| Booth number/ref |
Company |
Company Description |
| 3 [ Back to top ] | | 204 | 3D Glass Solutions, Inc. | 3D Glass Solutions is a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics. The Company manufactures a wide variety of glass-based, system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® glass ceramic technology for applications in RF electronics and photonics used in automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT industries. | | A [ Back to top ] | | 418 | AAA Test Lab | AAA Test Lab (www.aaactl.com) is a leading provider of comprehensive semiconductor and electronic component testing services. With state-of-the-art facilities and a team of highly skilled engineers, the company specializes in delivering reliable testing solutions that adhere to the industry's most rigorous standards, including MIL-STD-202, MIL-STD-883, and MIL-STD-750.
AAA Test Lab's capabilities encompass environmental, mechanical, and electrical testing, serving industries such as aerospace, defense, automotive, telecommunications, and medical devices. Their commitment to precision and quality ensures that every component meets critical performance and durability requirements. | | 322 | AARD Technology LLC | AARD Technology is the North American representative for scia Systems GmbH, a German supplier specialized in plasma and ion beam process equipment. We offer systems for coating, etching, and trimming for the MEMS, microelectronics, and optics industries for high volume manufacturers and R&D. Expert technical support ensures high volume manufacturers enjoy maximum uptime. | | 601 | ACCURATE CIRCUIT ENGINEERING | Accurate Circuit Engineering (ACE) is an AS9100, ITAR and Mil-Spec Certified manufacturer of high-technology Quick turn PCBs. Experts in RF, Microwave, Antenna and Hybrid constructions. With deliveries in as little as 24 hours, no one is faster. ACE is a small business and JPL flight approved and Awarded. ACE has continued to stay on the leading edge of technology offering only the best quality PCBs in the shortest amount of time. We also offer design and assembly making ACE a full turnkey solution. ACE where Quality, Speed and Technolgy come together! | | 514 | AdTech Ceramics | AdTech Ceramics is a fully integrated US manufacturer of alumina and aluminum nitride multilayer co-fired product. Products include metal to ceramic assemblies, QFN, PGA, and BGA packages. AdTech Ceramics specializes in mission-critical ceramics for challenging environments. Our 150,000 sq ft facility has the capacity to support prototyping to high volume requirements. We engineer the finest quality ceramics, making them #STRONGDURABLEPRECISE. * ITAR registered * CUI trained * AS9100D * NADCAP Certified | | 216 | Advent Diamond, Inc. | Advent Diamond is developing semiconductor technology beyond today's limits. We are commercializing diamond semiconductor materials and components to support innovation in telecommunication, electrification, and advanced sensing. | | 408 | AEM | AEM is a manufacturer of circuit protection, semiconductors and HF to mmWave Components for commercial to aerospace and defense applications. | | 406 | AMD | AMD has 30+ years of continuous focus and heritage in A&D applications, with a history of government and industry partnership and collaboration, which has led to unique advancements in the capability, reliability, and security of XQ devices. | | 123 | AmTECH Microelectronics | AmTECH Microelectronics is a contract manufacturing company, located in Silicon Valley, that specializes in complex microelectronics, advanced packaging, and SMT assembly. AmTECH's services include; Die Bonding, Flip Chip (C4), Thermocompression Bonding, Eutectic Die Bonding, Wire Bonding, Heavy Wire Bonding, Ribbon Bonding, Silver Sintering, Encapsulation, etc. The headquarters features a state-of-the-art clean room with equipment being added on a regular basis to help support leading-edge product design and manufacturing. AmTECH has been in business for over 30 years and has a strong team of engineers and management. The company is a proud service provider of prototype to medium volume on-shore manufacturing. | | 101 | Analog Devices | Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. | | 317 | Ansys | For more than 50 years, Ansys engineering simulation software has enabled innovators across industries to push boundaries using the predictive power of simulation. The next great leaps in human advancement will be powered by Ansys. | | 223 | Astronics Test Systems | Astronics Test Systems ensures optimal performance of mission critical systems through innovative test solutions. Leveraging 60 years’ experience, we offer automatic test expertise to electronics manufacturers in aerospace, military, mass transit, urgent communications, and space industries. Our test solutions ensure the world’s most advanced electronics perform as designed, every time. | | 218 | ASU | Arizona State University: Southwest Advanced Prototyping Hub | | 318 | Avalanche Technology | Avalanche Technology is the space technology leader enabling the Orbital Internet. With a proven STT-MRAM portfolio at multiple geometry nodes combined with an intellectual property portfolio of over 300 patents and applications, Avalanche is the only provider of scalable unified memory architecture for industrial, IoT, aerospace and storage applications that are Space-tested and proven. Avalanche’s Perpendicular STT-MRAM technology is the frontrunner to replace traditional Flash and SRAM for unified memory architectures in future SOC systems, delivering high performance and low power with a path to continued scalability. Learn more at avalanche-technology.com. | | B [ Back to top ] | | 309 | BAE Systems | At BAE Systems, our dedication shows in everything we do to provide our customers world-class capabilities across air, land, maritime, space and cyber domains. We’re pioneering inventions to defend our national security, protect our men and women in uniform, and sustain the prosperity of our communities and our planet. | | 608 | Battelle | | | C [ Back to top ] | | 200 | Cadence | | | 310 | CAST | CAST develops, sells, and supports digital silicon IP Cores for ASICs or FPGAs. Electronic system designers use IP from CAST to shorten development time and lower production risk in the automotive, industrial, defense, aerospace, consumer, security, and other markets. Founded in 1993 and with a worldwide footprint, CAST has helped thousands of companies gain a competitive edge and successfully ship billions of product units. | | 115 | Checkpoint Technologies | Checkpoint Technologies designs and manufactures Laser Scanning Microscopes and Photon Emission Microscopes for semiconductor device physics analytics/failure analysis. Checkpoint Technologies InfraScan™ LSM/PEM Microscope product line includes laser probing, Dual-Beam LTM-S probing, visible laser probing, waveform acquisition, frequency mapping, photon emission, lock-in TIVA / OBIRCH, SIL