivers trusted, full-stack AI acceleration — hardware, compiler, and runtime, designed and owned end-to-end. No third-party technology. No black boxes.
One design runs on FPGAs from any vendor and carries over to custom silicon unchanged, on a single toolchain.
The platform is built for co-development: hardware and models are tuned together against measured results, for accuracy, performance, and power.
It runs today's AI workloads, including reasoning models. | | M [ Back to top ] | | 511 | MACOM | MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. MACOM has achieved certification to the IATF16949 automotive standard, the ISO9001 international quality standard and the ISO14001 environmental management standard. MACOM has more than 70 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operates facilities throughout the United States, Europe, and Asia. | | 615 | Micro-Electronics Security Training Center | MEST (Microelectronics Security Training) is a U.S. Department of Defense–funded education and workforce development initiative dedicated to building a skilled U.S. workforce capable of designing, deploying, and protecting secure and trusted microelectronics across the full hardware–software stack.
MEST brings together leading universities, industry partners, and government stakeholders to provide comprehensive, hands-on training in microelectronics security. The program offers a broad ecosystem of training modules, major courses, micro-certificates, and self-learning resources designed to meet the needs of government and industry professionals at different levels of expertise.
MEST provides training across the entire microelectronics security landscape, from semiconductor devices, integrated circuits, and architectures to platforms and large-scale systems. Its hands-on approach incorporates state-of-the-art computer-aided design (CAD) tools, hardware design, security testing, hacking, and countermeasure techniques.
Through its multi-university collaboration and secure delivery of training materials through nanoHUB, MEST provides flexible learning opportunities for both traditional students and working professionals, including remote and self-paced training options. The program's goal is to strengthen the U.S. microelectronics security workforce and advance the nation's ability to develop and protect trusted microelectronics. | | 115 | Microsanj | Microsanj is a thermal metrology company specializing in high-resolution thermoreflectance imaging for RF, microwave, millimeter-wave, and power semiconductor devices. Founded in 2007, Microsanj has built a worldwide installed base of 100+ customers, from leading chipmakers and defense contractors to top research universities, all relying on SanjSCOPE™ systems to solve thermal problems that conventional tools can't address.
Our systems deliver sub-micron, full-field temperature mapping with transient resolution as fast as 500 picoseconds — making them uniquely suited for GaN HEMTs, MMICs, InP lasers, and other high-frequency devices where localized heating directly impacts performance and reliability. The NOSH-TDTR™ module extends this capability to passive materials characterization, enabling thermal conductivity measurement of substrates, thin films, and multilayer structures critical to advanced RF packaging. | | 203 | Mirabilis Design, Inc. | Mirabilis Design provides VisualSim, a pre-development digital twin platform for complete defense electronics, spanning digital, analog, RF, networking, software, and power. VisualSim models the entire multi-die system—processors, accelerators, memories, caches, die-to-die interconnects, software workloads, power behavior, and the surrounding electronics—so architects can evaluate performance, power, thermal hotspots, failures, and reliability before hardware exists. By connecting workload activity and data movement to power and thermal behavior, VisualSim helps determine how die partitioning, interconnect choice, bandwidth, power density, cooling, and die placement affect package architecture and system performance. This enables packaging, silicon, hardware, software, and systems teams to make tradeoffs together on one executable model rather than optimizing each domain independently. | | 