| Booth number/ref |
Company |
Company Description |
| A [ Back to top ] | | 322 | AARD Technology LLC | AARD Technology is the North American representative for scia Systems GmbH, a German supplier specialized in plasma and ion beam process equipment. We offer systems for coating, etching, and trimming for the MEMS, microelectronics, and optics industries for high volume manufacturers and R&D. Expert technical support ensures high volume manufacturers enjoy maximum uptime. | | 601 | ACCURATE CIRCUIT ENGINEERING | Accurate Circuit Engineering (ACE) is an AS9100, ITAR and Mil-Spec Certified manufacturer of high-technology Quick turn PCBs. Experts in RF, Microwave, Antenna and Hybrid constructions. With deliveries in as little as 24 hours, no one is faster. ACE is a small business and JPL flight approved and Awarded. ACE has continued to stay on the leading edge of technology offering only the best quality PCBs in the shortest amount of time. We also offer design and assembly making ACE a full turnkey solution. | | 514 | AdTech Ceramics | AdTech Ceramics is a fully integrated US manufacturer of alumina and aluminum nitride multilayer co-fired product. Products include metal to ceramic assemblies, QFN, PGA, and BGA packages. AdTech Ceramics specializes in mission-critical ceramics for challenging environments. Our 150,000 sq ft facility has the capacity to support prototyping to high volume requirements. We engineer the finest quality ceramics, making them #STRONGDURABLEPRECISE. * ITAR registered * CUI trained * AS9100D * NADCAP Certified | | 408 | AEM | AEM is a manufacturer of circuit protection, semiconductors and HF to mmWave Components for commercial to aerospace and defense applications. | | 123 | AmTECH Microelectronics | AmTECH Microelectronics is a contract manufacturing company, located in Silicon Valley, that specializes in complex microelectronics, advanced packaging, and SMT assembly. AmTECH's services include; Die Bonding, Flip Chip (C4), Thermocompression Bonding, Eutectic Die Bonding, Wire Bonding, Heavy Wire Bonding, Ribbon Bonding, Silver Sintering, Encapsulation, etc. The headquarters features a state-of-the-art clean room with equipment being added on a regular basis to help support leading-edge product design and manufacturing. AmTECH has been in business for over 30 years and has a strong team of engineers and management. The company is a proud service provider of prototype to medium volume on-shore manufacturing. | | 101 | Analog Devices | Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. | | 223 | Astronics Test Systems | Astronics Test Systems ensures optimal performance of mission critical systems through innovative test solutions. Leveraging 60 years’ experience, we offer automatic test expertise to electronics manufacturers in aerospace, military, mass transit, urgent communications, and space industries. Our test solutions ensure the world’s most advanced electronics perform as designed, every time. | | B [ Back to top ] | | 309 | BAE Systems | At BAE Systems, our dedication shows in everything we do to provide our customers world-class capabilities across air, land, maritime, space and cyber domains. We’re pioneering inventions to defend our national security, protect our men and women in uniform, and sustain the prosperity of our communities and our planet. | | C [ Back to top ] | | 200 | Cadence | | | 310 | CAST | CAST develops, sells, and supports digital silicon IP Cores for ASICs or FPGAs. Electronic system designers use IP from CAST to shorten development time and lower production risk in the automotive, industrial, defense, aerospace, consumer, security, and other markets. Founded in 1993 and with a worldwide footprint, CAST has helped thousands of companies gain a competitive edge and successfully ship billions of product units. | | 115 | Checkpoint Technologies | Checkpoint Technologies designs and manufactures Laser Scanning Microscopes and Photon Emission Microscopes for semiconductor device physics analytics/failure analysis. Checkpoint Technologies InfraScan™ LSM/PEM Microscope product line includes laser probing, Dual-Beam LTM-S probing, visible laser probing, waveform acquisition, frequency mapping, photon emission, lock-in TIVA / OBIRCH, SIL technologies, Dual SIL Systems, FemtoSecond Pulsed Laser stimulus, 2-photon LADA, TR-LADA, and pulsed laser probing – to reflect our fundamental commitment to adapting technology to meet customer specific needs within the field of semiconductor failure analysis and fault isolation. | | 517 | Chip Scan, Inc. | Chip Scan, based in New York City, is a provider of microelectronics assurance. Our specialty areas include cyber threat defense, microelectronics reverse engineering, space systems, and defending operational technologies. Chip Scan is accredited by the DMEA as a Category 1A Microelectronics Trusted Source. Chip Scan is also an awardee in the Anti-Tamper Executive Agent program for protection of critical program information. Our capabilities have been used to assure commercial and government systems, and our products are implemented and/or operational in commercial and military systems. Chip Scan also has strong core competencies in machine learning/AI driven reverse engineering, the