technologies, Dual SIL Systems, FemtoSecond Pulsed Laser stimulus, 2-photon LADA, TR-LADA, and pulsed laser probing – to reflect our fundamental commitment to adapting technology to meet customer specific needs within the field of semiconductor failure analysis and fault isolation. | | 517 | Chip Scan, Inc. | Chip Scan, based in New York City, is a provider of microelectronics assurance. Our specialty areas include cyber threat defense, microelectronics reverse engineering, space systems, and defending operational technologies. Chip Scan is accredited by the DMEA as a Category 1A Microelectronics Trusted Source. Chip Scan is also an awardee in the Anti-Tamper Executive Agent program for protection of critical program information. Our capabilities have been used to assure commercial and government systems, and our products are implemented and/or operational in commercial and military systems. Chip Scan also has strong core competencies in machine learning/AI driven reverse engineering, the recovery of critical design information for DMSMS and the hardening of systems for Anti-Tamper. | | 721 | Codasip s.r.o. | Codasip is a processor technology company enabling system-on-chip developers to differentiate their products for competitive advantage. Customers leverage the transformational potential of the open RISC-V ISA in a unique way through Codasip’s Custom Compute offering: Codasip Studio design automation tools and a fully open architecture licensing model combine with a range of processor IP that can be easily customized. The company is proudly European and serves a global market, where billions of devices are already enabled by Codasip technology. | | 411 | CoolCAD Electronics | CoolCAD Electronics designs and fabricates wide bandgap silicon carbide (SiC) semiconductor transistors and integrated circuits (ICs) for applications in Power Electronics, Green Energy, High-Temperature Electronics and Deep Ultraviolet (UV) Optical Electronics. CoolCAD SiC semiconductor devices operate at temperatures up to and beyond 400°C, that’s significantly above the 200°C capabilities of ordinary silicon-based chips. Our team of scientists and engineers have developed proprietary SiC formulations and manufacturing processes for achieving superior performance with high temperature tolerance. | | 511 | Cycuity | Accelerate Semiconductor Security with Cycuity
From Microprocessors to SoCs and FPGAs
Cycuity’s security solutions verify and validate semiconductor device security prior to manufacturing. Our software and services help accelerate the detection of security weaknesses to ensure mitigation pre-silicon.
Our deep security expertise, unique Radix technology, and systematic and robust approach to hardware security verification help organizations identify and address security weaknesses across the design supply chain — from third-party IP (3PIP) to full chips and systems including firmware. | | D [ Back to top ] | | 518 | DMEA TAPO | | | 219 | Draper Labs | Draper is a not-for-profit engineering organization started in 1973, specializing in national security, biotechnology and strategic systems. Draper has more than 2000 employees headquartered in Cambridge, MA with campuses across the country. | | E [ Back to top ] | | 122 | Edaptive Computing, Inc. (ECI) | Edaptive Computing, Inc. (ECI) provides innovative solutions to optimize, automate and integrate complex processes and systems. At GOMACTech, ECI is demonstrating PCBAT solution that provides the capability to automatically generate a BOM from a PCB image. | | 206 | Evatec NA | Evatec - the "Thin film Powerhouse". As a global leader in thin film technology, we design and manufacture production systems for industry, and our customized engineering solutions provide the equipment needed at the worlds' leading R&D and manufacturing facilities around the globe. Using our 70 years of process know-how we support our customers with thin film processes, leveraging advanced process control technologies for the best cost of ownership. | | 400 | Extreme Waves | Extreme Waves was founded and is based in San Diego, CA. We develop high-performance custom phased-arrays and transceivers for SATCOM, 5G, and point-to-point communication links at 8-110 GHz, including X, Ku and Ka-band SATCOM, Ku-band CDL, and all of the 5G frequencies up to 110 GHz. Our product portfolio also includes low and medium power X, Ku and Ka-band radars (pulsed and FMCW) with multiple phase centers. SiGe and CMOS chip design services and chip design reviews are also available for partners. Our customer list includes medium and large commercial and defense companies in the US, and several federal laboratories. Extreme Waves’ team together has more than 100 years of aggregate experience in phased-arrays and transceivers, with many PhD-level RF engineers on staff. One of our founders is Prof. Gabriel M. Rebeiz, Member of the National Academy, elected for his work on affordable phased-arrays. Prof. Rebeiz is the inventor of the 2x2 quad silicon beamformer architecture (together with Dr. Julio Navarro, Boeing), which is now widely used in SATCOM, RADAR and 5G systems. Previously, he has consulted with the leading defense and commercial companies in the US, Europe, Japan and Korea on phased-arrays and RF systems, and many of the SATCOM, RADAR and 5G systems and chips built today are based on his work, either at UCSD or as a consultant. Extreme Waves runs as a lean company with great engineers building great products. We are passionate about RF and systems, and we are very good at what we do. | | F [ Back to top ] | | 702 | Falcon Electronics, Inc | Electronics Distribution
Specializing In the Aerospace and Defense Market | | 501 | FINETECH | Finetech manufactures and supplies sub-micron accuracy die bonders for die attach, advanced packaging, and micro assembly applications. Manual, semi-automatic motorized, and automated models provide a prototype to production pathway. High process flexibility within one platform allows a wide range of bonding technologies: thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium, and precision vacuum die bonding. Application areas covered include optical packages, sensors, si photonics, micro LEDs, Cu pillar, flip chip, chip-on-glass, chip-on-flex, package on package, MCM, MEMs and more. Finetech also offers precision dispensers and advanced rework systems for today's challenging applications. The extensive process knowledge of Finetech’s engineering team significantly enhances the value of our solution offering. In an industry where "one size" does not fit all, Finetech engineers collaborate closely with customers to devise customized solutions for their specific applications. Ask us about our newly integrated PLASMA CLEANING solution, ideal for sensor and hybrid bonding. | | 323 | Frontgrade | For more than 6 decades, the skilled thinkers, makers, and doers at Frontgrade have embraced our mission to solve complex technology challenges across the U.S. and around the globe.