322 | MIT Lincoln Laboratory | The Lincoln Laboratory Microsystems Prototyping Foundry is a semiconductor research and fabrication facility for design, fabrication, packaging, and test with extensive staff, process, and technology capabilities. | | 107 | Mosaic Microsystems | Mosaic Microsystems is a Rochester-based semiconductor packaging company that has developed a production-ready, glass-based platform to address the "physical wall" currently facing the next generation of global connectivity. As the industry moves toward 6G, AI-driven hardware, and advanced Military SatCom, traditional organic substrates are becoming obsolete due to high signal loss, dimensional instability, and thermal mismatches at frequencies above 20 GHz. Mosaic's glass-core technology acts as a "super-highway" for high-frequency signals, reducing data loss by up to 50%. | | 223 | MRSI Mycronic | About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled precision and reliability for R&D, NPI, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, and optical imaging products. We provide the most flexible assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. Our commitment to excellence ensures we meet our customers' needs with meticulous attention to detail and 24/7 field support. For more information visit www.mycronic.com/product-areas/die-bonding/. | | N [ Back to top ] | | 422 | NHanced Semiconductors, Inc | | | 221 | North Carolina State University | The Commercial Leap Ahead for Wide bandgap Semiconductors (CLAWS) Hub is focused on advancing technologies for DoW that have dual-use solutions for civilians. | | 720 | Northrop Grumman | Northrop Grumman designs, manufactures, assembles,
tests and packages millions of microelectronics annually to support next-generation defense and commercial systems in the United States, ensuring the American supply chain is protected and sustainable to strengthen national defense infrastructure. From design, fabrication, to field, the company’s mission-tailored semiconductor solutions serve as the crucial intelligence powering mission success. | | O [ Back to top ] | | 623 | Otava RF | Otava Inc., based in Moorestown, NJ, develops end-to-end technology and radio frequency chips used by advanced 5G and Department of Defense applications. | | P [ Back to top ] | | 622 | PacTech USA, Inc. | PacTech – Packaging Technologies, is a leading provider of laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide. | | 222 | Polar Semiconductor | Polar Semiconductor is a U.S.-owned merchant semiconductor foundry headquartered in Bloomington, Minnesota. With more than 60 years of manufacturing experience and a state-of-the-art 200mm wafer fabrication facility, Polar specializes in analog, power, sensor, and mixed-signal semiconductor technologies. The company provides foundry services, process development, technology transfer, and high-volume manufacturing for customers across aerospace and defense, industrial, automotive, energy, and communications markets. Polar's technology portfolio includes BCD, CMOS, BiCMOS, MOSFET, IGBT, MEMS, and emerging GaN and wide-bandgap semiconductor platforms. As a majority U.S.-owned company with AS9100D-certified operations, automotive-qualified manufacturing systems, and expanding national security infrastructure, Polar is helping strengthen the domestic semiconductor supply chain and accelerate the transition of advanced technologies from research and prototype development into scalable U.S. production. | | 405 | Precision Circuit Technologies | At Precision Circuit Technologies (PCT) we’re heralding a new era of miniaturization and ultra high-density integration (UHDI), ushering in next-generation electronic devices that are significantly smaller, faster, and more functional than ever before. Built on liquid crystal polymer (LCP) substrate, known for its extremely low signal loss tangent (Df) and dielectric constant (Dk), and utilizing our proprietary particle-free liquid metal inks and patented additive fabrication techniques, we create ultra high-density interconnect (UHDI) circuits with unmatched precision, achieving intricate circuit geometries with lines and spaces as small as 6-microns, all while improving signal integrity.