recovery of critical design information for DMSMS and the hardening of systems for Anti-Tamper. | | 411 | CoolCAD Electronics | CoolCAD Electronics designs and fabricates wide bandgap silicon carbide (SiC) semiconductor transistors and integrated circuits (ICs) for applications in Power Electronics, Green Energy, High-Temperature Electronics and Deep Ultraviolet (UV) Optical Electronics. | | 511 | Cycuity | | | D [ Back to top ] | | 518 | DMEA TAPO | | | E [ Back to top ] | | 122 | Edaptive Computing, Inc. (ECI) | Edaptive Computing, Inc. (ECI) provides innovative solutions to optimize, automate and integrate complex processes and systems. At GOMACTech, ECI is demonstrating PCBAT solution that provides the capability to automatically generate a BOM from a PCB image. | | 400 | Extreme Waves | | | F [ Back to top ] | | 501 | FINETECH | Finetech manufactures and supplies sub-micron accuracy die bonders for die attach, advanced packaging, and micro assembly applications. Manual, semi-automatic motorized, and automated models provide a prototype to production pathway. High process flexibility within one platform allows a wide range of bonding technologies: thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium, and precision vacuum die bonding. Application areas covered include optical packages, sensors, si photonics, micro LEDs, Cu pillar, flip chip, chip-on-glass, chip-on-flex, package on package, MCM, MEMs and more. Finetech also offers precision dispensers and advanced rework systems for today's challenging applications. The extensive process knowledge of Finetech’s engineering team significantly enhances the value of our solution offering. In an industry where "one size" does not fit all, Finetech engineers collaborate closely with customers to devise customized solutions for their specific applications. | | 323 | Frontgrade | | | G [ Back to top ] | | 102 | GlobalFoundries | | | 304 | Graf Research Corp. | Graf Research® unleashes innovation by developing ideas into disruptive technologies. The mission of Graf Research is to perform research, provide services, apply analytics, and create products that enable secure and high-performance embedded and adaptive computing solutions. Graf Research® Corporation produces the Enverite® EDA suite, assurance tools for security and functional safety. The Enverite® EDA suite contains features that provide verification and auditing of FPGA build flows. Enverite® PV-Bit® verification evaluates the equivalence of an FPGA Bitstream and its physical netlist. Enverite® Trace® archiver creates and verifies a tamper-evident auditable digital thread as a design traverses the build flow. Enverite® Retrace® auditor authenticates and verifies integrity of a Trace® digital thread and enables automated reproduction of the traced build. | | H [ Back to top ] | | 714 | Honeywell Aerospace Technologies | | | I [ Back to top ] | | 614 | IBM | | | 415 | Idaho Scientific | Idaho Scientific is a specialized embedded security firm with a proven track record of solving the hardest cybersecurity, supply chain integrity and anti-tamper problems with novel and scalable solutions. We have completed projects for national labs, federal research centers, the Pentagon and dozens of companies. The company licenses its crypto, Root of Trust, Extension of Trust and secure processing technology to ensure systems are built upon a trusted and secure foundation. | | 616 | IEEE Computer Society | IEEE CS is the trusted organization dedicated to engaging the engineers, scientists, academia, and industry professionals from across the globe driving continued advancements in computer science and technology. | | 214 | Instec, Inc. | Instec is a scientific instrument manufacturer focused on precision thermal and environmental control. Our products are compatible with virtually any optical measurement system and can be equipped with electrical testing features including electrical probers, all inside a controlled sample environment. Capabilities include DC probing from -190°C to 1000ׄ°C, environmental control, Hall effect compatibility, fully custom tools, and unique RF probing features for 600°C+. Necessary for many applications including spectroscopy, electrochemical analysis, nanotechnology research, and more. | | 422 | Integra Technologies, Inc. | Integra Technologies is a global leader in the sourcing, packaging, testing and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability (“Hi-Rel”) applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle - from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high-reliability applications. Find out more at: https://www.integra-tech.com | | 109 | ISI | ISI specializes in the development of microelectronic modules with a particular focus on miniaturization and ruggedization of complex assemblies. Our comprehensive design and manufacturing capabilities enable rapid solutions for high-reliability applications, including the integration of smart sensors and the development of systems-in-package. ISI is a one-stop-shop for microelectronic module development with fast-turn prototyping and mid-volume production at our US-based, ITAR-registered manufacturing facility. | | J [ Back to top ] | | 315 | JEOL USA, Inc. | | | 320 | JSTF - Jazz Semiconductor Trusted Foundry | JSTF (a DMEA Accredited company) was created to provide Trusted and ITAR access to all Tower Semiconductor Newport Beach technologies for mil/aero and intelligence communities. Available Tower/Jazz Semi technologies range from 130nm high-speed SiGe and CMOS to 0.5um CMOS and support applications ranging from ROICs to mmWave. ITAR runs in Japan for 45nm and 65nm technologies are available. 