Michael Reedy Scholarships
The Society of Plastics Engineers’ Thermoplastic Materials & Foams Division (SPE TPM&F) is offering two student scholarships for students in plastics/foams area.
Two $500 scholarships are offered for selected undergraduate/graduate students attending the FOAMS®2018 Conference (Sept. 13–14, 2018) in Montreal, Canada. The scholarships, named in memory of our former board director Michael Reedy, are sponsored by Reedy International.
Application deadline extended: August 10, 2018!
Send application to Dr. Kimberly McLoughlin (kimberly.mcloughlin@braskem.com), including:
- One-page statement of your qualifications, educational and career goals in the plastics/foams industry.
- One or preferably two support letters from academic or professional individuals.
- High school and/or college transcript for the past 2 yrs.
- A list of relevant school activities, community activities, and honors.