As the largest provider of analog and radiation-hardened electronics for the aerospace, defense, and medical industries, we offer a broad portfolio of off-the-shelf and customizable radiofrequency, microwave, and high-reliability microelectronic products and subsystems — as well as complete solutions across the signal chain, from aperture to digital conversion.
From inception and development engineering to full-rate production and sustainment, we stay in lockstep with you throughout your program lifecycle.
At Frontgrade, we don’t succeed unless your mission succeeds. | | G [ Back to top ] | | 102 | GlobalFoundries | GlobalFoundries annual Trusted Foundry Training attracts leaders and technologists from across the national security, aerospace and defense industry. The invite-only event showcases the critical role of Trusted chip manufacturing for sensitive national defense applications, and highlight how essential chips securely manufactured by GF are enabling innovation and provide an efficient path to new technology development across a range of markets.
Through technical sessions, panel discussion and other presentations, attendees will hear straight from the source how GF Trusted manufacturing, our platforms and solutions, our design enablement and turnkey services, when paired with our industry-leading IP offerings and design tools, are accelerating design cycles and enabling our customers to speed up their time to market for new technologies.
GF’s U.S. facilities are accredited by the U.S. government as Trusted Supplier Category 1A, which implements proven stringent security measures to protect sensitive information and manufacture chips with the highest levels of integrity to ensure they are uncompromised. | | 403 | Golden Altos Corp. | Golden Altos is a QML provider of assembly services located in silicon valley (Fremont, CA). Golden Altos offers complete on-shore, in-house, high-reliability hermetic assembly for both monolithic and hybrid assemblies as well as qualification services for both hermetic and plastic IC’s. We continually strive to deliver the finest products, services and documentation through our own internal system, as well as regular certifications from government agencies. As a small business that has served the commercial, military, and aerospace industries for over 30 years, Golden Altos understands the importance of putting our customers first because what we do matters. | | 304 | Graf Research Corp. | Graf Research® Corporation produces the Enverite® EDA suite, FPGA assurance tools for security and functional safety. The Enverite® EDA suite contains features that provide verification and auditing of FPGA build flows. Enverite® PV-Bit® verification evaluates the equivalence of an FPGA Bitstream and its physical netlist. Enverite® Trace® archiver creates and verifies a tamper-evident auditable digital thread as a design traverses the build flow. Enverite® Retrace® auditor authenticates and verifies integrity of a Trace® digital thread and enables automated reproduction of the traced build. The Graf Research mission is to perform research, provide services, apply analytics, and create products that enable secure and high-performance embedded and adaptive computing solutions. | | H [ Back to top ] | | 714 | Honeywell Aerospace Technologies | | | I [ Back to top ] | | 614 | IBM | | | 415 | Idaho Scientific | Idaho Scientific is a specialized embedded security firm with a proven track record of solving the hardest cybersecurity, supply chain integrity and anti-tamper problems with novel and scalable solutions. We have completed projects for national labs, federal research centers, the Pentagon and dozens of companies. The company licenses its crypto, Root of Trust, Extension of Trust and secure processing technology to ensure systems are built upon a trusted and secure foundation. | | 616 | IEEE Computer Society | IEEE CS is the trusted organization dedicated to engaging the engineers, scientists, academia, and industry professionals from across the globe driving continued advancements in computer science and technology. | | 214 | Instec, Inc. | Instec is a scientific instrument manufacturer focused on precision thermal and environmental control. Our products are compatible with virtually any optical measurement system and can be equipped with electrical testing features including electrical probers, all inside a controlled sample environment. Capabilities include DC probing from -190°C to 1000ׄ°C, environmental control, Hall effect compatibility, fully custom tools, and unique RF probing features for 600°C+. Necessary for many applications including spectroscopy, electrochemical analysis, nanotechnology research, and more. | | 422 | Integra Technologies, Inc. | Integra Technologies is a global leader in the sourcing, packaging, testing and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability (“Hi-Rel”) applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle - from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high-reliability applications. Find out more at: https://www.integra-tech.com | | 215 | Intel Corporation | | | 109 | ISI | ISI specializes in the development of microelectronic modules with a focus on miniaturization and ruggedization of complex assemblies. Our comprehensive design and manufacturing capabilities enable rapid solutions for high-reliability applications, including the integration of smart sensors and the development of systems-in-package. ISI is a one-stop-shop for microelectronic module development with fast-turn prototyping and mid-volume production at our US-based, ITAR-registered manufacturing facility. | | J [ Back to top ] | | 315 | JEOL USA, Inc. | | | 320 | JSTF - Jazz Semiconductor Trusted Foundry | JSTF (a DMEA Trusted Accredited company) is a leading Trusted supplier serving the aerospace and defense industries, offering advanced on-shore semiconductor manufacturing services from .5um to 45nm through Trusted and ITAR access using the Tower Semiconductor technology portfolio in Newport Beach, San Antonio, Rio Rancho (Intel) and Bloomington, Minn (Polar Semi). Critical technologies are offered, such as SiGe BiCMOS (high-speed and high-frequency applications like radar and telecommunications), Radiation-Hardened Designs, SiPho, RF CMOS (Supporting ROICs, mmWave, advanced sensors, communication devices, imaging systems) and MEMS. ITAR access in Japan for 45nm and 65nm technologies is also available
The Irvine, California, facility is the hub of JSTF’s operations, ensuring domestic production and compliance with U.S. security standards.