18021 Cowan, Suite J, Irvine, CA 92614 949-361-3519 | | K [ Back to top ] | | 519 | Kansas City National Security Campus | | | 300 | Keysight | At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com. | | 406 | Keysight Riscure Security Solutions | Riscure Security Solutions by Keysight evaluates the security of software, chip technology and embedded/connected devices that are meant to operate securely in any environment. Riscure Security Solutions is an international market leader in providing test equipment for side channel and fault injection robustness of chip technology. Riscure’s equipment is used by manufacturers, government agencies and security test laboratories around the world. | | 710 | Knowles Precision Devices | Knowles Precision Devices has more than 40 years of experience developing RF and microwave components that meet the rigorous requirements for a variety of military, aerospace, telecommunications and industrial markets. Whether you need a catalogue part, build to print services or custom components, Knowles performs special life testing, sectioning, and additional electrical measurements to meet the MIL standards aerospace and defence require.
Our filters offer stable performance over a wide frequency range, from DC to 67+ GHz, and are rigorously tested to ensure the highest standards. Plus, our SMD components enable streamlined assembly for easy addition to your manufacturing process.
Our products are worldwide in use in the most advanced military and aerospace instrumentation and communication systems. A wide range of subsea, air and space navigation, communication and detection systems rely on the superior technology and performance of our filters. | | L [ Back to top ] | | 516 | Laser Thermal Analysis | At Laser Thermal, we’re committed to simplifying and enhancing the way thermal measurements are made. Leveraging cutting-edge technology, our instruments deliver fast, precise assessments of material thermal properties, enabling our customers to gain deeper product and material insights. Based in Charlottesville, Virginia, Laser Thermal is at the forefront of optical thermal measurements, spanning from nanometers to bulk materials. We’re excited to introduce our latest innovation, the "TOPS" thermal conductivity tool. This groundbreaking instrument measures thermal conductivity across solids, liquids, pastes, and gels, all in one instrument, with ease and speed, providing direct, reliable results in under one minute. TOPS is versatile, ideal for applications in microelectronics packaging, bulk materials, ceramics, thermal interface materials (TIMs), batteries, and advanced materials like thermal barrier coatings (TBCs). Laser Thermal is dedicated to meeting your needs through both contract testing and tool sales, ensuring you have the best solutions for your thermal measurement challenges. | | 615 | LeWiz Communications, Inc | LeWiz is a government contractor specializes in rad-hard chips and IP cores supporting trusted deep nanometer silicon processes and aerospace applications. Provides hardware/software solutions to target high performance computing, time-critical networking (wired, wireless) and eFPGA areas. | | M [ Back to top ] | | 211 | MACOM | MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. MACOM has achieved certification to the IATF16949 automotive standard, the AS9100D aerospace standard, the ISO9001 international quality standard and the ISO14001 environmental management standard. MACOM operates facilities across the United States, Europe, Asia and is headquartered in Lowell, Massachusetts. | | 423 | Menta eFPGA Inc. | Menta eFPGA Inc. is the worldwide leader of disruptive reprogrammable eFPGA IPs for ASICs and SoCs designers who need power efficient and right-the-first time design for quick volume production. The company introduced the world’s first 100% Standard Cell eFPGA IP in 2015 and has been providing the only eFPGA Soft IP available today in the market since 2021 to its customers. Menta’s eFPGA IP technology has been licensed to Trusted Semiconductor Solutions to deliver the best system designs on any CMOS process technology. The resulting eFPGA IP solution, production proven, is highly efficient, adaptive, and incorporates optional embedded custom blocks, memory, and adaptable DSPs. The design adaptive eFPGA IP is available as a Soft RTL IP or as a Hard GDSII IP, in rad-hard or non rad-hard version. Menta eFPGA Inc. products allow integrated circuits to be reconfigured at will, post-production. For more information about our products and services, visit www.menta-efpga.com | | 307 | Mercury Systems | Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today’s most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. | | 205 | Micropac Industries, Inc. | Micropac Industries manufactures microelectronic and optoelectronic