Our technology is cost effective, friendlier to the environment and can reduce circuit dimensions by up to 10X compared to traditional circuit fabrication processes. | | 718 | Presidio Components | US manufacturer of high reliability ceramic capacitors for defense, aerospace, high temperature, telecommunications, space applications. DLA audited, ISO certified. Engineering company that offers COTS as well as design per print capacitors. | | Q [ Back to top ] | | 308 | Qorvo | | | 501 | QP Technologies | QP Technologies is a U.S.-based provider of advanced semiconductor packaging, microelectronic assembly, and wafer preparation services, supporting customers from prototype through production. Our in-house capabilities include flip chip bonding, wire bonding, system-in-package (SiP), chip-on-board (CoB), multichip modules (MCM), wafer dicing, substrate assembly, and custom engineering solutions. Serving the defense, aerospace, medical, industrial, RF, power, and commercial electronics markets, QP Technologies delivers high-reliability manufacturing with rapid turnaround and exceptional quality. As a division of Promex Industries, we help customers accelerate innovation with advanced packaging technologies engineered for demanding applications. | | 311 | QuickLogic Corp. | QuickLogic, a trusted supplier in the Aerospace and Defense markets for nearly three decades, specializes in design of programmable logic devices, embedded FPGA (eFPGA) and FPGA-based products, including Strategic Radiation Hardened (SRH) FPGAs. | | R [ Back to top ] | | 103 | Raith America, Inc. | RAITH is a global market and technology leader in maskless nanofabrication and characterization systems. Its comprehensive portfolio includes electron beam lithography, FIB-SEM systems, laser lithography, and advanced imaging solutions. With over 1,200 systems installed worldwide and serving 10,000+ users, the company enables breakthrough innovations in quantum technologies, photonics, semiconductors, and life sciences. Its solutions bridge the gap between R&D and production, supporting applications in connectivity, mobility, green energy, and healthcare. Headquartered in Germany with global operations including a US-based demonstration and applications center, RAITH combines cutting-edge technology with four decades of expertise to deliver precision nanofabrication tools for both research institutions and industry. | | 401 | Rambus | Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With 36 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs. For more information, visit rambus.com. | | 216 | Raytheon | Raytheon’s Advanced Technology team incubates capabilities that fuel the future of defense. With a focus on cutting-edge components to full-scale solutions, early ideation to production readiness, seabed to space, we shape the systems and solutions that advance how tomorrow’s battles are fought and won. | | 207 | Real Intent | Real Intent provides intent-driven static sign-off EDA software tools to accelerate the shift left in advanced functional verification of digital designs.
Our static sign-off product capabilities include RTL linting, microarchitectural integrity, clock domain crossing, reset domain crossing; DFT, connectivity & glitch, and hardware security. Real Intent products lead the market in performance, capacity, accuracy, and completeness.
More than 50 major semiconductor companies use our products on a worldwide basis, including some of the largest companies developing ICs for mobile, networking, telecommunication and display graphics, among other applications. | | 406 | Red Balloon Security | Red Balloon Security secures your embedded systems with firmware defense, FPGA/SoC assurance, and cyber red teaming capabilities. | | 122 | Reliable MicroSystems | Reliable MicroSystems (Rel-Micro) supports the U.S. military and aerospace industries with design tools and techniques for building integrated circuits for systems where failure in not an option. These circuits are targeted for missions exposed to the effects of natural and man-made radiation – so called “Radiation Hardened” or “Rad-Hard” integrated circuits. While failures can be inconvenient in commercial microelectronics, they can be devastating in life-critical or mission-critical systems. Rel-Micro engineers have developed tools that allow failures to be discovered, and mitigation techniques developed, before the first part is built or deployed. Once vulnerabilities of a technology are known, Rel-Micro engineers also support critical semiconductor infrastructure needs through system-level, circuit-level, and technology-level design solutions. | | S [ Back to top ] | | 108 | Siemens | | | 120 | Silicon Creations | Silicon Creations is a self-funded, leading silicon IP provider with offices in the US and Poland, and sales representation worldwide. The company provides world-class silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance multi-protocol and targeted SerDes and high-speed differential I/Os for diverse applications including smart phones, wearables, consumer devices, processors, network devices, automotive, IoT, and medical devices. Silicon Creations' IP is proven and/or in high-volume mass production in process technologies up to the most advanced available in the industry. | | 315 | Silitronics | ONE-STOP PARTNER FOR ADVANCED SEMICONDUCTOR AND PHOTONICS PACKAGING. GRINDING, DICING, WIRE BONDING, ACTIVE ALIGNMENT, ASSEMBLY, PACKAGING. | | 500 | SkyWater Technology | SkyWater Technology is securing America’s silicon foundation as the largest U.S.