JSTF HQS Address: 18021 Cowan, Suite J, Irvine, CA 92614 949-291-2649 | | K [ Back to top ] | | 519 | Kansas City National Security Campus | The Kansas City National Security Campus is one of eight sites that comprise the NNSA. Along with safeguarding the country’s nuclear weapons, the KCNSC team is charged with leading other missions for the Department of Energy to include Nuclear Weapons Program, Global Security, and Supply Chain Management. The Global Security, a division of the Kansas City National Security Campus, is an engineering and manufacturing asset, safeguarding the nation with products and services that support response to global threats. Global security has 400+ personnel in Kansas City & Albuquerque supporting national security across multiple critical areas. With over 75 years of experience, the mission of KCNSC remains to deliver innovative national security solutions for generations to come. | | 300 | Keysight | At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com. | | 710 | Knowles Precision Devices | Knowles Precision Devices has more than 40 years of experience developing RF and microwave components that meet the rigorous requirements for a variety of military, aerospace, telecommunications and industrial markets. Whether you need a catalogue part, build to print services or custom components, Knowles performs special life testing, sectioning, and additional electrical measurements to meet the MIL standards aerospace and defence require.
Our filters offer stable performance over a wide frequency range, from DC to 67+ GHz, and are rigorously tested to ensure the highest standards. Plus, our SMD components enable streamlined assembly for easy addition to your manufacturing process.
Our products are worldwide in use in the most advanced military and aerospace instrumentation and communication systems. A wide range of subsea, air and space navigation, communication and detection systems rely on the superior technology and performance of our filters. | | L [ Back to top ] | | 516 | Laser Thermal Analysis | At Laser Thermal, we’re committed to simplifying and enhancing the way thermal measurements are made. Leveraging cutting-edge technology, our instruments deliver fast, precise assessments of material thermal properties, enabling our customers to gain deeper product and material insights. Based in Charlottesville, Virginia, Laser Thermal is at the forefront of optical thermal measurements, spanning from nanometers to bulk materials. We’re excited to introduce our latest innovation, the "TOPS" thermal conductivity tool. This groundbreaking instrument measures thermal conductivity across solids, liquids, pastes, and gels, all in one instrument, with ease and speed, providing direct, reliable results in under one minute. TOPS is versatile, ideal for applications in microelectronics packaging, bulk materials, ceramics, thermal interface materials (TIMs), batteries, and advanced materials like thermal barrier coatings (TBCs). Laser Thermal is dedicated to meeting your needs through both contract testing and tool sales, ensuring you have the best solutions for your thermal measurement challenges. | | 615 | LeWiz Communications, Inc | LeWiz is a government contractor specializes in rad-hard chips and IP cores supporting trusted deep nanometer silicon processes and aerospace applications. Provides comprehensive hardware/software solutions to target high performance computing, time-critical networking (wired, wireless, time-triggered, time-sensitive) and strategic FPGA chips with leading, proven eFPGA technology. Portfolio includes RISC-V, NOC/bridges, programmable I/O, high speed I/Os (LVDS, SerDes), accelerators, AXIS/AXI peripherals, HBM controller, data movers. Contribute to open-source community and actively define/drive industry standards – advancing state of the art. | | M [ Back to top ] | | 211 | MACOM | MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. MACOM has achieved certification to the IATF16949 automotive standard, the AS9100D aerospace standard, the ISO9001 international quality standard and the ISO14001 environmental management standard. MACOM operates facilities across the United States, Europe, Asia and is headquartered in Lowell, Massachusetts. | | 423 | Menta eFPGA Inc. | Menta eFPGA Inc. is the market leader in design-adaptive embedded FPGA (eFPGA) IP for military and aerospace semiconductor applications. Our eFPGA technology provides flexible, reprogrammable logic for critical applications like telecom, satellite communications, and cryptography that require secure post-deployment reconfiguration and modernization. Menta's eFPGA IP is built using 100% standard cell technology, making it process node agnostic and the most flexible solution on the market. Available as both soft IP for rapid delivery and hard IP, Menta's eFPGA is silicon-proven across multiple popular and radiation-hardened process nodes. Menta’s eFPGA IP technology has been licensed to Trusted Semiconductor Solutions to accelerate customer CMOS designs. To program the eFPGA logic, Menta offers the Origami Programmer, a highly flexible synthesis, place, and route tool available as a standalone application or API. This provides customers a complete, integrated solution for implementing Menta's field-reprogrammable FPGA technology. | | 307 | Mercury Systems | Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today’s most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. | | 810 | Micrcohip Technology | Empowering your innovation is at the heart of our mission. We are a leading provider of hardware, software and tools for embedded applications, offering a wide range of microcontrollers, FPGAs, silicon carbide, analog solutions and much more. From secure IoT to capacitive touch, from solutions for industrial applications to automotive to aerospace, our comprehensive product portfolio and easy-to-use development tools enable designers to bring their ideas to life | | 205 | Micropac Industries, Inc. | Micropac Industries manufactures microelectronic and optoelectronic
components and modules for the hi-rel industrial, medical, military, aerospace and
space markets. Certified to MIL-PRF-19500, MIL-PRF-38534, and AS9100, Micropac
offers both standard and custom products including optocouplers, LEDs and Displays,
Proximity and Hall Effect sensors, solid state relays and power controllers, and multichip modules. | | 111 | Microsanj | Microsanj manufactures high-sensitivity, high-spatial, fast-transient thermal imaging analysis systems for materials research, chip characterization and validation, and failure analysis. | | 522 | Micross Components | Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and the most comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 45 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. | | 414 | MIT Lincoln Laboratory | The Microelectronics Laboratory is a state-of-the-art semiconductor research and fabrication facility that supports the design, fabrication, and packaging of novel devices. | | 701 | MITRE | We apply systems thinking across government, industry, and academia to solve whole-of-nation challenges. | | 420 | MMEC | The MMEC microelectronics consortium leads the
acceleration of microelectronic technologies and delivers solutions to establish a trusted and resilient domestic
supply chain. The MMEC is the leading collaborative,
pubic-private ecosystem that engages broadly across innovative partners in industry, academia, and government to rapidly advance defense and commercial
applications. This unique environment empowers
members to discover new technologies, share
capabilities, develop a skilled workforce, and launch groundbreaking innovation into scalable commercial
production for the benefit of National Security and
economic dominance. | | 622 | Mosaic Microsystems | Mosaic is a leading domestic provider of glass advanced packaging for microelectronics. Mosaic's glass substrates and interposers address evolving trends, offering increased interconnect density compared to organic interposers and with lower loss than silicon. Moreover, the burgeoning innovations in AI, chiplets, and heterogeneous integration are catalyzing a revolution in advanced semiconductor packaging. Mosaic's glass, characterized by its smooth surface enabling finer feature patterning and smaller vias, empowers designers to optimize performance, minimize power consumption, and enhance design flexibility. | | 504 | MOSIS 2.0 | California DREAMS | USC/ISI | Led by the University of Southern California Information Sciences Institute (USC/ISI), the Defense Ready Electronics and Microdevices Superhub (DREAMS) is one of eight regional innovation hubs established under the Department of Defense Microelectronics Commons Program. This strategic initiative is funded by the CHIPS and Sciences Act of 2022 to develop onshore microelectronics hardware prototyping.