components and modules for the hi-rel industrial, medical, military, aerospace and
space markets. Certified to MIL-PRF-19500, MIL-PRF-38534, and AS9100, Micropac
offers both standard and custom products including optocouplers, LEDs and Displays,
Proximity and Hall Effect sensors, solid state relays and power controllers, and multichip modules. | | 111 | Microsanj | Microsanj manufactures high-sensitivity, high-spatial, fast-transient thermal imaging analysis systems for materials research, chip characterization and validation, and failure analysis. | | 522 | Micross Components | Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and the most comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 45 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. | | 414 | MIT Lincoln Laboratory | The Microelectronics Laboratory is a state-of-the-art semiconductor research and fabrication facility that supports the design, fabrication, and packaging of novel devices. | | 701 | MITRE | We apply systems thinking across government, industry, and academia to solve whole-of-nation challenges. | | 622 | Mosaic Microsystems | Mosaic is a leading domestic provider of glass advanced packaging for microelectronics. Mosaic's glass substrates and interposers address evolving trends, offering increased interconnect density compared to organic interposers and with lower loss than silicon. Moreover, the burgeoning innovations in AI, chiplets, and heterogeneous integration are catalyzing a revolution in advanced semiconductor packaging. Mosaic's glass, characterized by its smooth surface enabling finer feature patterning and smaller vias, empowers designers to optimize performance, minimize power consumption, and enhance design flexibility. | | 504 | MOSIS 2.0 | California DREAMS | USC/ISI | Led by the University of Southern California Information Sciences Institute (USC/ISI), the Defense Ready Electronics and Microdevices Superhub (DREAMS) is one of eight regional innovation hubs established under the Department of Defense Microelectronics Commons Program. This strategic initiative is funded by the CHIPS and Sciences Act of 2022 to develop onshore microelectronics hardware prototyping.
DREAMS unites academic and commercial organizations across Southern California and our partners across the United States with three goals: maturation of advanced RF technologies for rapid prototyping, lab-to-fab transition of semiconductor technologies and training the next-generation of engineers in advanced RF and microelectronics technologies.
The pioneering USC/ISI MOSIS Multi Project Wafer (MPW) fabrication services is at the core of DREAMS. MOSIS is a transformative service that has streamlined the end-to-end prototyping of microchips for educational, commercial and national security applications for over 40 years. MOSIS 2.0 connects customers to an extensive network of state-of-the-art nanofab and foundry services, accelerating the use of advanced process and prototyping technologies within the DREAMS hub, and reducing barriers to innovation. | | 715 | MRSI Mycronic | MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. | | N [ Back to top ] | | 518 | Nano OPS, Inc. | | | 503 | Nimbis Services, Inc. | Nimbis Services is the technology-transition engine for U.S excellence. We support the full trusted and assured technology-transition lifecycle, from research and development to acquisition, maintenance, and sustainment.
The Nimbis Trusted Stratus is a dual-use Modeling, Simulation, and Analysis (MS&A) platform accelerating the transition of microelectronics, manufacturing, and aerospace technologies. Our platform's unique digital-twin capabilities supports radiation effects analysis, thermal analysis, and hardware-software co-verification, and more.
Over the past 16 years, Nimbis has launched and implemented numerous projects and prototypes for the DoD and supported over 300 projects and 150 organizations. We are deeply experienced in the underlying cloud and on-prem high-performance computing, data, and networking infrastructures that support MS&A and digital engineering. | | 405 | NSA Cybersecurity Collaboration Center | The NSA Cybersecurity Collaboration Center is providing DoD small and medium sized companies free cybersecurity solutions to harness their networks. These are designed to help defend against nation-state threats that are targeting DoD entities | | O [ Back to top ] | | 107 | Omni Design Technologies | Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores, from 28nm down through advanced FinFET nodes, which enable differentiated system-on-chip (SoC), in applications ranging from 5G, wireline and optical communications, LiDAR, radar, automotive networking, AI, image sensors, and the internet-of-things (IoT). Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few MSPS to more than 100 GSPS sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins-Colorado, Bangalore-India, Hyderabad-India, Dublin-Ireland, Boston-Massachusetts. | | 722 | onsemi | | | P [ Back to top ] | | 314 | PacTech USA, Inc. | PacTech-Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc., Silicon Valley, USA and PacTech ASIA Sdn., Bhd., Penang, Malaysia.
