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The Future of Logic
EUV is Here, Now What?
Applied Materials is pleased to host a panel discussion during which speakers from some of our industry’s leading logic manufacturers and end-users will exchange views on The Future of Logic. Panelists from Facebook, IBM, Intel, Stanford University and TSMC will explore the differing roadmaps for scaling power vs. performance; the prospect that specialty technologies might create diverging needs; the “new look” of logic architecture and packaging design; and the evolution of materials engineering in light of these transformations.
Please join us for a lively and engaging program!
Program Details
Parc 55 San Francisco Hotel
55 Cyril Magnin Street
San Francisco, CA 94102
Cyril Magnin Ballroom, 4th Floor
Tuesday, December 10
5:00 – 6:00 PM Registration & Reception
6:00 – 7:40 PM Panel Discussion
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Register
Complete the online registration form by December 9 to confirm your attendance.
Please bring a copy of your business card to facilitate the check-in process.