-based semiconductor foundry. A trusted partner to both commercial customers and federal defense programs, SkyWater’s Technology as a Service model empowers innovators to bring emerging technologies like quantum computing and next-generation systems from concept to reality. With state-of-the-art facilities in Minnesota, Florida, and Texas, SkyWater specializes in foundational nodes and advanced packaging to support the nation’s critical infrastructure, strengthen supply chain resilience, and ensure long-term U.S. technology leadership. SkyWater is a DMEA-accredited Category 1A Trusted Foundry. To learn more, visit SkywaterTechnology.com. | | 300 | Spectral Design and Test, Inc. | Spectral Design and Test Inc., based in Somerville, New Jersey, is a global leader in specialized embedded memory solutions. Our products cater to the commercial markets, AI/IoT/5G sectors, and the Mil/Aero/DoD industries. Spectral offers a comprehensive range of intellectual property (IP) through our MemoryIP™ portfolio, which includes AI-optimized SRAMs, low-power IoT memories, radiation-hardened by design (RHBD) memories, and other specialized memory architectures like TCAMs. We are your one-stop shop for embedded memory IP. Our Memory Development EDA tools are designed to meet the specific needs of Mil/Aero companies, enabling them to build their own RHBD Memory Compilers. With our flagship product, MemoryCanvas™, developing Memory Compilers is easier and more productive than ever before. Additionally, our MemoryTime™ product allows designers to model, analyze, and characterize embedded memories, generating the most advanced EDA views available. For more information, please visit our website at www.spectral-dt.com. | | 200 | StratEdge Corporation | StratEdge Corporation designs and manufactures a complete line of high-frequency, high-power, high-reliability semiconductor packages operating from DC to 63+ GHz, specializing in packages and mounting tabs for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. StratEdge's molded ceramic packages offer unparalleled reliability, designed to handle high-frequency chips up to 18 GHz, with over 200 standard outlines available, providing a vast array of packaging options. Complementing these, StratEdge's post-fired ceramic packages and copper laminate mounting tabs excel in thermal management for compound semiconductors. The packages provide ultra-low loss performance over a wide range of frequencies, depending on the style and mounting configuration. Many open-tooled designs are available with 50 ohm impedance high-frequency transitions, which provide convenience and ease for packaging high-performance semiconductors. StratEdge has a variety of lids and options for their attachment and offers post assembly services. Markets served include telecom for 5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. Our facility near San Diego, California, is both ITAR registered and ISO 9001:2015 certified. | | 201 | Synopsys | Please use the same as last year | | T [ Back to top ] | | 109 | Tektronix Component Solutions | Tektronix Component Solutions (CSO) is a U.S.-based Outsourced Semiconductor Assembly and Test (OSAT) provider that leverages Tektronix’s long heritage in test and measurement to deliver semiconductor packaging, assembly, and test services. It offers end-to-end solutions including wafer test, package assembly, package test, reliability analysis, failure analysis, and supply chain support for complex microelectronics programs. The business specializes in low-volume, high-reliability applications serving industries such as defense, space, industrial, medical, and select automotive markets where quality and compliance are critical. CSO operates from Beaverton, Oregon, with ITAR registration, DMEA Category 1A Trusted Supplier status, and advanced cleanroom facilities designed for mission-critical semiconductor manufacturing and test. Its key differentiator is deep test expertise combined with collaborative engineering support, helping customers reduce risk, improve yield, and accelerate product deployment. | | 423 | Trusted Semiconductor Solutions Inc. | Trusted Semiconductor Solutions (TSS) delivers high-reliability microelectronics for dual-use applications. We provide domestic design of semiconductors, high-density packages, and board products that are fabricated with our state-of-the-art manufacturing partners. TSS on-premise production test includes electrical, functional, reliability, and part qualification and our secure product storefront enables reuse of technology specifically developed for the US government. | | 209 | Trusted Strategic Solutions, LLC | | | 119 | Trymax USA | Trymax Semiconductor specializes in designing and manufacturing innovative plasma and UV based systems used in fabrication of integrated circuits. | | TTM Technologies | TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, RF components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including PCBs and substrates. TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com. | | U [ Back to top ] | | 514 | UF | Florida Semiconductor Institute | The Florida Semiconductor Institute’s mission is to drive innovation and technological advancement by (1) executing high-impact research and development programs, (2) educating and training the next generation of talent through expanded workforce pipelines, and (3) coordinating our statewide semiconductor ecosystem. We foster collaboration across academia, industry, non-profits, and government to strengthen Florida’s vibrant semiconductor industry. |
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