The equipment product line consists of solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50).
Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.
The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing, chip singulation, tape & reel services. | | 110 | Palomar Technologies | Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assemblies used in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for specialty OSAT/process development, and Customer Support services. Palomar delivers improved production quality and yield, reduced assembly times, and rapid ROI. | | 321 | Photronics, Inc. | | | 402 | PQShield | Post Quantum Crypto Hardware, Software and Security Solutions | | 711 | Precision Circuit Technologies | At Precision Circuit Technology (PCT) we’re heralding a new era of miniaturization and ultra high-density integration (UHDI), ushering in next-generation electronic devices that are significantly smaller, faster, and more functional than ever before. Built on liquid crystal polymer (LCP) substrate, known for its extremely low signal loss tangent (Df) and dielectric constant (Dk), and utilizing our proprietary particle-free liquid metal inks and patented additive fabrication techniques, we create ultra high-density interconnect (UHDI) circuits with unmatched precision, achieving intricate circuit geometries with lines and spaces as small as 6-microns, all while improving signal integrity.
Our technology is cost effective, friendlier to the environment and can reduce circuit dimensions by up to 10X compared to traditional circuit fabrication processes. | | Q [ Back to top ] | | 203 | Qorvo | Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet. | | 201 | QP Technologies | QP Technologies (formerly Quik-Pak) is a leading provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services and our service offerings enable our customers to target a range of end markets, including commercial, RF, power, industrial, automotive, medical and mil-aero. We leverage proven technologies developed by our skilled experts, and we work closely with you to get your products to market quickly and in high volume. Our in-depth and unique industry knowledge, combined with the personal relationship we create with you, means you can count on us to be your trusted adviser and partner. | | 306 | QuickLogic Corp. | QuickLogic, a trusted supplier in the Aerospace and Defense markets for nearly three decades, specializes in design of programmable logic devices, embedded FPGA (eFPGA) and FPGA-based products, including Strategic Radiation Hardened (SRH) FPGAs. Our low-power, production-proven eFPGA enables in-field fast reconfiguration of ASICs and SoCs, facilitating over-the-air updates for evolving needs. Our 100% open-source tools offer Mil/Aero/Defense contractors complete toolchain visibility and long-term control, which secures critical intellectual property and ensures future support. QuickLogic's dedication to innovation within the defense and aerospace community reinforces its role as a leader in trusted, secure, SRH, and fast reconfigurable computing technology for defense applications. quicklogic.com | | R [ Back to top ] | | 112 | Raith America, Inc. | RAITH is the global market and technology leader for maskless nanofabrication and characterization systems and solutions, enabling customers in industrial and scientific settings to drive innovation and device production all around the world. With a broad range of technologies and many years of experience, we enable a wide variety of applications of the digital future – including connectivity, mobility, green energy, and healthcare. Our unique combination of high-precision writing and imaging tools creates efficient solutions for research and industry | | 409 | Rambus | Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com. | | 723 | Raytheon | | | 407 | Red Balloon Security | Red Balloon Security is a leading security provider and research firm committed to defending embedded devices across a range of critical industries and shaping the future of the embedded security industry. Our expert team has pioneered foundational technologies, such as Symbiote and OFRAK, that help secure millions of embedded devices currently in service. Today, we continue to research, develop, and commercialize new capabilities to protect embedded systems manufactured globally. Additionally, our R&D team consists of world-class researchers and developers who publish seminal research papers in the fields of embedded security and intrusion detection. Red Balloon has led research activities funded by the U.S. Government including DARPA, Department of Homeland Security, Air Force, and Navy. | | S [ Back to top ] | | 611 | S-Cubed | Comprised of a team of accomplished engineers and entrepreneurs, S-Cubed has a long history of designing and manufacturing innovative equipment for semiconductor lithography and allied industries. Our tools are deployed in fabs and labs throughout the world and are fully supported by our global service capability. The key advantage that S-Cubed holds over other wafer processing equipment manufacturers is that our modular architecture approach allows us to build exactly the machine you need for your throughput and wafer processing requirements. | | 305 | Secure Micro Technologies, LLC | Secure Micro Technologies offers a full range of solutions for secure, trusted and privacy-preserving services