DREAMS unites academic and commercial organizations across Southern California and our partners across the United States with three goals: maturation of advanced RF technologies for rapid prototyping, lab-to-fab transition of semiconductor technologies and training the next-generation of engineers in advanced RF and microelectronics technologies.
The pioneering USC/ISI MOSIS Multi Project Wafer (MPW) fabrication services is at the core of DREAMS. MOSIS is a transformative service that has streamlined the end-to-end prototyping of microchips for educational, commercial and national security applications for over 40 years. MOSIS 2.0 connects customers to an extensive network of state-of-the-art nanofab and foundry services, accelerating the use of advanced process and prototyping technologies within the DREAMS hub, and reducing barriers to innovation. | | 715 | MRSI Mycronic | MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. | | N [ Back to top ] | | 518 | Nano OPS, Inc. | | | 503 | Nimbis Services, Inc. | Nimbis Services is the technology-transition engine for U.S excellence. We support the full trusted and assured technology-transition lifecycle, from research and development to acquisition, maintenance, and sustainment.
The Nimbis Trusted Stratus is a dual-use Modeling, Simulation, and Analysis (MS&A) platform accelerating the transition of microelectronics, manufacturing, and aerospace technologies. Our platform's unique digital-twin capabilities supports radiation effects analysis, thermal analysis, and hardware-software co-verification, and more.
Over the past 16 years, Nimbis has launched and implemented numerous projects and prototypes for the DoD and supported over 300 projects and 150 organizations. We are deeply experienced in the underlying cloud and on-prem high-performance computing, data, and networking infrastructures that support MS&A and digital engineering. | | 316 | Noble Metal Services | High Reliability precious metal reclaim: Gold, Silver, Platinum, Palladium, and Iridium and Source materials
Production scrap, printed circuits, rags, wipes, jars, etch, ceramics, cyanide solutions.
100% destruction of your proprietary materials. | | 700 | Northrop Grumman | Northrop Grumman is a leading global aerospace and defense technology company. Our pioneering solutions equip our customers with the capabilities they need to connect and protect the world, and push the boundaries of human exploration across the universe. Driven by a shared purpose to solve our customers’ toughest problems, our employees define possible every day. | | 405 | NSA Cybersecurity Collaboration Center | The NSA Cybersecurity Collaboration Center is providing DoD small and medium sized companies free cybersecurity solutions to harness their networks. These are designed to help defend against nation-state threats that are targeting DoD entities | | 600 | NSWC Crane | The FPGA Assurance for Navy and Government Systems (FANGS) and Reverse Engineering Embedded Firmware (REEF) Labs of NSWC Crane provide technical expertise and tool solutions for securing DoD programs and systems. FANGS and REEF are part of JFAC for collaborating with other DoD entities while also collaborating closely with industry and academia. The REEF Lab supports firmware assurance throughout the product lifecycle using forensic and vulnerability analysis for firmware as well as firmware feature verification by utilizing binary extraction, disassemblers/decompilers, and debuggers. The FANGS Lab assures the entire FPGA lifecycle with SME support, V&V of performer tools, and R&D solutions. Tools presented at GOMACTech and developed by the FANGS Lab for FPGA Assurance include the Security Mitigation Enforcer (SeME) and Bitstream Analysis Toolkit (BAT). | | O [ Back to top ] | | 107 | Omni Design Technologies | Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores, from 28nm down through advanced FinFET nodes, which enable differentiated system-on-chip (SoC), in applications ranging from 5G, wireline and optical communications, LiDAR, radar, automotive networking, AI, image sensors, and the internet-of-things (IoT). Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few MSPS to more than 100 GSPS sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins-Colorado, Bangalore-India, Hyderabad-India, Dublin-Ireland, Boston-Massachusetts. | | 720 | onsemi | | | P [ Back to top ] | | 314 | PacTech USA, Inc. | PacTech - Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech ASIA Sdn., Bhd., Penang, Malaysia and PacTech USA Inc., Silicon Valley, USA.
The equipment product line consists of solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50).
Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.