computing systems and applications including advanced cryptographic solutions, digital auditing, logging, and forensics, secure data storage and legacy systems retrofitting, among others. | | 419 | Shibuya Corporation | Shibuya Corporation is a leading provider of advanced semiconductor manufacturing solutions, committed to driving innovation across the industry. Our portfolio features cutting-edge equipment, including solder ball mounters, flip chip bonders, and automated systems designed to meet the needs of next-generation packaging technologies. With decades of engineering expertise, we support a wide range of applications, from photonics to integrated circuit packaging, ensuring precision, speed, and reliability. | | 505 | Siemens EDA | | | 121 | SiFive | As the pioneers who introduced RISC-V to the world, SiFive is transforming the future of compute by bringing the limitless potential of RISC-V to the highest performance and most data-intensive applications in the world. SiFive’s unrivaled compute platforms have enabled leading technology companies around the world to innovate, optimize and deliver the most advanced solutions of tomorrow across every market segment of chip design, including artificial intelligence, machine learning, automotive, data center, mobile, and consumer. With SiFive, the future of RISC-V has no limits. | | 210 | Silicon Assurance | Silicon Assurance is a hardware security startup committed to pioneering EDA software technologies that excel in detecting, assessing, and mitigating security vulnerabilities in silicon chips designed by semiconductor and system companies. The distinctive feature of these technologies lies in their capacity to recognize threats before the critical chip fabrication stage. The company is a spinoff from the University of Florida and has been operational since 2021. The company has secured multiple funding rounds from America's Seed Funds, Florida High Tech Corridor, and forged partnerships with renowned entities. | | 120 | Silitronics | Silitronics offers IC package design, substrate fabrication, process development and assembly services. We are the only company to provide fully automated active alignment for Silicon Photonics, FAU design + fabrication and co-package optical assembly for AI/ML, Cloud, LiDAR and Silicon Photonics customers. Silitronics has fully automated equipment in a clean room 10K and 1K with ISO9001, ISO13485, ITAR and Mil-Std883 quality controls. Silitronics team has expertise to innovate, develop, and implement cost effective design and assembly solutions from concepts to finished products.
Our key differentiated services are complicated process development and full turn-key services. Many of the NPI are so advanced that there is no precedence and does not fit in a standard assembly. Often the design rules have to be pushed beyond its limit. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well planned Design of Experiments (DOE) and investments in new equipment. Silitronics customer are top tier hyper scalers and leading start-ups in Chiplets Heterogeneous Integration, Silicon Photonics, COB, MEMS sensors, LiDAR, AR/VR, and Defense applications. Silitronics team has 100+ man years of R&D experience.
For any questions: call at 408-605-1148 or email to:sales@silitronics.com. | | 401 | SkyWater Technology | SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, volume production and heterogeneous integration solutions in its U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology within diverse categories including mixed-signal CMOS, read-out ICs, rad-hard ICs, MEMS, superconducting ICs, photonics and advanced packaging. SkyWater serves the growing markets of aerospace & defense, automotive, biomedical, industrial and quantum computing. For more information, visit: www.skywatertechnology.com. | | 500 | Spectral Design and Test, Inc. | Spectral Design and Test Inc. is a worldwide leader in specialized embedded memory, based in Somerville, New Jersey. Our products support the Commercial markets, AI/IoT/5G, and the Mil/Aero/DoD markets. Spectral offers intellectual property (IP) in the form of specialized embedded memories as part of their MemoryIP™ offering. With a broad portfolio of embedded memory technology for AI optimized SRAMs, Low Power IoT memories, radiation hardened by design memories (RHBD), and other specialized memory architectures such as TCAMs, Spectral is a one stop shop for embedded memory IP. The company’s Memory Development EDA tools address the needs of Mil/Aero Companies to build their own RHBD Memory Compilers. Using MemoryCanvas™, the flagship memory development product, Memory Compilers can be developed with the ease of use and productivity level unmatched in the industry. The MemoryTime™ product enables designers to model, analyze and characterize embedded memories and generate the most advanced EDA views. Additional information on the company can be accessed at http://www.spectral-dt.com. | | 515 | SRI International | SRI International in Princeton, NJ (formerly Sarnoff Corporation), is the prime contractor for the DLA’s Generalized Emulation of Microcircuits (GEM) and Advanced Microcircuit Emulation (AME) Programs. The Emulation Programs provide a continuing source of Form, Fit, Function, and Interface replacements for non-procurable microcircuits. | | 623 | StratEdge Corporation | StratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards.
StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services.
StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego. | | 301 | Synopsys | Synopsys is the world’s leading provider of solutions for designing and verifying advanced chips, and for accelerating design of the next-generation processes and models required to manufacture those chips. Synopsys is collaborating with government, industry and academia experts in the field of Superconducting Electronics (SCE) to develop a comprehensive set of physics-based Technology Computer Aided Design (TCAD) tools for accurate modeling, and Electronic Design Automation (EDA) tools that enable the automation of digital SCE designs, improving integration scale, efficiency, and manufacturability. Learn more at our booth and at www.synopsys.com. | | T [ Back to top ] | | 114 | Tektronix CSO | Tektronix Component Solutions has been a leader in wafer and package testing for over 50 years. Rooted in the heart of the Silicon Forest, we bring innovation to high-complexity, critical applications, excelling in small to medium production volumes. | | 417 | Tenet3 | Tenet3® builds custom knowledge models that enable our clients to manage change and make better decisions. We guide your organization through solving its most complex tasks and challenges. Our team of dedicated experts helps you enumerate, organize, and visualize your data to reveal its true potential: the traceable connections among data sets that can help you overcome tough strategic challenges. Never locked in and easy enough for anyone to use with minimal training, our solutions make your jobs easier, faster, and more informed. | | 105 | Triad Micro Devices | Triad Micro Devices (TMD), a division of Triad Semiconductor, is dedicated to creating and providing analog and mixed-signal integrated circuits exclusively for the aerospace and defense industry. The company’s products are developed utilizing industry-standard EDA tools by experts in full-custom IC design, combined with proprietary ViArray technology for accelerating time to market, while reducing qualification time and providing a lower total cost of acquisition. TMD’s ViArrays have been qualified to MIL-PRF-38535 and will be listed on the QML as class V, Q, Q+, and N. To explore the possibility of making your ideas reality, visit us at www.triadmicrodevices.com. | | 222 | Trusted Semiconductor Solutions Inc. | Trusted Semiconductor Solutions is a high reliability semiconductor design and product development company with expertise in radiation hardened microelectronics. Our fabless business model enables solutions utilizing state-of-the-practice (SOTP) and state-of-the-art (SOTA) technology through our foundry partnerships. We specialize in IC design, semiconductor IP development, chiplet products, and high-density package solutions. Trusted Semiconductor Solutions is a Category 1A Trusted accredited small business and a non-traditional defense contractor. We are known for our exceptional flexibility and for being a single point of contact with our customers for product development needs offering services from design to delivery with unparalleled program management, consulting, and customer service. | | 108 | Trusted Strategic Solutions | Trusted Strategic Solutions provides strategic recommendations to government and tech industry leaders. We recognize the increased global and national need for rare earth elements, microelectronics, semiconductors, and the vulnerabilities created by the increased needs. Trusted Strategic Solutions develops strategies alongside the U.S. government and industry to overcome these challenges. | | 610 | Trymax Semiconductor Equipment BV | Trymax Semiconductor Equipment is an innovative plasma-based company designing, manufacturing and marketing state of the art equipment solutions for ashing, descum, surface preparation, light etching as well as UV photoresist curing and charge erase. With a product portfolio ranging from 100mm wafer size to 300mm and an installed base of >300 systems, Trymax has significant market shares at foundries, IDMs, and Wafer Level packaging houses for end applications in Power Semiconductors, RF, Analog, Automotive, MEMS, LED, and CMOS. Recognized for its reliability, low cost of ownership, and performances, Trymax continuously innovates to support its customer’s needs. Trymax is headquartered in the Netherlands and operates local offices in Italy, USA and China. | | Y [ Back to top ] | | 520 | YES Tech | YES Tech manufactures precision cleaning, coating, curing, monolayer surface modification and wet process equipment for innovative leaders in the life sciences, emerging defense technologies, and advanced semiconductor packaging. Start your journey to breakthrough technologies with shorter process times, higher yields, improved reliability, and lower total cost of ownership. |
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