The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, FIB, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing and chip singulation. | | 110 | Palomar Technologies | Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assemblies used in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for specialty OSAT/process development, and Customer Support services. Palomar delivers improved production quality and yield, reduced assembly times, and rapid ROI. | | 416 | Penn State Applied Research Laboratory - Electronics Manufacturing Center | The Electronics Manufacturing Center is the Office of Naval Research electronics Center Of Excellence located within the Penn State Applied Research Laboratory. Our core mission is to identify, develop, and execute projects that focus on the transition of electronics manufacturing technologies to naval ships, aircraft, submarines and unmanned systems. | | 321 | Photronics, Inc. | | | 402 | PQShield Ltd | PQShield is a cybersecurity company specializing in post-quantum cryptography. We’re aiming to empower organizations to be crypto agile, with the ultimate quantum-resistant solutions, updating the world’s technology supply chain, and staying one step ahead of the attackers. | | 711 | Precision Circuit Technologies | At Precision Circuit Technology (PCT) we’re heralding a new era of miniaturization and ultra high-density integration (UHDI), ushering in next-generation electronic devices that are significantly smaller, faster, and more functional than ever before. Built on liquid crystal polymer (LCP) substrate, known for its extremely low signal loss tangent (Df) and dielectric constant (Dk), and utilizing our proprietary particle-free liquid metal inks and patented additive fabrication techniques, we create ultra high-density interconnect (UHDI) circuits with unmatched precision, achieving intricate circuit geometries with lines and spaces as small as 6-microns, all while improving signal integrity.
Our technology is cost effective, friendlier to the environment and can reduce circuit dimensions by up to 10X compared to traditional circuit fabrication processes. | | Q [ Back to top ] | | 203 | Qorvo | Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet. | | 201 | QP Technologies | QP Technologies (formerly Quik-Pak) is a leading provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services and our service offerings enable our customers to target a range of end markets, including commercial, RF, power, industrial, automotive, medical and mil-aero. We leverage proven technologies developed by our skilled experts, and we work closely with you to get your products to market quickly and in high volume. Our in-depth and unique industry knowledge, combined with the personal relationship we create with you, means you can count on us to be your trusted adviser and partner. | | 306 | QuickLogic Corp. | QuickLogic, a trusted supplier in the Aerospace and Defense markets for nearly three decades, specializes in design of programmable logic devices, embedded FPGA (eFPGA) and FPGA-based products, including Strategic Radiation Hardened (SRH) FPGAs. Our low-power, production-proven eFPGA enables in-field fast reconfiguration of ASICs and SoCs, facilitating over-the-air updates for evolving needs. Our 100% open-source tools offer Mil/Aero/Defense contractors complete toolchain visibility and long-term control, which secures critical intellectual property and ensures future support. QuickLogic's dedication to innovation within the defense and aerospace community reinforces its role as a leader in trusted, secure, SRH, and fast reconfigurable computing technology for defense applications. quicklogic.com | | R [ Back to top ] | | 208 | Radiation Test Solutions | Radiation consulting and testing of electronics and materials for the Space and Defense industries. | | 112 | Raith America, Inc. | RAITH is the global market and technology leader in maskless nanofabrication and characterization systems. Our comprehensive portfolio includes electron beam lithography, FIB-SEM systems, laser lithography, and advanced imaging solutions. With over 1,200 systems installed worldwide and serving 10,000+ users, we enable breakthrough innovations in quantum technologies, photonics, semiconductors, and life sciences. Our solutions bridge the gap between R&D and production, supporting applications in connectivity, mobility, green energy, and healthcare. Headquartered in Germany with global operations including US-based applications center, RAITH combines cutting-edge technology with four decades of expertise to deliver precision nanofabrication tools for both research institutions and industry. | | 409 | Rambus | Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com. | | 723 | Raytheon | | | 207 | Real Intent | Real Intent is a leading provider of EDA software to accelerate early functional verification and advanced sign-off of digital designs. Our static sign-off product capabilities include multi-mode clock domain crossing; multi-scenario reset domain crossing; multi-test mode DFT; multi-policy RTL linting, connectivity & glitch, hardware security, and formal linting. Real Intent products lead the market in performance, capacity, accuracy, and completeness. | | 407 | Red Balloon Security | Red Balloon Security is a leading security provider and research firm committed to defending embedded devices across a range of critical industries and shaping the future of the embedded security industry. Our expert team has pioneered foundational technologies, such as Symbiote and OFRAK, that help secure millions of embedded devices currently in service. Today, we continue to research, develop, and commercialize new capabilities to protect embedded systems manufactured globally. Additionally, our R&D team consists of world-class researchers and developers who publish seminal research papers in the fields of embedded security and intrusion detection. Red Balloon has led research activities funded by the U.S. Government including DARPA, Department of Homeland Security, Air Force, and Navy. | | 209 | Remtec Inc. | Located in Canton, MA and founded in 1990 – Remtec specializes in the development of advanced and high-performance ceramic packaging, substrates, circuit boards, and components utilized across the electronics industry – and particularly well-suited for challenging high-power, high-circuit-density, and mission-critical applications. ITAR compliant, ISO-certified, and based in a newly renovated state-of-the-art facility that readily facilitates customers’ current onshoring initiatives, Remtec is especially proud of our years-long relationships with leaders in the military/aerospace, semiconductor equipment, medical electronics, industrial electronics, and commercial telecom sectors. Finally, our current technology toolkit includes direct bond copper, active metal braze, precision thick-film, multilayer packaging and interconnects, and a vast range of materials. | | S [ Back to top ] | | 611 | S-Cubed | Comprised of a team of accomplished engineers and entrepreneurs, S-Cubed has a long history of designing and manufacturing innovative equipment for semiconductor lithography and allied industries. Our tools are deployed in fabs and labs throughout the world and are fully supported by our global service capability. The key advantage that S-Cubed holds over other wafer processing equipment manufacturers is that our modular architecture approach allows us to build exactly the machine you need for your throughput and wafer processing requirements. | | 604 | S2MARTS | Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS), managed by NSTXL, is the premier rapid OT contracting vehicle for the DoD in trusted microelectronics, strategic and spectrum missions, and other critical mission areas. Naval Surface Warfare Center (NSWC), Crane Division created S²MARTS to grow and engage an elite network of innovators, shorten the path to defense prototype development, and advance national security efforts. S²MARTS is the contracting vehicle for Microelectronics Commons, a passed by the CHIPS and Science Act to strengthen American manufacturing. | | 305 | Secure Micro Technologies, LLC | Secure Micro Technologies, LLC offers embedded cybersecurity solutions for critical infrastructure like satellite systems, command and control systems, nuclear reactors, industrial control systems, and communication systems. The company conducts research and develops advanced technologies to enable secure microelectronics/electronics systems, including design, development, and deployment of secure processors, ASIC accelerators, radiation-hardened and high-performance FPGA-based designs, firmware, and secure software solutions. Secure Micro Technologies assists clients with agile digital design development, feasibility studies, FPGA and ASIC prototyping, cybersecurity posture assessments, compliance with ISO cybersecurity standards, and crypto-agility. | | 404 | SecureFoundry | ur company specializes in the development, sales, and commercialization of advanced microelectronics through cutting-edge technologies, including Multi Electron Beam Direct Write Lithography (MEB-DWL) systems. With a strong focus on innovation and precision, we provide industry-leading solutions for the semiconductor and microelectronics sectors.
The MEB-DWL technology is a next-generation patterning tool that enables highly accurate and efficient direct-write lithography for producing intricate microstructures at nanoscale dimensions. By utilizing multiple electron beams in parallel, our systems dramatically enhance throughput and resolution, making them ideal for applications in advanced semiconductor manufacturing, photonic devices, MEMS (Microelectromechanical Systems), and more. | | 419 | Shibuya Corporation | Shibuya Corporation is a leading provider of advanced semiconductor manufacturing solutions, committed to driving innovation across the industry. Our portfolio features cutting-edge equipment, including solder ball mounters, flip chip bonders, and automated systems designed to meet the needs of next-generation packaging technologies. With decades of engineering expertise, we support a wide range of applications, from photonics to integrated circuit packaging, ensuring precision, speed, and reliability. | | 505 | Siemens EDA | Siemens is driving transformation to enable a digital enterprise for electronic systems, including 2.5D/3D heterogeneous Integration, packaging and multi-domain system design and verification. Xcelerator, the integrated portfolio of software and services from Siemens, helps companies of all sizes create and leverage a comprehensive digital twin that provides organizations with new insights and opportunities to drive innovation. See the latest from Questa formal and verification, hardware-assisted verification with Veloce, system level packaging with XSI/XPD, high-level design and synthesis with Catapult, physical design implementation with Aprisa, circuit simulation and verification with AFS/Solido, DFT for chip & 2.5/3DIC modules with Tessent, functional monitoring with Embedded Analytics and signoff with the Calibre product solutions. | | 121 | SiFive | As the pioneers who introduced RISC-V to the world, SiFive is transforming the future of compute by bringing the limitless potential of RISC-V to the highest performance and most data-intensive applications in the world. SiFive’s unrivaled compute platforms have enabled leading technology companies around the world to innovate, optimize and deliver the most advanced solutions of tomorrow across every market segment of chip design, including artificial intelligence, machine learning, automotive, data center, mobile, and consumer. With SiFive, the future of RISC-V has no limits. | | 210 | Silicon Assurance | Silicon Assurance is a hardware security startup committed to pioneering EDA software technologies that excel in detecting, assessing, and mitigating security vulnerabilities in silicon chips designed by semiconductor and system companies. The distinctive feature of these technologies lies in their capacity to recognize threats before the critical chip fabrication stage. The company is a spinoff from the University of Florida and has been operational since 2021. The company has secured multiple funding rounds from America's Seed Funds, Florida High Tech Corridor, and forged partnerships with renowned entities. | | 120 | Silitronics | Silitronics offers IC package design, substrate fabrication, process development and assembly services. We are the only company to provide fully automated active alignment for Silicon Photonics, FAU design + fabrication and co-package optical assembly for AI/ML, Cloud, LiDAR and Silicon Photonics customers. Silitronics has fully automated equipment in a clean room 10K and 1K with ISO9001, ISO13485, ITAR and Mil-Std883 quality controls. Silitronics team has expertise to innovate, develop, and implement cost effective design and assembly solutions from concepts to finished products.
Our key differentiated services are complicated process development and full turn-key services. Many of the NPI are so advanced that there is no precedence and does not fit in a standard assembly. Often the design rules have to be pushed beyond its limit. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well planned Design of Experiments (DOE) and investments in new equipment. Silitronics customer are top tier hyper scalers and leading start-ups in Chiplets Heterogeneous Integration, Silicon Photonics, COB, MEMS sensors, LiDAR, AR/VR, and Defense applications. Silitronics team has 100+ man years of R&D experience.
For any questions: call at 408-605-1148 or email to:sales@silitronics.com. | | 401 | SkyWater Technology | SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, volume production and heterogeneous integration solutions in its U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology within diverse categories including mixed-signal CMOS, read-out ICs, rad-hard ICs, MEMS, superconducting ICs, photonics and advanced packaging. SkyWater serves the growing markets of aerospace & defense, automotive, biomedical, industrial and quantum computing. For more information, visit: www.skywatertechnology.com. | | 500 | Spectral Design and Test, Inc. | Spectral Design and Test Inc. is a worldwide leader in specialized embedded memory, based in Somerville, New Jersey. Our products support the Commercial markets, AI/IoT/5G, and the Mil/Aero/DoD markets. Spectral offers intellectual property (IP) in the form of specialized embedded memories as part of their MemoryIP™ offering. With a broad portfolio of embedded memory technology for AI optimized SRAMs, Low Power IoT memories, radiation hardened by design memories (RHBD), and other specialized memory architectures such as TCAMs, Spectral is a one stop shop for embedded memory IP. The company’s Memory Development EDA tools address the needs of Mil/Aero Companies to build their own RHBD Memory Compilers. Using MemoryCanvas™, the flagship memory development product, Memory Compilers can be developed with the ease of use and productivity level unmatched in the industry. The MemoryTime™ product enables designers to model, analyze and characterize embedded memories and generate the most advanced EDA views. Additional information on the company can be accessed at http://www.spectral-dt.com. | | 515 | SRI International | SRI International in Princeton, NJ (formerly Sarnoff Corporation), is the prime contractor for the DLA’s Generalized Emulation of Microcircuits (GEM) and Advanced Microcircuit Emulation (AME) Programs. The Emulation Programs provide a continuing source of Form, Fit, Function, and Interface replacements for non-procurable microcircuits. | | 623 | StratEdge Corporation | StratEdge Corporation, founded in 1992, designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards.
StratEdge assembly services have a Class 1000 cleanroom with Class 100 work areas for performing sensitive operations. It is fully equipped with the most modern assembly equipment, enabling high-speed, deep access, fine wire wedge and ribbon bonding. The component placement die attach system is the fastest and most reliable multiple die-type bonder on the market. It enables StratEdge to offer highly accurate, repeatable placement and includes a station for automated eutectic die attach utilizing proprietary processes that yield ultra-thin, low void solder joints. StratEdge has a variety of lids and options for their attachment and offers post assembly services.
StratEdge is an ISO 9001:2015 certified and ITAR registered facility located in Santee, California, near San Diego. | | 301 | Synopsys | Synopsys is the world’s leading provider of solutions for designing and verifying advanced chips, and for accelerating design of the next-generation processes and models required to manufacture those chips. Synopsys is collaborating with government, industry and academia experts in the field of Superconducting Electronics (SCE) to develop a comprehensive set of physics-based Technology Computer Aided Design (TCAD) tools for accurate modeling, and Electronic Design Automation (EDA) tools that enable the automation of digital SCE designs, improving integration scale, efficiency, and manufacturability. Learn more at our booth and at www.synopsys.com. | | T [ Back to top ] | | 114 | Tektronix CSO | Tektronix Component Solutions has been a leader in wafer and package testing for over 50 years. Rooted in the heart of the Silicon Forest, we bring innovation to high-complexity, critical applications, excelling in small to medium production volumes. | | 417 | Tenet3 | Tenet3® builds custom knowledge models that enable our clients to manage change and make better decisions. We guide your organization through solving its most complex tasks and challenges. Our team of dedicated experts helps you enumerate, organize, and visualize your data to reveal its true potential: the traceable connections among data sets that can help you overcome tough strategic challenges. Never locked in and easy enough for anyone to use with minimal training, our solutions make your jobs easier, faster, and more informed. | | 105 | Triad Micro Devices | Triad Micro Devices (TMD), a division of Triad Semiconductor, is dedicated to creating and providing analog and mixed-signal integrated circuits exclusively for the aerospace and defense industry. The company’s products are developed utilizing industry-standard EDA tools by experts in full-custom IC design, combined with proprietary ViArray technology for accelerating time to market, while reducing qualification time and providing a lower total cost of acquisition. TMD’s ViArrays have been qualified to MIL-PRF-38535 and will be listed on the QML as class V, Q, Q+, and N. To explore the possibility of making your ideas reality, visit us at www.triadmicrodevices.com. | | 222 | Trusted Semiconductor Solutions Inc. | Trusted Semiconductor Solutions is a high reliability semiconductor design and product development company with expertise in radiation hardened microelectronics. Our fabless business model enables solutions utilizing state-of-the-practice (SOTP) and state-of-the-art (SOTA) technology through our foundry partnerships. We specialize in IC design, semiconductor IP development, chiplet products, and high-density package solutions. Trusted Semiconductor Solutions is a Category 1A Trusted accredited small business and a non-traditional defense contractor. We are known for our exceptional flexibility and for being a single point of contact with our customers for product development needs offering services from design to delivery with unparalleled program management, consulting, and customer service. | | 108 | Trusted Strategic Solutions | Trusted Strategic Solutions provides strategic recommendations to government and tech industry leaders. We recognize the increased global and national need for rare earth elements, microelectronics, semiconductors, and the vulnerabilities created by the increased needs. Trusted Strategic Solutions develops strategies alongside the U.S. government and industry to overcome these challenges. | | 610 | Trymax Semiconductor Equipment BV | Trymax Semiconductor Equipment is an innovative plasma-based company designing, manufacturing and marketing state of the art equipment solutions for ashing, descum, surface preparation, light etching as well as UV photoresist curing and charge erase. With a product portfolio ranging from 100mm wafer size to 300mm and an installed base of >300 systems, Trymax has significant market shares at foundries, IDMs, and Wafer Level packaging houses for end applications in Power Semiconductors, RF, Analog, Automotive, MEMS, LED, and CMOS. Recognized for its reliability, low cost of ownership, and performances, Trymax continuously innovates to support its customer’s needs. Trymax is headquartered in the Netherlands and operates local offices in Italy, USA and China. | | U [ Back to top ] | | 117 | UF | Florida Semiconductor Institute | The Florida Semiconductor Institute (FSI), serves as the statewide hub for research, development, and workforce initiatives in semiconductor technologies. Our expertise encompasses emerging materials, chip design, process development, microsystems, heterogeneous integration, advanced packaging, and cybersecurity. Dedicated to making Florida a global leader in specialty electronics, FSI drives high-impact R&D programs, expands the talent pipeline, and coordinates the state’s semiconductor ecosystem. We desire to catalyze over 10,000 new high-wage jobs, foster public-private partnerships, and in so doing, expand the semiconductor industry throughout the state of Florida. | | Y [ Back to top ] | | 520 | YES Tech | YES manufactures precision cleaning, coating, curing, monolayer surface modification and both dry and wet process equipment for life sciences, emerging defense technologies, and advanced semiconductor packaging. Start your journey today with our breakthrough technologies that offer shorter process times, higher yields, improved reliability, and lower total cost of ownership | | Z [ Back to top ] | | 119 | Zero ASIC | Zero ASIC is a semiconductor startup based in Cambridge, MA developing chiplet based ASICs for SWAP constrained systems. Zero ASICs’s groundbreaking chip design platform reduces development costs by an order of magnitude, democratizing access to next generation custom AI silicon. |
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